公开(公告)号：US07061094B2

公开(公告)日：2006-06-13

申请号：US11035953

申请日：2005-01-18

Applicant: Eiji Takahashi ,  Takeshi Nakayama

Inventor： Eiji Takahashi ,  Takeshi Nakayama

IPC: H01L23/52 ,  H01L23/12 ,  H05K3/46 ,  H01P5/02

CPC classification number: H05K1/0224 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K1/0237 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/0969 ,  H01L2924/00

Abstract: A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as to straddle the gap portion and so as to be substantially parallel to each other. The multilayer PCB also includes at least one ground trace provided between the at least two signal traces and on the top face of the substrate so as to straddle the gap portion.

Abstract translation: 多层印刷电路板（PCB）包括基板; 具有限定间隙部分的边缘的接地层，所述接地层设置在所述基板的底面上; 和至少两条信号迹线，并且设置在基板的顶面上，以跨越间隙部分并且基本上彼此平行。 所述多层PCB还包括至少一个设置在所述至少两个信号迹线之间并且在所述基板的顶面上的接地迹线，以跨越所述间隙部分。

公开(公告)号：US20060057889A1

公开(公告)日：2006-03-16

申请号：US11023489

申请日：2004-12-29

Applicant: Akiyoshi Saitou

Inventor： Akiyoshi Saitou

IPC: H01R13/66

CPC classification number: H05K1/0233 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/18 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: A printed circuit board has separate first, second and third sections arranged in a predetermined direction. A connector is mounted at the first section. A noise cut filter is mounted at the second section and connected to the connector. An electronic circuit component is mounted at the third section and connected to the noise cut filter. An electrically conductive power source layer is formed within the printed circuit board at a position outside a peripheral section adjacent the second section. The noise cut filter is allowed to operate without receiving any influence of noise from the power source layer. Noise is sufficiently removed at the noise cut filter. Noise is suppressed to the utmost in electric signals in the connector. Radiation of noise is reliably reduced at the connector. Electromagnetic interference can be suppressed.

Abstract translation: 印刷电路板具有沿预定方向布置的单独的第一，第二和第三部分。 连接器安装在第一部分。 噪声截止滤波器安装在第二部分并连接到连接器。 电子电路部件安装在第三部分并连接到噪声截止滤波器。 在印刷电路板的与第二部分相邻的周边部分外的位置处形成导电电源层。 允许噪声抑制滤波器工作，而不会受到来自电源层的噪声的任何影响。 噪声在噪音截止滤波器上被充分去除。 连接器中的电信号最大限度地抑制噪声。 连接器可靠地降低噪声辐射。 可以抑制电磁干扰。

公开(公告)号：US20060043572A1

公开(公告)日：2006-03-02

申请号：US10927134

申请日：2004-08-27

Applicant: Yasuhiro Sugimoto ,  Kazunaga Higo ,  Kazuhiro Suzuki

Inventor： Yasuhiro Sugimoto ,  Kazunaga Higo ,  Kazuhiro Suzuki

IPC: H01L29/40

CPC classification number: H01L23/66 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z0; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an interaxis distance between said signal through-hole conductor and said shield through-hole conductor is adjusted as defined herein.

Abstract translation: 一种布线板，包括：板芯，具有第一主表面和第二主表面; 包括导体线的导体层; 电介质层与所述导体层交替地层叠在所述第一和第二主表面中的至少一个上; 通孔导体; 如本文所定义的信号通孔; 如本文所定义的信号通孔导体; 如本文所定义的第一路径端垫; 如本文所定义的第二路径端垫; 如本文所定义的屏蔽通孔; 和如本文所定义的屏蔽通孔导体; 其中：如本文所定义的形成信号传输路径; 所述导体层中的至少一个设置在所述第一和第二主表面侧的每一个上; 所述第一主表面侧的所述表面导体和所述导体线形成具有恒定特性阻抗Z0的带状线，微带线或共面波导; 所述屏蔽通孔的内表面被所述屏蔽通孔导体覆盖; 并且如本文所定义的那样调节所述信号通孔导体和所述屏蔽通孔导体之间的间隔距离。

公开(公告)号：US06998291B2

公开(公告)日：2006-02-14

申请号：US10859639

申请日：2004-06-03

Applicant: Shigetsugu Muramatsu ,  Tohru Hizume

Inventor： Shigetsugu Muramatsu ,  Tohru Hizume

IPC: H01L21/44

CPC classification number: H05K3/4644 ,  H05K3/005 ,  H05K3/421 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0108 ,  H05K2203/1189

Abstract: A wiring board is disclosed that includes a first insulating layer, a conductor which is formed on a surface of the first insulating layer, and a second insulating layer which is formed on surfaces of the first insulating layer and of the conductor. The wiring board is provided with a semispherical-shaped or conical-shaped hole-forming portion which penetrates through the second insulating layer into the conductor.

Abstract translation: 公开了一种布线板，其包括第一绝缘层，形成在第一绝缘层的表面上的导体和形成在第一绝缘层和导体的表面上的第二绝缘层。 布线板设置有半球形或圆锥形的孔形成部分，其穿过第二绝缘层进入导体。

公开(公告)号：US20060027393A1

公开(公告)日：2006-02-09

申请号：US11195965

申请日：2005-08-03

Applicant: Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

Inventor： Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

IPC: H05K1/00 ,  C25D5/02

CPC classification number: H05K3/242 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/0969

Abstract: The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.

