公开(公告)号：US20160158559A1

公开(公告)日：2016-06-09

申请号：US14941311

申请日：2015-11-13

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Dao Min Zhou ,  Neil Talbot ,  Jerry Ok ,  Gailland R. Nolan

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US09318821B2

公开(公告)日：2016-04-19

申请号：US14401887

申请日：2014-01-15

Applicant: NSK LTD.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H05K1/00 ,  H01R12/52 ,  H01R13/405 ,  H01R43/24 ,  H01R12/58 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/24 ,  H01R107/00

CPC classification number: H01R12/523 ,  H01R12/58 ,  H01R13/405 ,  H01R43/24 ,  H01R2107/00 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/042 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10522

Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.

Abstract translation: 提供多极连接器。 可以防止在垂直于多极连接器的连接方向的方向上排列成一行的多个销状端子的特定销状端子的变形，并且还可以防止特定销状端子的位置偏移 和其他针形端子。 多极连接器（101）包括沿垂直于多极连接器的连接方向（箭头Y方向）的方向（箭头X方向）排成一列的多个销状端子110，该连接方向在连接方向上延伸， 保持构件（120），其构造成在垂直于连接方向的方向上延伸，并以预定的间距保持多个销状端子（110）。

公开(公告)号：US20160007444A1

公开(公告)日：2016-01-07

申请号：US14770118

申请日：2014-02-25

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Masahiro WATANABE ,  Hiroshi TAJIMA

IPC: H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/09 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0715 ,  H05K2201/1028 ,  H05K2201/2009

Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.

Abstract translation: 一种用于柔性印刷线路板的加强构件，其在长时间内保持印刷电路板的电磁波屏蔽效果和接地效果。 加强构件与接地布线图案的预定部分相对设置，并且包括与接地布线图案的预定部分相对并与其导电的一个表面。 另一个表面与处于接地电位的外部接地构件导通，一个表面和另一个表面彼此相对。 加强构件包括由导电金属制成的基座和形成在基座的表面上以构成另一表面的至少一部分的表面层，表面层比由金属制成的基底具有更高的导电性和耐腐蚀性， 表面层厚度为0.004〜0.2μm。

公开(公告)号：US09226402B2

公开(公告)日：2015-12-29

申请号：US13843873

申请日：2013-03-15

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/16 ,  H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/00 ,  H05K7/00 ,  H05K5/00 ,  H01L23/28 ,  H05K1/09 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract translation: 提供缓冲结构，其可以用于减少适应电子系统中的应变，其包括与更刚性的装置部件电连通的顺应部件。 缓冲结构设置在适配电子系统上或至少部分嵌入适配电子系统中，使得缓冲结构与柔顺部件和更刚性的器件部件之间的连接区域的至少一部分重叠。 缓冲结构可以具有比适形电子系统的密封剂更高的杨氏模量值。

公开(公告)号：US20150235609A1

公开(公告)日：2015-08-20

申请号：US14664526

申请日：2015-03-20

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09G5/00 ,  G06T1/60 ,  G09G3/32 ,  G06F3/14

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1423 ,  G06F3/1446 ,  G06F3/147 ,  G06T1/60 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/003 ,  G09G5/14 ,  G09G2300/026 ,  G09G2300/04 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K999/99 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/1028 ,  Y02P70/611

Abstract: In one embodiment, a modular multi-panel display system includes a mechanical support structure, and an array of LED display panels arranged in rows and columns and mounted to the mechanical support structure so as to form an integrated display. None of the LED display panels have a receiver card within the panel. A receiver box is mounted to the mechanical support. The receiver box is housed in a housing that is separate from housings of each of the LED display panels. The receiver box includes a receiver card coupled to feed data to be displayed on the integrated display to a plurality of the LED display panels. A control box is outside of the mechanical support and electrically connected to the receiver box through a data connection. A plurality of electrical connections electrically connects the receiver box with a first display panel in each row of display panels.

