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    Flexible connection system
    151.
    发明授权
    Flexible connection system 失效
    灵活的连接系统

    公开(公告)号：US06369333B1

    公开(公告)日：2002-04-09

    申请号：US09023531

    申请日：1998-02-13

    Applicant: Dawson Yee

    Inventor： Dawson Yee

    IPC: H01R909

    CPC classification number: H05K3/306 ,  H01R12/58 ,  H01R12/7047 ,  H05K1/116 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10969

    Abstract: A method and apparatus for a connection system to a substrate is provided. The system includes a substrate having a mounting hole to permit an object to be coupled to the substrate. The substrate further includes a conductive pattern around the mounting hole on the substrate. The conductive pattern is designed to contact an interface, and selectively couple a ground signal to the object coupled to the substrate.

    Abstract translation: 提供了一种用于连接到衬底的系统的方法和装置。 该系统包括具有安装孔以允许物体与衬底耦合的衬底。 衬底还包括围绕衬底上的安装孔的导电图案。 导电图案被设计成接触界面，并且将接地信号选择性地耦合到耦合到基板的对象。

    Conducting foil for conductively connecting electric and/or electronic components
    152.
    发明授权
    Conducting foil for conductively connecting electric and/or electronic components 有权
    导电箔用于电气和/或电子部件的导电连接

    公开(公告)号：US6150614A

    公开(公告)日：2000-11-21

    申请号：US125183

    申请日：1998-08-12

    Applicant: Bernhard Miller ,  Friedbert Roether ,  Norbert Schneider

    Inventor： Bernhard Miller ,  Friedbert Roether ,  Norbert Schneider

    IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34

    CPC classification number: H05K1/118 ,  H05K1/0215 ,  H05K1/0281 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K3/0058 ,  H05K3/3447

    Abstract: In a conductor foil for conductively connecting electrical and/or electronic components, the conductor foil including printed circuit traces, insulated to the outside and applied on a non-conductive, elastically malleable carrier foil. The conductive foil also includes soldering surfaces connected to the printed circuit traces, for soldering to electric terminals of components, in addition, the conductor foil includes feed line segments through which the printed circuit traces are led to the soldering surfaces, in order, in response to shaking stresses, to avoid damage to the soldering points by vibrations transmitted by the feed line segments. Furthermore, the conductor foil has stiffening segments branching off from the feed line segments, the stiffening segments, in response to shaking stresses, causing a force diversion of the vibrations onto the stiffening segments via the feed line segment movable end, which is not connected to the soldering surfaces.

    Abstract translation: PCT No.PCT / DE97 / 01995 Sec。 371日期1998年8月12日 102（e）1998年8月12日PCT PCT 1997年9月9日PCT公布。 WO98 / 28956 PCT公开号 日期1998年7月2日在用于导电连接电气和/或电子部件的导体箔中，导体箔包括印刷电路迹线，绝缘到外部并施加在不导电的，弹性可延展的载体箔上。 导电箔还包括连接到印刷电路迹线的焊接表面，用于焊接到部件的电端子，此外，导体箔包括馈送线段，印刷电路迹线通过引线段引导到焊接表面，以响应 振动应力，以避免由馈电线段传播的振动损坏焊接点。 此外，导体箔具有从进料线段分支出的加强段，加强段响应于振动应力，引起通过馈送线段可移动端将振动转移到加强段上的力，其不连接到 焊接面。

    Arrangement for modifying eletrical printed circuit boards
    156.
    发明授权
    Arrangement for modifying eletrical printed circuit boards 失效
    修改电子印刷电路板的布置

    公开(公告)号：US5834705A

    公开(公告)日：1998-11-10

    申请号：US205990

    申请日：1994-03-04

    Applicant: Siamak Jonaidi

    Inventor： Siamak Jonaidi

    IPC: H05K1/00 ,  H05K1/14 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K3/225 ,  H05K1/141 ,  H05K1/0393 ,  H05K2201/049 ,  H05K2201/096 ,  H05K2201/10409 ,  H05K2201/10689 ,  H05K2203/167 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/361 ,  H05K3/363 ,  H05K3/368

    Abstract: An apparatus for modifying a printed circuit board comprised of a nonconductively adhering flexible circuitized substrate, the flexible circuitized substrate having a conductive circuit trace composed of one or more layers of thin wires sandwiched between two or more layers of flexible insulating protective material. The wires forming the circuit trace of the flexible substrate and the conductors forming the circuitry in and on the printed circuit board are electrically interconnected at appropriate predetermined positions by establishing conductive paths through portions of the insulating layers of the flexible circuitized substrate. Circuit components can also be affixed to either the flexible circuitized substrate or to the printed circuit board or to both after the flexible circuitized substrate has been affixed to the printed circuit board. By this means, additional or corrective electrical connections can be made to the printed circuit board at one time without the danger of routing errors or unwanted transmission effects of soldered wire interconnects. Additionally, circuit components of a differing bonding-pad configuration or pitch may be conveniently substituted for those originally designed to be used within the printed circuit board circuitry.

