公开(公告)号：US06735857B2

公开(公告)日：2004-05-18

申请号：US09931003

申请日：2001-08-17

Applicant: Yuji Saito ,  Kozo Fukuzawa

Inventor： Yuji Saito ,  Kozo Fukuzawa

IPC: H05K330

CPC classification number: H05K1/0206 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0269 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49179 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of the through-hole upper lands; solder and solder paste are then melted by heating, causing them to flow into the through-holes and to wet and spread out upon the through-hole bottom face lands, thereby effecting a soldered joint with the BGA-side pads and through-hole upper lands securely attached, and forming solder fillets. In this way, the quality of the solder joints can be ascertained by an ordinary external inspection method.

Abstract translation: 将焊膏预先施加到印刷电路板的通孔上焊盘（或焊料）上，通过将焊接到BGA侧焊盘的焊料插入通孔上焊盘的孔来实现附着; 然后通过加热熔化焊料和焊膏，使其流入通孔，并在通孔底面焊盘上湿润并展开，从而实现与BGA侧焊盘和通孔上部的焊接接头 牢固连接，形成焊锡片。 以这种方式，可以通过普通的外部检查方法来确定焊点的质量。

公开(公告)号：US20040064942A1

公开(公告)日：2004-04-08

申请号：US10267158

申请日：2002-10-08

Inventor： C. Key Chung ,  Sook Chien Chan ,  Kum Foo Leong

IPC: H05K003/34

CPC classification number: H05K3/3436 ,  H05K1/113 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: Apparatus and methods providing for interconnecting a component to a substrate comprising one or more via-in-pad (VIP) interconnects is presented. In one embodiment in accordance with the invention, a first interconnect material is deposited on the VIP bond pad and into at least a portion of the VIP bore adjacent the bond pad. The substrate is subjected to a reflow process to form a plug of first reflowable interconnect material having a cap and a stem. The cap conforms to the bond pad and has a predetermined thickness and a diameter larger than the diameter of the bore. The stem conforms to the diameter of the bore and extends from the cap into the bore a predetermined distance. A component interconnect is coupled to the VIP bond pad and the cap using a second reflowable interconnect material having a reflow temperature lower than that of the first interconnect material. The plug remains in a solid form and effectively blocks the migration of the second reflowable interconnect material into the VIP bore.

Abstract translation: 提供了提供用于将组件互连到包括一个或多个通孔在内（VIP）互连的衬底的设备和方法。 在根据本发明的一个实施例中，第一互连材料沉积在VIP结合垫上并进入邻近接合垫的VIP孔的至少一部分中。 对衬底进行回流处理以形成具有盖和杆的第一可回流互连材料的插塞。 盖符合接合焊盘并具有预定的厚度和直径大于孔的直径。 杆符合孔的直径并从盖延伸到孔中预定的距离。 组件互连使用具有比第一互连材料的回流温度低的回流温度的第二可回流互连材料耦合到VIP接合焊盘和盖。 塞子保持固体形式并且有效地阻止第二可回流互连材料迁移到VIP孔中。

公开(公告)号：US06671176B1

公开(公告)日：2003-12-30

申请号：US10184357

申请日：2002-06-27

Applicant: Tina P. Barcley

Inventor： Tina P. Barcley

IPC: H05K720

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/114 ,  H05K3/0061 ,  H05K2201/09572 ,  H05K2201/09781 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A method of cooling heat-generating electrical components during service has a heat-removing element. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged ends. Heat absorbed by the heat-removing element is then transported to a heat sink, cooperatively associated therewith, for disposal. In an electrical assemblage, a circuit board contains multiple heat generating components each being associated with a heat-removing element of the invention.

Abstract translation: 在使用期间冷却发热电气部件的方法具有散热元件。 除热元件在其中包括多个通孔并且固定地附接到电气部件的尖端，通常在相对的带电端上。 然后将由除热元件吸收的热量输送到散热器，与散热器配合使用，以进行处理。 在电气组合中，电路板包含多个发热部件，每个发热部件与本发明的散热元件相关联。

公开(公告)号：US06659328B2

公开(公告)日：2003-12-09

申请号：US10017598

申请日：2001-12-18

Applicant: Robert J. Dances

Inventor： Robert J. Dances

IPC: B23K306

CPC classification number: H05K3/363 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/0061 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10666

Abstract: A method and apparatus for depositing solder paste on a printed wiring board has a stencil with a pattern of multiple apertures. The pattern aligns with a through-hole in the printed wiring board when the stencil is in physical contact with the printed wiring board. A squeegee arrangement applies solder paste through the multiple apertures in the stencil through the through-hole of the printed wiring board to the upper surface of the printed wiring board for securely mounting electronic components to the upper surface of the printed wiring board, for providing a thermal path for the heat sinks of the electronic components and for providing a low inductance electrical path to ground for the electrical components.

