Application method
    142.
    发明授权

    公开(公告)号:US11033929B2

    公开(公告)日:2021-06-15

    申请号:US15807643

    申请日:2017-11-09

    Inventor: Naozumi Fujiwara

    Abstract: For a substrate having a diameter of 300 millimeters and a main surface on which a lot of pattern elements standing upright are formed, a processing using a processing liquid is performed on the main surface. After the processing using the processing liquid, a filler solution is applied onto the main surface. In the application process of the filler solution, pure water is supplied onto the main surface which faces upward while the substrate is in a horizontal state, and a liquid film of the pure water which covers the main surface and has a thickness not larger than 5 micrometers is formed by rotating the substrate. Then, the filler solution containing a water-soluble filler is supplied onto a center portion of the main surface while the substrate is rotated at the number of rotation not smaller than 300 times and not larger than 500 times per minute.

    Spin coating apparatus, system, and method

    公开(公告)号:US11020766B2

    公开(公告)日:2021-06-01

    申请号:US16576195

    申请日:2019-09-19

    Abstract: A spin coating apparatus, system, and/or method that increase the uniformity of a coating material on a substrate. The spin coating system may be specifically directed for use with polygonal shaped substrates. The spin coating system may include a process chamber within which the substrate is located, spinning on a chuck, during operation. The spin coating system may include gas injection ports that inject a gas into the process chamber so that the gas contacts the substrate along corner portions of its front surface. This injection of the gas increases pressure and prevents excessive build-up of the coating material that may otherwise occur when spin coating polygonal shaped substrates.

    Film forming apparatus, film forming method, and storage medium

    公开(公告)号:US10960435B2

    公开(公告)日:2021-03-30

    申请号:US15915392

    申请日:2018-03-08

    Abstract: A film forming apparatus includes: a film forming gas discharge part; an exhaust port; a rotation mechanism; a heating part configured to heat the interior of a reaction container to a temperature lower than a temperature of a film forming gas discharged from the film forming gas discharge part; first gas discharge holes opened, in the film forming gas discharge part, toward a gas temperature reducing member so that the film forming gas is cooled by colliding with the gas temperature reducing member inside the reaction container before the film forming gas is supplied to substrates; and second gas discharge holes opened, in the film forming gas discharge part, in a direction differing from an opening direction of the first gas discharge holes so that the film forming gas does not collide with the gas temperature reducing member before the film forming gas is supplied to the substrates.

    Nano-coating protection method for electrical connectors

    公开(公告)号:US10934623B2

    公开(公告)日:2021-03-02

    申请号:US16882100

    申请日:2020-05-22

    Inventor: Jian Zong

    Abstract: Introduced here is a plasma polymerization apparatus and process. Example embodiments include a vacuum chamber in a substantially symmetrical shape to a central axis. A rotation rack may be operable to rotate about the central axis of the vacuum chamber. Additionally, reactive species discharge mechanisms positioned around a perimeter of the vacuum chamber in a substantially symmetrical manner from the outer perimeter of the vacuum chamber may be configured to disperse reactive species into the vacuum chamber. The reactive species may form a polymeric multi-layer coating on surfaces of the one or more devices. Each layer may have a different composition of atoms to enhance the water resistance, corrosion resistance, and fiction resistance of the polymeric multi-layer coating.

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