公开(公告)号：US08456861B2

公开(公告)日：2013-06-04

申请号：US13209165

申请日：2011-08-12

Applicant: Kuang-Tao Sung ,  Shih-Hsien Chen

Inventor： Kuang-Tao Sung ,  Shih-Hsien Chen

IPC: H05K7/02 ,  H05K7/04

CPC classification number: G06F1/1601 ,  G06F2200/1612 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/361 ,  H05K2201/091 ,  H05K2201/10598 ,  H05K2203/167 ,  Y10T29/49002

Abstract: A method of fixing a flexible circuit board. The method comprises the following steps: providing a flexible circuit board having a locating hole, providing a display module frame having a locating element corresponding to the locating hole, passing the locating element through the locating hole, bonding the flexible circuit board to the frame and deforming the locating element for to fix the flexible circuit board on the frame.

Abstract translation: 一种固定柔性电路板的方法。 该方法包括以下步骤：提供具有定位孔的柔性电路板，提供具有与定位孔相对应的定位元件的显示模块框架，使定位元件穿过定位孔，将柔性电路板接合到框架， 使定位元件变形以将柔性电路板固定在框架上。

公开(公告)号：US20130119652A1

公开(公告)日：2013-05-16

申请号：US13810331

申请日：2011-07-15

Applicant: Kate Stone

Inventor： Kate Stone

IPC: B42D15/00 ,  H05K13/00 ,  H05K7/06

CPC classification number: B42D15/00 ,  B32B37/142 ,  B32B37/185 ,  B32B38/10 ,  B32B38/105 ,  B32B2305/34 ,  B32B2457/00 ,  B42D1/007 ,  B42D15/022 ,  H01H2211/012 ,  H01H2229/004 ,  H05K1/185 ,  H05K3/046 ,  H05K3/1241 ,  H05K3/4084 ,  H05K3/4697 ,  H05K7/06 ,  H05K13/00 ,  H05K2201/055 ,  H05K2201/091 ,  Y10T29/49002

Abstract: A device comprising a laminate (2) comprising at least two layers (31, 32, 33, 34, 35) and a plurality of electronic components (5, 6, 7, 8) disposed between two layers. At least one of the layers (31, 34) supports conductive tracks (10, 11) arranged to connect electronic components.

Abstract translation: 一种包括层叠体（2）的装置，其包括至少两层（31,32,33,34,35）和设置在两层之间的多个电子部件（5,6,7,8）。 层（31,34）中的至少一个支撑布置成连接电子部件的导电轨道（10,11）。

公开(公告)号：US08251707B2

公开(公告)日：2012-08-28

申请号：US13123036

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

IPC: H01R29/00

CPC classification number: H01R13/6658 ,  H01R12/67 ,  H01R24/64 ,  H01R25/006 ,  H01R2201/04 ,  H04L41/12 ,  H04Q1/136 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A structure for use with data network management systems uses a plurality of cables interconnecting patch panels, network devices and end-user devices and further utilizes integrated circuits to monitor the status of these end-user devices. The structure includes respective primary (36) and secondary (45) circuit boards. A plurality of connective jacks (31) are mounted on the primary circuit board and these jacks are interconnected to switches and other patch panels within the network. Wires from the jacks extend to and connect with end-user devices and a secondary circuit board is spaced apart from the primary circuit board so as to define a hollow nest (42) within the patch panel assembly that houses and protects integrated circuits (45, 52) and the like.

Abstract translation: 用于数据网络管理系统的结构使用互连接线板，网络设备和最终用户设备的多条电缆，并且还利用集成电路来监视这些终端用户设备的状态。 该结构包括相应的初级（36）和次级（45）电路板。 多个连接插座（31）安装在主电路板上，并且这些插孔与网络内的交换机和其他接线板互连。 插座的电线延伸到终端用户设备并与其连接，并且次级电路板与主电路板间隔开，以便在接线板组件内限定一个中空的座（42），该中空座（42）容纳和保护集成电路 52）等。

公开(公告)号：US20110308842A1

公开(公告)日：2011-12-22

申请号：US13075865

申请日：2011-03-30

Applicant: Yoshihiro MORITA ,  Takahiro OOI ,  Tetsuro YAMADA ,  Akiko MATSUI ,  Mitsuhiko SUGANE ,  Takahide MUKOYAMA

Inventor： Yoshihiro MORITA ,  Takahiro OOI ,  Tetsuro YAMADA ,  Akiko MATSUI ,  Mitsuhiko SUGANE ,  Takahide MUKOYAMA

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0366 ,  D03D1/0088 ,  D03D15/0011 ,  D03D15/0088 ,  D10B2401/18 ,  D10B2505/02 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0248 ,  H05K2201/029 ,  H05K2201/091 ,  H05K2203/0195 ,  Y10T29/49124

Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

Abstract translation: 布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线 在绝缘层上。 第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。

公开(公告)号：US20110195598A1

公开(公告)日：2011-08-11

申请号：US13123029

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot C. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot C. Baines ,  Jeng-De Lin

IPC: H01R13/66 ,  H01R3/00

CPC classification number: H04Q1/136 ,  H01R4/2433 ,  H01R13/2421 ,  H01R13/4538 ,  H01R13/465 ,  H01R13/6473 ,  H01R13/6616 ,  H01R13/6625 ,  H01R24/64 ,  H01R2201/04 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A termination unit (144) for use with a system that permits the monitoring of a computer network to perform network inventories. The termination unit takes the form of a cap that engages the termination face of a network jack and has a sensing circuit (246) integrated therewith so that, once engaged with the jack, the sensing circuit is connected to two terminals of the jack. The sensing circuit may include a resistor, capacitor or inductor, any of which provide a known sensing value that is different than a sensed value of an end-user device used on the network, but less than infinity so that the system senses when an end-user device is connected to or disconnected from the network.

