公开(公告)号：US20050266702A1

公开(公告)日：2005-12-01

申请号：US11139846

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20050237075A1

公开(公告)日：2005-10-27

申请号：US11170852

申请日：2005-06-30

Applicant: Alan Wood ,  Tim Corbett

Inventor： Alan Wood ,  Tim Corbett

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/13 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

CPC classification number: H01L24/80 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0491 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2855 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L22/20 ,  H01L22/22 ,  H01L23/13 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

公开(公告)号：US20050230841A1

公开(公告)日：2005-10-20

申请号：US10825400

申请日：2004-04-15

Applicant: Michael Walk ,  Hamid Azimi ,  John Guzek ,  Charan Gurumurthy

Inventor： Michael Walk ,  Hamid Azimi ,  John Guzek ,  Charan Gurumurthy

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/52 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0271 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/15312 ,  H01L2924/15313 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.

Abstract translation: 系统可以包括无芯衬底，附着到衬底的材料层，具有比衬底更低的弹性模量的材料层，耦合到材料层的插入器以及耦合到插入器的电容层。

公开(公告)号：US20050215707A1

公开(公告)日：2005-09-29

申请号：US11132846

申请日：2005-05-19

Applicant: Jyoti Sharma ,  Martin Choate ,  Steve Peters ,  Kevin Rafferty

Inventor： Jyoti Sharma ,  Martin Choate ,  Steve Peters ,  Kevin Rafferty

IPC: B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B17/04 ,  B32B27/04 ,  B32B27/18 ,  C08K5/06 ,  C08K5/14 ,  C08L51/00 ,  C08L51/04 ,  C08L53/02 ,  C08L55/02 ,  C08L67/06 ,  H05K1/03 ,  B32B27/00 ,  C08H1/00

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B17/04 ,  B32B27/04 ,  B32B27/18 ,  B32B2307/20 ,  B32B2307/3065 ,  B32B2309/022 ,  B32B2309/12 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  C08K5/06 ,  C08K5/14 ,  C08L51/003 ,  C08L51/04 ,  C08L53/02 ,  C08L55/02 ,  C08L67/06 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0209 ,  Y10T428/249933 ,  Y10T428/249939 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31616 ,  Y10T428/31645 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31786 ,  Y10T428/31794 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T442/2631 ,  C08L2666/02 ,  C08L2666/14

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as the prepregs, laminates and composites made from the thermosetting resin composition.

Abstract translation: 本发明涉及一种热固性树脂体系，其可用于制造高性能预浸料，层压材料和复合材料以及由热固性树脂组合物制成的预浸料，层压材料和复合材料。

公开(公告)号：US20050202261A1

公开(公告)日：2005-09-15

申请号：US11044533

申请日：2005-01-28

Applicant: Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: B32B3/00 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘附辅助剂金属箔，其包含在金属上含有环氧树脂作为不可或缺成分的粘合助剂层，其中粘合助剂层的厚度为0.1-10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US20050194349A1

公开(公告)日：2005-09-08

申请号：US10906682

申请日：2005-03-02

Applicant: Dyi-Chung Hu ,  Chih-Kung Huang ,  Chien-Nan Wu

Inventor： Dyi-Chung Hu ,  Chih-Kung Huang ,  Chien-Nan Wu

IPC: H01B13/00 ,  H01L21/48 ,  H01L23/28 ,  H01L23/498 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K1/028 ,  H01L21/4846 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/064 ,  H05K3/244 ,  H05K3/383 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2203/0574 ,  H01L2924/00

Abstract: A method of fabricating a film carrier is provided. The method comprises the steps of providing a film; forming a metallic layer on the film, patterning the metallic layer by etching to form a plurality of metallic leads; and, patterning the film by etching to form a plurality of openings so that processing time and manufacturing cost are reduced.

