Abstract:
A low cost aluminum electrolytic capacitor package having axial anode and cathode leads extending in one direction is capable of being seated and wave-solder connected in horizontal position to a printed circuit board without rolling, which unwanted rolling may result in withdrawal of one lead that consequently may not receive solder. A dummy lead is bonded to the opposite end of the package to stabilize the capacitor after solder mounting. One of the three leads has an ox-bow bend that tends to stop the unwanted rolling.
Abstract:
To seat an electrical circuit element in a metallized opening of a circuit board and permit escape of solder gases, a bead is placed on the insertion pin and formed with a surface facing the support board which is non-symmetrical with respect to the axis of the pin, and of the insertion opening. Preferably, the surface is conical, and on adjacent pins the cone angles are tilted in opposite directions to provide for the non-symmetrical positioning of any one cone and centered placement of the insertion pins in the insertion openings.
Abstract:
A mounting arrangement is provided whereby an electronic display device with contact pins accessible on one side is mounted on a printed circuit board by means of a plurality of elongated pin extender elements connected between individual ones of the contact pins and points of contact on associated ones of the conductive leads on the printed circuit board, the elements having pin receiving means for receiving the pins and being oriented at an off-orthogonal angle with respect to said printed circuit board and the pin extender elements form a triangulated structural support for the display device.
Abstract:
An electrical connection between spaced and parallel mother and daughter boards including terminals secured to the mother board and projecting toward the daughter board having a pivot link arm with a daughter board-engaging member at the free end of the link arm and a daughter board spring contact. A number of terminals are secured to the mother board all facing in the same direction so that upon movement of the daughter board in a direction parallel to the mother board the links pivot the daughter board down toward the mother board and bring contact pads on the daughter board in engagement with the spring contacts.
Abstract:
A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a mounting block. The housing includes a base, a first side wall and a second side wall. Each terminal module includes a first signal terminal and a second signal terminal. The first signal terminal has a first mounting foot, and the second signal terminal has a second mounting foot. The housing includes a receiving groove at a bottom end of the base. The mounting block is received in the receiving groove. The mounting block is made of electroplated plastic. The mounting block has an opening for the first mounting foot and the second mounting foot to extend through. As a result, the backplane connector has a better shielding effect.
Abstract:
A terminal module includes a number of conductive terminals. The conductive terminal includes a contact portion, a transition portion connected with the contact portion and a connection portion electrically connected with the transition portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The differential signal terminals include a first signal terminal and a second signal terminal. The terminal module further includes a fixing block fixed on the transfer portions of the first signal terminal and the second signal terminal. As a result, a distance between the first signal terminal and the second signal terminal can be controlled by the fixing block for improving the quality of data transmission. The present disclosure also discloses a backplane connector having the terminal module.
Abstract:
A backplane connector includes a housing and a number of terminal modules. Each terminal module includes a number of conductive terminals, a metal shield surrounding member, a first metal shield and a second metal shield. The conductive terminal includes a mating portion and a tail portion. The conductive terminals include a first signal terminal and a second signal terminal. The metal shield surrounding member surrounds the mating portions of the first signal terminal and the second signal terminal. The first metal shield and the second metal shield are in contact with the metal shield surrounding member. As a result, the shielding area is increased and the shielding effect is improved.
Abstract:
According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.