Abstract translation: 用于在印刷线路板上沉积焊膏的方法和装置具有具有多个孔的图案的模版。 当模板与印刷线路板物理接触时，图案与印刷线路板中的通孔对准。 刮板装置将焊膏通过印刷电路板的通孔穿过模板中的多个孔，到印刷电路板的上表面，用于将电子部件牢固地安装到印刷电路板的上表面，以提供 用于电子部件的散热器的热路径，并为电气部件提供低电感电路到地。

公开(公告)号：US06514845B1

公开(公告)日：2003-02-04

申请号：US09173128

申请日：1998-10-15

Applicant: Kian Teng Eng ,  Kok Chin Fong

Inventor： Kian Teng Eng ,  Kok Chin Fong

IPC: H01L2144

CPC classification number: H05K3/3478 ,  H05K1/112 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0379 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  Y02P70/613

Abstract: The invention is a method for attaching an electronic component (40) having Ball Grid Array contacts (36) to a circuit board contact array (31) to prevent the solder balls (36) of the Ball Grid Array from fracturing and distorting during solder reflow when the Ball grid Array contact (36) is attached to a contact (31) on a printed circuit board (30) that has a via (32) extending at least partially though the printed circuit board (30). A solder form (35) is placed over each via (32) in each contact (31) of the contact array. The electronic component (40) that has BGA contacts (36) is placed over the contact array (31) such that each ball (36) of the ball grid array of the electronic component resides on a solder form (35). The component (40) and circuit board (30) is subjected to a solder reflow process to seal the component (40) to the circuit board (30). The solder form (35) at least partially fills the via (32) preventing the BGA contact (36) from collapsing into the via (32).

Abstract translation: 本发明是一种用于将具有球栅阵列触点（36）的电子部件（40）连接到电路板接触阵列（31）以防止球栅阵列的焊球（36）在焊料回流期间破裂和变形的方法 当球栅阵列接触件（36）附接到印刷电路板（30）上的接触件（31）时，该印刷电路板（30）具有至少部分延伸穿过印刷电路板（30）的通孔（32）。 在接触阵列的每个触点（31）中的每个通孔（32）上放置焊料形式（35）。 具有BGA触点（36）的电子部件（40）被放置在接触阵列（31）上，使得电子部件的球栅阵列的每个球（36）驻留在焊料形式（35）上。 对组件（40）和电路板（30）进行焊料回流处理以将部件（40）密封到电路板（30）。 焊料形式（35）至少部分地填充通孔（32），防止BGA接触件（36）塌陷到通孔（32）中。

公开(公告)号：US20020175438A1

公开(公告)日：2002-11-28

申请号：US10191378

申请日：2002-07-08

Applicant: International Business Machines Corporation

Inventor： Peter A. Gruber ,  Frederic Maurer ,  Lubomyr Taras Romankiw

IPC: B29C045/14 ,  B29C045/63

CPC classification number: H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  H01L2924/00

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 nullm, and high aspect ratios, i.e., at least 5:1 to be filled with an electrically conductive material such as a solder or a conductive polymer such that vias or interconnects can be formed in electronic substrates. The present invention apparatus and method can be advantageously used in fabricating substrates for display panels by forming conductive vias and interconnects for placing a voltage potential on pixel display elements formed on the display panels.