Abstract translation: 一种与允许监视计算机网络执行网络清单的系统一起使用的终端单元（144）。 终端单元采用与网络插座的端接面接合的帽的形式，并且具有与其一体化的感测电路（246），使得一旦与插座接合，感测电路连接到插座的两个端子。 感测电路可以包括电阻器，电容器或电感器，其中任一个提供与网络上使用的终端用户设备的感测值不同但已经小于无穷远的已知感测值，使得系统感测何时结束 用户设备连接到网络或与网络断开连接。

公开(公告)号：US07948079B2

公开(公告)日：2011-05-24

申请号：US12549289

申请日：2009-08-27

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L29/40

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/142 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  Y10T428/31678 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.

Abstract translation: 公开了一种制造多层基板的混合结构的方法。 该方法包括以下步骤：将与相应电介质层的边界区连接的至少一个金属层的边界区域与相邻的金属层和相邻的电介质层分别用于每个多层基板并连接金属层的金属层的分离边界 一个多层基板，具有另一多层基板的金属层的分离边界区域，以形成连接部分。 所述混合结构至少包括第一多层基板和第二多层基板。 至少一个第一金属层与至少一个第二金属层连接以形成连接部分。

公开(公告)号：US20110107928A1

公开(公告)日：2011-05-12

申请号：US12957113

申请日：2010-11-30

Applicant: Dirk De Bruyker ,  JengPing Lu ,  Jürgen H. Daniel ,  Eugene M. Chow ,  Armin R. Völkel

Inventor： Dirk De Bruyker ,  JengPing Lu ,  Jürgen H. Daniel ,  Eugene M. Chow ,  Armin R. Völkel

IPC: B41M1/10

CPC classification number: B41M1/10 ,  B41M1/04 ,  B41M1/06 ,  H05K3/207 ,  H05K2201/091 ,  H05K2203/105

Abstract: A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.

Abstract translation: 打印表面包括在第一表面上具有锁定电极的基板，在基板的第一表面上的间隔层，图案化的间隔层以形成孔，使得锁定电极驻留在孔中，可变形的膜，该膜具有导电 区域，在间隔层上包围孔，每个封闭的井及其膜的相关区域形成像素膜，以及致动电路，用于致动电极，以使像素膜中选定的像素膜保持在偏转状态，当像素 膜受到冲击以返回到未偏转的状态。

公开(公告)号：US20100321916A1

公开(公告)日：2010-12-23

申请号：US12865433

申请日：2009-02-04

Applicant: Yasuhiro Yoshida

Inventor： Yasuhiro Yoshida

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/361 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/091 ,  H05K2201/10977 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T29/49126

Abstract: An FPC and another circuit board having terminals parts where a plurality of conductive interconnects are arranged are prepared. An adhesive film is arranged between the terminal part of the FPC and the terminal part of the circuit board to form a stack. A rigid head having a pushing face on which a plurality of convex parts are formed is used to hot-press the stack from the FPC side to soften the adhesive film and locally expel the softened adhesive film at the locations pressed by the convex parts of the rigid head.

Abstract translation: 制备FPC和具有布置多个导电互连件的端子部分的另一电路板。 在FPC的端子部分和电路板的端子部分之间布置粘合膜以形成叠层。 使用具有形成有多个凸部的推动面的刚性头部来从FPC侧热压堆叠，软化粘合膜，并且在被柔软的粘合剂膜压缩的位置处局部排出软化的粘合剂膜 刚性头。

公开(公告)号：US07832913B2

公开(公告)日：2010-11-16

申请号：US12101265

申请日：2008-04-11

Applicant: Vincent Biarne ,  Gérard Billot

Inventor： Vincent Biarne ,  Gérard Billot

IPC: B60Q1/00 ,  F21V29/00

CPC classification number: H05K1/189 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: A motor vehicle light comprising an equipped flexible electronic support that comprises: a flat flexible insulating support equipped on a first face with a plurality of flat conductive tracks; at least one light source of the light emitting diode type disposed on the first face of the flexible insulating support; wherein a second face of the flexible insulating support is covered with a layer of thermally conductive material for dissipating the heat produced by the light emitting diodes, the layer comprising an area of contact with the diode and an extended area extending out of this contact area, the dissipation of the heat taking place essentially at this extended area.

Abstract translation: 一种机动车辆灯，包括装备有柔性电子支架的机动车辆灯，其包括：安装在具有多个平坦导电轨道的第一面上的平坦柔性绝缘支撑件; 至少一个发光二极管类型的光源设置在柔性绝缘支撑件的第一面上; 其中所述柔性绝缘支撑件的第二面覆盖有导热材料层，以消散由所述发光二极管产生的热量，所述层包括与所述二极管接触的区域和延伸出所述接触区域的延伸区域， 热量的消散基本上在这个扩展区域。

公开(公告)号：US07806560B2

公开(公告)日：2010-10-05

申请号：US12499171

申请日：2009-07-08

Applicant: John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

Inventor： John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

IPC: F21V33/00

CPC classification number: H05K1/0203 ,  F21K9/00 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09363 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.

Abstract translation: 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。