Abstract translation: 在一个实施例中，模块化多面板显示系统包括机械支撑结构以及排列成行和列并安装到机械支撑结构上以形成集成显示器的LED显示面板阵列。 LED显示屏中没有一个在面板内有接收卡。 接收盒安装在机械支架上。 接收盒被容纳在与每个LED显示面板的壳体分开的壳体中。 接收器盒包括接收器卡，该接收器卡耦合到将要在集成显示器上显示的数据馈送到多个LED显示面板。 控制箱位于机械支架之外，并通过数据连接与接收箱电连接。 多个电连接将接收器盒与每排显示面板中的第一显示面板电连接。

公开(公告)号：US20150216037A1

公开(公告)日：2015-07-30

申请号：US14583358

申请日：2014-12-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YOSHIHIRO TOMITA ,  MITSUHIRO KASAHARA

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/00

CPC classification number: H05K1/0283 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/146 ,  H05K3/18 ,  H05K3/28 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09263 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2203/0191 ,  H05K2203/1469 ,  H05K2203/308 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic device includes: electronic elements; expandable and contractible conductors each disposed between two of the electronic elements adjacent to each other; a seal which covers the electronic elements and the conductors except principal surfaces of the electronic elements and first surfaces of the conductors, the principal surfaces of the electronic elements and the first surfaces of the conductors being present on a same plane on which surfaces of the seal are present; and leading electrode films each of which is attached in a film-like form to three surfaces which are the surface of the seal positioned between one of the electronic elements and one of the conductors, the first surface of the conductor, and part of the principal surface of the electronic element, to electrically connect the electronic element and the conductor through the leading electrode film.

Abstract translation: 电子设备包括：电子元件; 每个电子元件彼此相邻放置在两个电子元件之间; 密封件，其覆盖电子元件和除电子元件的主表面和导体的第一表面之外的导体，电子元件的主表面和导体的第一表面存在于同一平面上，密封件的表面 存在; 以及引导电极膜，其各自以薄膜状形式连接到位于一个电子元件之间的密封件表面的三个表面，其中一个导体，导体的第一表面和主体的一部分 电子元件的表面，通过前导电极膜电连接电子元件和导体。

公开(公告)号：US20150189753A1

公开(公告)日：2015-07-02

申请号：US14144516

申请日：2013-12-30

Applicant: Dileep Goyal ,  Mihai Ionescu ,  Hari N. Chakravarthula

Inventor： Dileep Goyal ,  Mihai Ionescu ,  Hari N. Chakravarthula

IPC: H05K1/14 ,  H05K3/36 ,  H01B7/06

CPC classification number: H05K1/0283 ,  G06F1/163 ,  G06F3/011 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/1028 ,  H05K2201/10287 ,  Y10T29/49126

Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices configured to facilitate communication among electronic devices, including mobile phones and media devices that present audio and/or video content. More specifically, disclosed are wearable systems, platforms and methods for providing stress-tolerant interconnections to enhance signal connectivity reliability in a wearable device. In various embodiments, a wearable electronics platform can include circuit substrates and interconnect portions disposed coextensive with a longitudinal surface between the circuit substrates. An interconnection portion can include conductors having one or more stress-relief features, and an elastic material encapsulating the conductors. In some examples, the longitudinal surface including the interconnects and the circuit substrates can be configured to substantially encircle an axis. The axis can coincide with a body part or an appendage, such as a wrist.

Abstract translation: 实施例通常涉及可穿戴电气和电子硬件，计算机软件，有线和无线网络通信以及被配置为促进包括提供音频和/或视频内容的移动电话和媒体设备的电子设备之间的通信的可穿戴/移动计算设备。 更具体地，公开了用于提供耐应力互连以增强可穿戴设备中的信号连接可靠性的可穿戴系统，平台和方法。 在各种实施例中，可佩戴的电子平台可以包括电路基板和与电路基板之间的纵向表面共同延伸的互连部分。 互连部分可以包括具有一个或多个应力消除特征的导体和封装导体的弹性材料。 在一些示例中，包括互连件和电路基板的纵向表面可以构造成基本上环绕轴线。 轴可以与身体部位或附属物（例如手腕）重合。

公开(公告)号：US20150131244A1

公开(公告)日：2015-05-14

申请号：US14395467

申请日：2013-04-03

Applicant: CENTRE NATIONALE DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： Sylvain Ballandras ,  Bruno Francois

IPC: G01K11/26 ,  H05K1/18

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2101/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The electrical device (2, 202) according to the invention comprises a first electrical component (4) and a second electrical component (6) connected to each other via an electrical connection means (26) having an electrically insulating support plate (24), and a weld joint (22) deposited on the support plate (24).The weld joint (22) has a melting temperature (TO significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection means (26) are provided to be subjected.The electrical device (2) comprises a cement (28) that completely covers the exposed weld joint (22), the material of the cement (28) being chosen to maintain its adhesion and its tightness with respect to the weld joint (22) when the ambient operating temperature (Ta) is applied.