Abstract translation: 公开了一种用于填充电子基板中的高纵横比孔的装置和方法，其可以有利地用于填充具有大于5:1的纵横比的孔。 在装置中，填充板和真空板与连接装置结合使用，使得在两个板之间形成间隙以容纳配备有高纵横比通孔的电子基板。 填充板配备有注入槽，而真空板配备有真空槽，使得当基板夹在其中时，通孔可以从空气排出并同时从液体的底侧和顶侧注入液体 底物。 本发明的新型装置和方法允许填充具有小直径，即小至10um，高纵横比，即至少5:1的通孔，以填充诸如焊料的导电材料 或导电聚合物，使得可以在电子基板中形成通孔或互连。 本发明的装置和方法可以有利地用于制造用于显示面板的基板，通过形成用于在形成在显示面板上的像素显示元件上放置电压电位的导电通孔和互连。

公开(公告)号：US20020171157A1

公开(公告)日：2002-11-21

申请号：US09880733

申请日：2001-06-13

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L023/48 ,  H01L029/40

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/10135 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81139 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 形成在半导体器件和衬底之间的接合部包括Cu等的金属球，Sn和金属球的化合物，金属球通过化合物结合在一起。

公开(公告)号：US06477052B1

公开(公告)日：2002-11-05

申请号：US09630221

申请日：2000-08-01

Applicant: Tina Barcley

Inventor： Tina Barcley

IPC: H05K720

CPC classification number: H05K1/0278 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/429 ,  H05K2201/0281 ,  H05K2201/09063 ,  H05K2201/09572 ,  H05K2201/0969 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/302

Abstract: A printed circuit board, containing thermal pads, is adhered to a rigidizer plate whereupon the entire unit can then be bent over itself to create a compact assembly which can be substantially smaller, but contain the same number of traces and electrical components, as an unbent printed circuit board of the same surface area. Further, a complete housing assembly is formed which is sealed on each edge of the rigidizer by inserting the edge into a panel with a groove. This assembly provides a secure fit that provides great stability with a relatively low weight and volume. The assembly also provides a better RF non-mechanical connection and much better thermal performance.

Abstract translation: 包含热垫的印刷电路板被粘附到刚性板上，随后整个单元可以自身弯曲，以形成一个紧凑的组件，其可以显着地更小，但是包含相同数量的迹线和电气部件 印刷电路板的表面积相同。 此外，通过将边缘插入具有凹槽的面板中，形成完整的壳体组件，其被密封在刚性化器的每个边缘上。 该组件提供了具有相对较低重量和体积的极好稳定性的安全配合。 该组件还提供更好的RF非机械连接和更好的热性能。

公开(公告)号：US06469486B1

公开(公告)日：2002-10-22

申请号：US09542068

申请日：2000-04-03

Applicant: Ionel Jitaru

Inventor： Ionel Jitaru

IPC: H01F2742

CPC classification number: H05K1/165 ,  H01F27/06 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/05 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09572 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49165

Abstract: A transformer group in which a multitude of transformers are used to supply energy to a single load. The transformers are connected in series; in order to assist in providing a “flux equalizing” affect, the invention includes a flux equalizer circuit. The flux equalizer circuit provides a series of flux windings. Each flux winding is associated with a single transformer. The windings are arranged in parallel. In this manner, a balancing of the output of the transformers is obtained; the power output from each transformer is “sensed” by its associated flux winding which is “shared” with the other transformers via their own associated flux winding. Power is process then through the secondary windings, rectifiers, and output filters to a common load.

Abstract translation: 一个变压器组，其中使用多个变压器向单个负载提供能量。 变压器串联连接; 为了帮助提供“通量均衡”的影响，本发明包括一个通量均衡器电路。 通量均衡器电路提供一系列磁通绕组。 每个磁通绕组与单个变压器相关联。 绕组平行布置。 以这种方式，获得变压器的输出的平衡; 来自每个变压器的功率输出由其相关联的磁通绕组“感测”，其通过其自身的相关磁通绕组与其它变压器“共享”。 电源通过次级绕组，整流器和输出滤波器到达共同的负载。

公开(公告)号：US06469255B2

公开(公告)日：2002-10-22

申请号：US09855771

申请日：2001-05-16

Applicant: Yoshio Watanabe ,  Toru Takebe ,  Mayumi Kosemura

Inventor： Yoshio Watanabe ,  Toru Takebe ,  Mayumi Kosemura

IPC: H05K100

CPC classification number: H01L23/49805 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/321 ,  H05K3/361 ,  H05K3/363 ,  H05K3/403 ,  H05K3/42 ,  H05K3/4623 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09572 ,  Y10T428/24917 ,  H01L2924/00

Abstract: There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane.

Abstract translation: 提供占用空间小，价格低的复合布线板及其制造方法; 所述复合布线板包括形成有连接部的端面上的至少两个刚性布线板，其中每个刚性布线板布置成使得每个连接部分位于平面上，并且每个相应的连接部分是 在飞机上相互连接。