Abstract translation: 本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。 本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。 每个区域1A具有部分完成的布线电路板10。 部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。 在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。 在金属片1中，在引线13下面的部分中形成开口16。

公开(公告)号：US20060023364A1

公开(公告)日：2006-02-02

申请号：US10992836

申请日：2004-11-22

Applicant: Takeshi Ohwe

Inventor： Takeshi Ohwe

IPC: G11B5/48 ,  G11B21/16

CPC classification number: H05K3/361 ,  G11B5/4846 ,  G11B5/486 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0285

Abstract: A head supporting mechanism having a structure for connecting a first end of a suspension side wire, the other end thereof being connected to a magnetic head of a disk apparatus, to a circuit of a disk device via a flexible circuit board is provided, without using solder containing lead so that the both are easily disconnected during repair. A tail terminal (2) provided at the one end of the suspension side wire is disposed to be in surface-contact with a bonding pad (1) of the flexible circuit board (10) and bonded to the latter via a gold ball (6).

Abstract translation: 一种头部支撑机构，其具有用于将悬挂侧线的第一端（其另一端连接到盘装置的磁头）经由柔性电路板连接到盘装置的电路的结构，而不使用 包含铅的焊料使得两者在维修期间容易断开。 设置在悬挂侧线的一端的尾端子（2）设置成与柔性电路板（10）的接合焊盘（1）表面接触，并通过金球（6）与其接合 ）。

公开(公告)号：US20060000636A1

公开(公告)日：2006-01-05

申请号：US10882167

申请日：2004-07-02

Applicant: John Lauffer ,  James Larnerd ,  Voya Markovich

Inventor： John Lauffer ,  James Larnerd ,  Voya Markovich

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

Abstract: A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.

Abstract translation: 电路化基板，其包括多个邻接的开放段，其在导电层内限定面对的边缘部分，以隔离导电层的分离部分，使得该层可用于不同的功能，例如功率和接地元件内部的功能和接地元件 包括基板作为其一部分的产品（例如，电气组件）。 还提供了制造衬底的方法，利用衬底的电组件，还利用衬底的多层电路化组件和诸如主机的信息处理系统。

公开(公告)号：US06982386B2

公开(公告)日：2006-01-03

申请号：US10267080

申请日：2002-10-07

Applicant: Syed Sajid Ahmad

Inventor： Syed Sajid Ahmad

IPC: H05K1/16 ,  H01L23/053

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/06136 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0272 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2203/1178 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of making and using such interconnecting substrates. In one aspect of the invention, an interconnecting substrate comprises a first external layer having a first external surface, a second external layer having a second external surface, and a conductive core between the first and second external layers. The conductive core can have at least a first conductive stratum between the first and second external layers, and a dielectric layer between the first conductive stratum and one of the first or second external layers. The conductive core can also include a second conductive stratum such that the first conductive stratum is on a first surface of the dielectric layer and the second conductive stratum is on a second surface of the dielectric layer. The interconnecting substrate also has at least one vent through at least one of the first conductive stratum, the second conductive stratum, and/or the dielectric layer. The vent is configured to direct moisture away from the dielectric layer, and thus the vent can be a moisture release element that allows moisture to escape from the dielectric layer during high temperature processing.

公开(公告)号：US20050276030A1

公开(公告)日：2005-12-15

申请号：US10864958

申请日：2004-06-10

Applicant: Kok-Siang Ng ,  King Wong ,  Michael Ryan

Inventor： Kok-Siang Ng ,  King Wong ,  Michael Ryan

IPC: H05K1/02 ,  H05K7/06

CPC classification number: H05K1/0245 ,  H05K1/0224 ,  H05K1/0237 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/09681 ,  H05K2201/0969 ,  Y10T29/49155

Abstract: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.

Abstract translation: 这里描述了具有参考层开口以有助于实现电路中的差分阻抗的部件。

公开(公告)号：US20050257952A1

公开(公告)日：2005-11-24

申请号：US11131341

申请日：2005-05-18

Applicant: Shinji Morimoto ,  Koji Nakashima ,  Toyokazu Yoshino ,  Katsuya Okamoto

Inventor： Shinji Morimoto ,  Koji Nakashima ,  Toyokazu Yoshino ,  Katsuya Okamoto

IPC: H05K1/03 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K3/363 ,  H05K3/281 ,  H05K3/3452 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0215 ,  H05K2201/0305 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/09909 ,  H05K2203/0278 ,  H05K2203/058

Abstract: A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.

Abstract translation: 柔性印刷布线板具有这样的构造，该构造配备有通过使用丝网印刷法在包括导体图案的部件安装部分的区域上涂覆而形成的阻焊部分和以这种方式粘贴的覆盖膜 开口部分的外周部分与阻焊部分的周边部分的上部重叠。本发明的柔性印刷电路板的制造方法具有配置有导体图案形成工艺，阻焊剂 成型工艺和覆盖薄膜粘贴工艺。