Abstract translation: 提供一种制造薄膜载体的方法。 该方法包括提供薄膜的步骤; 在所述膜上形成金属层，通过蚀刻图案化所述金属层以形成多个金属引线; 并且通过蚀刻来图案化膜以形成多个开口，从而减少了处理时间和制造成本。

公开(公告)号：US06916527B2

公开(公告)日：2005-07-12

申请号：US09986005

申请日：2001-11-07

Applicant: Naoto Ikegawa ,  Masahiro Sato ,  Naoyuki Kondo

Inventor： Naoto Ikegawa ,  Masahiro Sato ,  Naoyuki Kondo

IPC: C08J7/06 ,  C08L51/06 ,  C08L55/02 ,  C23C14/02 ,  C23C14/20 ,  H05K1/03 ,  H05K3/38 ,  B32B5/06 ,  B32B5/16 ,  B32B15/08 ,  B32B27/06

CPC classification number: H05K1/0373 ,  C08L51/06 ,  C08L55/02 ,  C23C14/022 ,  C23C14/20 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/095 ,  Y10S428/901 ,  Y10T428/249951 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31533 ,  Y10T428/31681 ,  Y10T428/31699 ,  C08L2666/14 ,  C08L2666/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A resin molded component, comprising metal coating treatment being provided on the surface by a physical deposition method chosen from among sputtering, vacuum deposition, and ion plating after the surface is activated by plasma treatment, and is produced by forming a resin composition combined a base resin comprising of a thermoplastic resin or a thermosetting resin with a rubber-like elastic material.

Abstract translation: 一种树脂成型部件，其特征在于，在表面被等离子体处理后，通过溅射，真空蒸镀，离子镀等选择的物理沉积方法，在表面上设置金属被膜成形体， 由具有橡胶状弹性材料的热塑性树脂或热固性树脂构成的树脂。

公开(公告)号：US06914198B2

公开(公告)日：2005-07-05

申请号：US10237579

申请日：2002-09-09

Applicant: Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H01L23/495 ,  H05K1/02 ,  H05K1/09 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

Abstract translation: 公开了一种包括具有有源侧和非有源侧的电路的器件，封装电路的有源侧的封装，并且不包围电路的非有源侧的一部分，以及引线，其具有连接到第一端 经由引线芯片连接到电路的有源侧，并且具有从封装延伸的第二端。 还公开了一种包括由柔性导体形成的电路和引线的器件，其中引线具有连接到电路的第一端。

公开(公告)号：US20050118845A1

公开(公告)日：2005-06-02

申请号：US10496558

申请日：2002-11-21

Applicant: Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

Inventor： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC: C09J7/00 ,  C09J9/02 ,  C09J121/00 ,  C09J183/04 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R11/01 ,  H05K3/32 ,  H01R4/58

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

Abstract translation: 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US20050098901A1

公开(公告)日：2005-05-12

申请号：US10829115

申请日：2004-04-20

Applicant: Shyh-Ming Chang ,  Yuan-Chang Huang ,  Wen-Chih Chen ,  Sheng-Shu Yang

Inventor： Shyh-Ming Chang ,  Yuan-Chang Huang ,  Wen-Chih Chen ,  Sheng-Shu Yang

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/30 ,  H05K3/32 ,  H01L23/48

CPC classification number: H05K3/325 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/10135 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1357 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/2036 ,  H05K2203/1189 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The invention provides a bonding structure with compliant bumps, and also includes a stopper structure and a protection layer. Compliant bumps include at least a polymer bump, a metal layer and a surface conductive layer. Both the stopper structure and protection layer are formed with polymer bumps and metal layer. Compliant bumps provide bonding pad and conductive channel. Stoppers are used to prevent compliant bumps from crushing for overpressure in bonding process. The protection layer provides functions of grounding and shielding. The stoppers can be outside or connected with the compliant bumps. The protection layer is lower then the stopper structure and compliant bumps. It can be separated or connected with stoppers.

Abstract translation: 本发明提供一种具有柔性凸块的接合结构，并且还包括止动结构和保护层。 合适的凸块包括至少聚合物凸块，金属层和表面导电层。 阻挡结构和保护层均由聚合物凸块和金属层形成。 符合凸块提供焊盘和导电通道。 止动器用于防止在接合过程中顺应性的颠簸破碎超压。 保护层提供接地和屏蔽功能。 止动器可以在外部或与顺应性凸块连接。 保护层低于止动器结构和顺应性凸块。 它可以与塞子分离或连接。