Abstract:
A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.
Abstract:
A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions.
Abstract:
A printed circuit board includes a signal layer having a pair of differential transmission lines thereon. An eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines are variable according to a distance between the pair of differential transmission lines. The eye width and the eye height of the eye diagram are at minimum values when the distance between the pair of differential transmission lines is at a first distance. The eye width and the eye height meet requirements of the pair of differential transmission lines for the eye diagram when the distance between the pair of differential transmission lines is set at a second distance, the second distance is less than the first distance.
Abstract:
A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.
Abstract:
An electronic filtering device includes continuous trace on a dielectric substrate and a dissipation layer communicatively coupled to the trace. The dissipation layer may include disconnected metal particles, which may be embedded in a substrate, for example in an epoxy. The continuous trace may be meandering, for example crenulated, coil or spiral signal path. At least a second continuous trace may be spaced from the first by the substrate, and conductively coupled by a via. The electronic filtering device may be used in one or more printed circuit boards (PCBs) that form stages of an input/output system.
Abstract:
A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.
Abstract:
Disclosed is an electrical capacitance sensor comprising: a board 10 having a one main surface and an other main surface; a sensor electrode 26 formed on the one main surface of the board 10 and detecting an electrical capacitance between the sensor electrode 26 and an object; a first guard electrode 25 formed on the one main surface of the board 10 and in a vicinity of the sensor electrode 26; and a second guard electrode 27 formed on the other main surface of the board 10, wherein a first terminal connecting portion 21 for the first guard electrode 25 and a second terminal connecting portion 23 for the second guard electrode 27 are provided at positions opposing each other.
Abstract:
A printed circuit board layout method includes the following steps. A printed circuit board with a signal layer, and a pair of differential transmission lines positioned on the signal layer is provided. A first distance is determined, when the distance between the pair of differential transmission lines is greater or less than the first distance, an eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines increases. A second distance less than the first distance is set between the pair of differential transmission lines which makes the eye width and the eye height meet requirement of the differential transmission lines for the eye diagram.
Abstract:
A multi-layer flexible film package which shields electromagnetic waves, prevents electrostatic discharge, and at the same time, performs a heat radiation function, and a liquid crystal display device having the same, include an insulating film having circuit patterns and internal ground wiring lines at a first side thereof, an insulating layer formed on the circuit patterns and the internal ground wiring lines, a driver integrated circuit (“IC”) electrically connected to the circuit patterns and the internal ground wiring lines, a ground layer formed on a second side opposite the first side of the insulating film and connected to the internal ground wiring lines, and via holes formed through the insulating film and electrically connecting the internal ground wiring lines and the ground layer.
Abstract:
A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.