公开(公告)号：US07768796B2

公开(公告)日：2010-08-03

申请号：US12147218

申请日：2008-06-26

Applicant: James W. Cady ,  Paul Goodwin

Inventor： James W. Cady ,  Paul Goodwin

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。

公开(公告)号：US07651336B2

公开(公告)日：2010-01-26

申请号：US11868947

申请日：2007-10-08

Applicant: Gary Yasumura ,  Joseph C. Fjelstad ,  William F. Wiedemann ,  Para K. Segaram ,  Kevin P. Grundy

Inventor： Gary Yasumura ,  Joseph C. Fjelstad ,  William F. Wiedemann ,  Para K. Segaram ,  Kevin P. Grundy

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/62 ,  H01R12/716 ,  H01R13/24 ,  H01R13/6587 ,  H05K1/142 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2203/167

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract translation: 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。

公开(公告)号：US07616452B2

公开(公告)日：2009-11-10

申请号：US11331969

申请日：2006-01-13

Applicant: James Douglas Wehrly, Jr. ,  Paul Goodwin ,  Russell Rapport

Inventor： James Douglas Wehrly, Jr. ,  Paul Goodwin ,  Russell Rapport

IPC: H05K1/11

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.

Abstract translation: 所提供的电路模块采用装有集成电路（IC）的灵活电路。 柔性电路围绕刚性衬底设置。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 柔性电路的应变消除部分优选地比柔性电路的布置集成电路的部分更少的层，并且还可以表现出比装有集成电路的柔性电路的部分更多的灵活性。 底物形式优选地由导热材料设计。

公开(公告)号：US07459784B2

公开(公告)日：2008-12-02

申请号：US11961477

申请日：2007-12-20

Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

公开(公告)号：US07394149B2

公开(公告)日：2008-07-01

申请号：US11715303

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01L23/02

CPC classification number: H05K1/189 ,  G06F1/183 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/2018

Abstract: A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.

Abstract translation: 低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。 或者，低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 被配置成与所述模块配合地配合的插座; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。

公开(公告)号：US07278855B2

公开(公告)日：2007-10-09

申请号：US11055579

申请日：2005-02-09

Applicant: Gary Yasumura ,  Joseph C. Fjelstad ,  William F. Wiedemann ,  Para K. Segaram ,  Kevin P. Grundy

Inventor： Gary Yasumura ,  Joseph C. Fjelstad ,  William F. Wiedemann ,  Para K. Segaram ,  Kevin P. Grundy

IPC: H01R12/00

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/62 ,  H01R12/716 ,  H01R13/24 ,  H01R13/6587 ,  H05K1/142 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2203/167

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract translation: 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。

公开(公告)号：US20070230139A1

公开(公告)日：2007-10-04

申请号：US11754211

申请日：2007-05-25

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H05K7/20

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The semiconductor module includes a heat spreader, two semiconductors that include circuitry, a termination resistor, an array of electrical contact points, and a plurality of electrically conductive leads. The semiconductors are thermally coupled to the heat spreader. The terminator resistor is electrically coupled to the circuitry of at least one of the semiconductors. The array of electrical contact points are coupled to the heat spreader. The conductive leads are electrically connected to the semiconductors and the array of electrical contact points. At least one of the leads is common to both of the semiconductors.

Abstract translation: 半导体模块包括散热器，包括电路的两个半导体，终端电阻器，电接触点阵列以及多个导电引线。 半导体热耦合到散热器。 终端电阻器电耦合到至少一个半导体的电路。 电触点阵列耦合到散热器。 导电引线电连接到半导体和电接触点阵列。 至少一个引线对于这两个半导体都是共同的。

公开(公告)号：US20070230134A1

公开(公告)日：2007-10-04

申请号：US11754212

申请日：2007-05-25

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H05K7/20

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The semiconductor module includes a heat spreader, first and second sets of two semiconductors that include circuitry and are thermally coupled to the heat spreader, first and second termination resistors, and first and second sets of electrically conductive leads. The first termination resistor is coupled to the circuitry at the first set of semiconductors, while the second termination resistor is coupled to the circuitry of the second set of semiconductors. The first set of leads connect to the first set of semiconductors and has at least one lead that is common to both of the semiconductors of the first set of semiconductors. The second set of leads connect to the second set of semiconductors and has at least one lead that is common to both of the semiconductors of the second set of semiconductors.

Abstract translation: 半导体模块包括散热器，包括电路的第一和第二组两个半导体，并且热耦合到散热器，第一和第二终端电阻器以及第一和第二组导电引线。 第一终端电阻器耦合到第一组半导体的电路，而第二终端电阻器耦合到第二组半导体的电路。 第一组引线连接到第一组半导体，并且具有至少一个与第一组半导体的半导体的半导体共同的引线。 第二组引线连接到第二组半导体，并且具有至少一个与第二组半导体的半导体的半导体共同的引线。

公开(公告)号：US20060261449A1

公开(公告)日：2006-11-23

申请号：US11131835

申请日：2005-05-18

Applicant: Russell Rapport ,  Paul Goodwin ,  James Cady

Inventor： Russell Rapport ,  Paul Goodwin ,  James Cady

IPC: H01L23/495

CPC classification number: H05K1/117 ,  G11C5/04 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4691 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

Abstract translation: 提供了一种电路模块，其中两个辅助基板或卡或刚性柔性组件的刚性部分填充有集成电路（IC）。 辅助基板与柔性电路连接。 柔性电路的一侧具有适于连接到边缘连接器的触点。 柔性电路围绕优选金属衬底的边缘缠绕，以将两个次要衬底中的一个设置在衬底的第一侧上，并且在衬底的第二侧上设置另一个辅助衬底。

公开(公告)号：US20060203442A1

公开(公告)日：2006-09-14

申请号：US11077952

申请日：2005-03-11

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: G06F1/16

CPC classification number: G11C5/04 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2203/1572

Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.