Abstract translation: 根据本发明的电气设备（2,202）包括通过具有电绝缘支撑板（24）的电连接装置（26）彼此连接的第一电气部件（4）和第二电气部件（6） 和沉积在支撑板（24）上的焊接接头（22）。 焊接接头（22）的熔融温度（TO显着低于设置有两个电气部件和电连接装置26中的至少一个）的环境工作温度（Ta），电气装置 2）包括完全覆盖暴露的焊接接头（22）的水泥（28），选择水泥（28）的材料以在环境工作温度下保持其粘合力及其相对于焊接接头（22）的密封性 （Ta）。

公开(公告)号：US09000305B2

公开(公告)日：2015-04-07

申请号：US13394473

申请日：2010-09-01

Applicant: Manfred Michalk

Inventor： Manfred Michalk

IPC: H05K1/16 ,  H05K3/30 ,  G06K19/077 ,  H01Q7/00 ,  H01Q9/27 ,  H05K3/10 ,  H01L23/00 ,  H01F41/06

CPC classification number: H05K1/162 ,  G06K19/07749 ,  G06K19/07779 ,  H01F41/074 ,  H01L24/85 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01Q7/00 ,  H01Q9/27 ,  H05K3/103 ,  H05K3/30 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/1028 ,  Y10T156/10 ,  Y10T156/17 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The present invention relates to a circuit arrangement (1) having a prescribed electrical capacitance, comprising a substrate (S) having at least one metallic, electrically conductive conductor (L, Lb, Ls). According to the invention, at least one first conductor strip segment (LA1) is disposed on the substrate (S) and at least some regions of at least one second conductor strip segment (LA2, LA3, LA4) are disposed on the first conductor strip segment (LA1), wherein an electrically insulating layer (iS) is disposed between the conductor strip segments (LA1, LA2, LA3, LA4), forming a dielectric. The invention further relates to a method and a device (2) for producing a circuit arrangement (1) having a prescribed electrical capacitance.

Abstract translation: 本发明涉及具有规定电容的电路装置（1），其包括具有至少一个金属导电导体（L，Lb，Ls）的基板（S）。 根据本发明，至少一个第一导体条段（LA1）设置在基板（S）上，并且至少一个第二导体条段（LA2，LA3，LA4）的至少一些区域设置在第一导体条 （LA1），其中电绝缘层（iS）设置在导体条段（LA1，LA2，LA3，LA4）之间，形成电介质。 本发明还涉及一种用于制造具有规定电容的电路装置（1）的方法和装置（2）。

公开(公告)号：US20150003020A1

公开(公告)日：2015-01-01

申请号：US14490425

申请日：2014-09-18

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Chang HONG ,  Kwang Seop YOUM ,  Bong Kyu CHOI

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic component-embedded printed circuit board includes: a core substrate having a cavity; an electronic component in the cavity; an inner circuit layer formed on the core substrate; a cooling member provided on the first surface of the core substrate at a position over the cavity; and an outer insulating layer on the core substrate. In one embodiment, the cooling member is covering over a portion of the outer surface of the inner circuit layer, and is adhered to the electronic component and to the outer surface of the inner circuit layer through a conductive material.

Abstract translation: 电子元件嵌入式印刷电路板包括：具有空腔的芯基板; 空腔中的电子部件; 形成在所述芯基板上的内电路层; 设置在所述芯基板的所述第一表面上的空腔上方的位置的冷却部件; 和芯基板上的外绝缘层。 在一个实施例中，冷却构件覆盖在内部电路层的外表面的一部分上，并且通过导电材料粘附到电子部件和内部电路层的外表面。