公开(公告)号：US11646246B2

公开(公告)日：2023-05-09

申请号：US16461970

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H01L29/40 ,  H01L29/06 ,  H01L23/48 ,  H01L21/00 ,  H01K3/10 ,  H01L23/15 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H05K3/10 ,  H01L21/48 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22 ,  H05K1/16 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K3/00 ,  H01L23/367

CPC classification number: H01L23/481 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49883 ,  H05K3/101 ,  H05K3/102 ,  H05K3/107 ,  H05K3/4061 ,  H05K3/4076 ,  H05K3/4614 ,  H05K3/4629 ,  C03C2204/00 ,  C03C2205/00 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0029 ,  H05K3/403 ,  H05K3/423 ,  H05K2201/0272 ,  H05K2201/0391 ,  H05K2201/068 ,  H05K2201/09254 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/1006 ,  H05K2203/0182 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1131 ,  H05K2203/1461 ,  H05K2203/1476

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：US20190235695A1

公开(公告)日：2019-08-01

申请号：US16382427

申请日：2019-04-12

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya Hashimoto

IPC: G06F3/041 ,  H05K1/11 ,  G02F1/1333 ,  G06F1/16 ,  H05K1/02 ,  G06F3/044 ,  G02F1/1343

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

公开(公告)号：US10064276B2

公开(公告)日：2018-08-28

申请号：US14919594

申请日：2015-10-21

Applicant: Applied BioPhotonics, Ltd.

Inventor： Richard K Williams ,  Keng Hung Lin

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K3/24

CPC classification number: H05K1/148 ,  H05K1/147 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/24 ,  H05K3/32 ,  H05K3/361 ,  H05K3/4038 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

公开(公告)号：US20170371482A1

公开(公告)日：2017-12-28

申请号：US15674907

申请日：2017-08-11

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya Hashimoto

IPC: G06F3/041 ,  G06F3/044 ,  G02F1/1343 ,  G02F1/1333

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

公开(公告)号：US09773761B2

公开(公告)日：2017-09-26

申请号：US14903858

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L33/62 ,  H01L25/075 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

公开(公告)号：US09711386B2

公开(公告)日：2017-07-18

申请号：US14336717

申请日：2014-07-21

Applicant: Applied Materials, Inc.

Inventor： Michael S. Cox ,  Zheng Yuan

IPC: H01L21/683 ,  H05K3/10 ,  H05K3/28 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01L21/6833 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2203/0195 ,  H05K2203/1338 ,  Y10T29/49155

Abstract: Embodiments of the present invention provide a substrate support assembly including an electrostatic chuck with enhanced heat resistance. In one embodiment, an electrostatic chuck includes a support base, an electrode assembly having interleaved electrode fingers formed therein, and an encapsulating member disposed on the electrode assembly, wherein the encapsulating member is fabricated from one of a ceramic material or glass.

公开(公告)号：US20170118838A1

公开(公告)日：2017-04-27

申请号：US14919594

申请日：2015-10-21

Applicant: Applied BioPhotonics, Ltd.

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/02 ,  H05K3/32 ,  H05K3/06 ,  H05K3/00 ,  H05K3/36 ,  H05K3/18

CPC classification number: H05K1/148 ,  H05K1/147 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/24 ,  H05K3/32 ,  H05K3/361 ,  H05K3/4038 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

公开(公告)号：US09557854B2

公开(公告)日：2017-01-31

申请号：US15010744

申请日：2016-01-29

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya Hashimoto

IPC: G06F3/041 ,  G06F3/044 ,  H05K1/11 ,  G06F1/16 ,  H05K1/02 ,  H05K3/36

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

Abstract translation: 显示装置包括显示面板和与显示面板重叠形成的静电电容式触摸面板。 多个X电极和与X电极交叉的多个Y电极。 第一信号线向X电极提供信号，第二信号线向Y电极提供信号，并且第一信号线和第二信号线形成在柔性印刷电路板上。 在每个X电极和Y电极的电极部分的电极部分附近形成虚拟电极，虚拟电极不与X电极和Y电极重叠，并且虚拟电极不与第一和第二信号电连接 线条。

公开(公告)号：US09414490B2

公开(公告)日：2016-08-09

申请号：US14206750

申请日：2014-03-12

Applicant: HIQ SOLAR, INC.

Inventor： Andre P. Willis

IPC: H05K7/10 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.

Abstract translation: 具有诸如焊盘的部件连接焊盘的印刷线路板，为表面安装电路部件提供热应力补偿以及制造这种焊盘的方法。 部件连接焊盘包括相对的多个导电指状物组，它们在其远端相互连接并且在它们的近端分开，在它们的近端具有用于安装单个表面安装电路部件的表面。

公开(公告)号：US20160172339A1

公开(公告)日：2016-06-16

申请号：US14903834

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

Abstract translation: 提供了使用纳米级LED电极组件的LED灯。 使用纳米级LED电极组件的LED灯可以解决限制，其中当根据现有技术的纳米级LED器件立起并且三维耦合到电极时，难以允许纳米级 LED装置站起来，并且当纳米尺度的LED装置与一对一耦合对应于彼此不同的电极时，产品质量劣化。 因此，具有纳米单元的纳米级LED器件可以连接到彼此不同的两个电极而不引起缺陷，并且由于连接到电极的纳米级LED器件的方向性，可以提高光提取效率。 此外，由于LED灯中设置的纳米级LED的一部分的缺陷导致的LED灯的功能劣化可以最小化，并且LED灯可以通过使用纳米级LED电极而具有柔性的结构和形状 其组件根据LED灯的使用目的或位置可变形。