    Abstract translation: 一种用于修改由非导电粘附的柔性电路化基板构成的印刷电路板的装置，所述柔性电路化基板具有由夹在两层或更多层柔性绝缘保护材料之间的一层或多层细线构成的导电电路迹线。 形成柔性基板的电路迹线的线和形成印刷电路板中和印刷电路板上的电路的导体通过建立穿过柔性电路化基板的绝缘层的一部分的导电路径而在适当的预定位置电互连。 电路部件也可以固定到柔性电路化基板或印刷电路板上，或者在柔性电路化基板已被固定到印刷电路板之后。 通过这种方式，可以一次对印刷电路板进行额外的或校正的电连接，而不会出现路由错误或焊接线互连的不期望的传输效应的危险。 另外，不同焊接结构或间距的电路部件可以方便地代替原来设计用于印刷电路板电路的那些。

    Printed circuit board mounting structure and electronic device using the same
    158.
    发明授权
    Printed circuit board mounting structure and electronic device using the same 失效
    印刷电路板安装结构和使用其的电子设备

    公开(公告)号：US5786989A

    公开(公告)日：1998-07-28

    申请号：US591908

    申请日：1996-01-25

    Applicant: Shin Kawabe

    Inventor： Shin Kawabe

    IPC: H05K1/18 ,  H05K3/22 ,  H05K7/14 ,  H05K9/00 ,  H05K5/00 ,  H01R9/18

    CPC classification number: H05K1/181 ,  H05K3/222 ,  H05K7/142 ,  H05K9/0039 ,  H05K2201/10409 ,  H05K2201/105 ,  H05K2201/10598 ,  Y02P70/611

    Abstract: A mounting structure for mounting a printed circuit board on a frame of an electronic device. The mounting structure comprises a body, a lead, and a threaded portion. The threaded portion is formed on the body, and receives a screw. The printed circuit board is secured to a frame of an electronic device using the mounting structure. Specifically, the mounting structure is secured to the frame using the screw. The lead is soldered to lands on a mounting surface of the printed circuit board by a process for mounting electronic parts (e.g. an IC or LSI package) on the mounting surface of the electronic device.

    Abstract translation: 一种用于将印刷电路板安装在电子设备的框架上的安装结构。 安装结构包括主体，引线和螺纹部分。 螺纹部分形成在主体上，并接收螺钉。 使用安装结构将印刷电路板固定到电子设备的框架。 具体地，使用螺钉将安装结构固定到框架。 引线通过用于将电子部件（例如IC或LSI封装）安装在电子设备的安装表面上的工艺焊接到印刷电路板的安装表面上的焊盘上。

    Heat sink assembly including a printed wiring board and a metal case
    159.
    发明授权
    Heat sink assembly including a printed wiring board and a metal case 失效
    散热器组件包括印刷电路板和金属外壳

    公开(公告)号：US5739586A

    公开(公告)日：1998-04-14

    申请号：US705609

    申请日：1996-08-30

    Applicant: Sharon M. Cannizzaro ,  Libbie R. Terwilliger ,  Timothy B. Tunnell ,  Wayne P. Vaughn ,  Steven Veneman

    Inventor： Sharon M. Cannizzaro ,  Libbie R. Terwilliger ,  Timothy B. Tunnell ,  Wayne P. Vaughn ,  Steven Veneman

    IPC: H01L23/367 ,  H01L23/40 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42 ,  H01L23/10 ,  H01L23/28 ,  H01L23/34

    CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/09572 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/42

    Abstract: A heat sink assembly includes a printed wiring board, a metal case and a circuit package containing a gallium arsenide field effect transistor heat dissipating circuit. The circuit package includes a metal slug formed integrally with the circuit package, the heat dissipating circuit being bonded to an obverse surface of the metal slug. The printed wiring board includes first and second metal lands, the first metal land being disposed on an obverse surface of the printed wiring board, the second metal land being disposed on a reverse surface of the printed wiring board. A solder film is formed bonded to and thermally coupling a reverse surface of the metal slug to the first metal land, and a plurality of solder posts are formed, each post bonding to and thermally coupling the first metal land to the second metal land. The metal case is pressed against the second metal land with a grease film of thermally conductive grease squeezed therebetween. At least one bolt extends through a hole in the printed wiring board and into the metal case so as to squeeze together the metal case, the printed wiring board, the first and second metal lands and the grease film.

    Abstract translation: 散热器组件包括印刷线路板，金属外壳和包含砷化镓场效应晶体管散热电路的电路封装。 电路封装包括与电路封装一体形成的金属块，该散热电路接合到金属块的正面上。 印刷电路板包括第一和第二金属焊盘，第一金属焊盘设置在印刷电路板的正面上，第二金属焊盘设置在印刷电路板的背面上。 形成了将金属块的反面与第一金属焊盘接合并热耦合的焊锡膜，并且形成多个焊料柱，每个焊接柱与第一金属焊盘接合并热耦合到第二金属焊盘。 金属壳体被压在第二金属焊盘上，在其间挤压有导热油脂的脂膜。 至少一个螺栓延伸穿过印刷线路板中的孔并进入金属壳体中，以将金属壳体，印刷线路板，第一和第二金属焊盘和油脂膜挤压在一起。

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