公开(公告)号：US20180295713A1

公开(公告)日：2018-10-11

申请号：US16003626

申请日：2018-06-08

Applicant: Laird Technologies, Inc.

Inventor： John SONG ,  George William RHYNE

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

公开(公告)号：US20180269610A1

公开(公告)日：2018-09-20

申请号：US15921671

申请日：2018-03-15

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： SHUO-HSIU HSU

IPC: H01R12/79 ,  H05K1/18 ,  H05K1/02 ,  H04B1/40

CPC classification number: H01R12/79 ,  H04B1/3888 ,  H04B1/40 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: A connector assembly having two ends respectively connected to a case and a main circuit board comprises a bracket, a bottom plate assembled on the bottom of the bracket and a flexible circuit board located between the bracket and the bottom plate. The bracket includes a mating surface attached to the case, a mounting surface opposite the mating surface, and a receiving cavity recessed inwardly from the mounting surface. The bracket includes a pair of openings extending through the mating surface thereof and communicating with the receiving cavity. A pair of chip modules are disposed on the flexible circuit board corresponding to the openings. One side of the flexible circuit board, which is farther away from the bracket, includes an electrical connector for mating with the main circuit board.

公开(公告)号：US10070524B2

公开(公告)日：2018-09-04

申请号：US13442092

申请日：2012-04-09

Applicant: Qing Ma ,  Quan A. Tran ,  Robert L. Sankman ,  Johanna M. Swan ,  Valluri R. Rao

Inventor： Qing Ma ,  Quan A. Tran ,  Robert L. Sankman ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H01R43/00 ,  H05K1/11 ,  H01L21/48 ,  H01L23/367 ,  H01L23/498 ,  H05K3/46 ,  H01L23/15 ,  H05K3/00

CPC classification number: H05K1/112 ,  H01L21/4803 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/10253 ,  H05K3/0014 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10674 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

公开(公告)号：US20180220539A1

公开(公告)日：2018-08-02

申请号：US15747569

申请日：2016-08-05

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Yujiro KANEKO ,  Yoshio KAWAI

IPC: H05K5/00 ,  B60R16/02 ,  H05K1/18 ,  H05K5/06 ,  H05K7/20 ,  H05K9/00 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K5/0017 ,  B60R16/02 ,  H01L23/29 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/181 ,  H05K3/28 ,  H05K3/284 ,  H05K5/00 ,  H05K5/0034 ,  H05K5/065 ,  H05K7/14 ,  H05K7/20 ,  H05K7/20409 ,  H05K7/20854 ,  H05K7/209 ,  H05K9/00 ,  H05K9/0007 ,  H05K9/0084 ,  H05K2201/10075 ,  H05K2201/10371 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Providing an electronic control device excellent in electromagnetic shielding property with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin that seals the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin. The housing case consists of: a heat sink portion a portion of which is exposed from the sealing resin to dissipate heat of the inside of the sealing resin; an electromagnetic shield unit that shields electromagnetic noise by covering the electronic component; and a fixing portion exposed from the sealing resin to achieve fixation to a vehicle body.

公开(公告)号：US20180168076A1

公开(公告)日：2018-06-14

申请号：US15859951

申请日：2018-01-02

Applicant: Laird Technologies, Inc.

Inventor： Kuo Chun Chao ,  Mohammadali Khorrami ,  Paul Francis Dixon

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K9/0022 ,  H05K1/0216 ,  H05K1/028 ,  H05K1/181 ,  H05K3/303 ,  H05K9/009 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2203/1311

Abstract: According to various aspects, exemplary embodiments are disclosed of stretchable and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield generally includes a stretchable and/or flexible shielding layer including a first side and a second side. One or more adhesion and/or dielectric layers are along at least the first side and/or the second side of the stretchable and/or flexible shielding layer.

公开(公告)号：US09999165B2

公开(公告)日：2018-06-12

申请号：US15222906

申请日：2016-07-28

Applicant: Samsung Electronics Co., Ltd

Inventor： Jae Myung Cho ,  Kyunghan Kim ,  Chijoon Kim ,  Sukhyun Lee

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0026 ,  H05K1/0216 ,  H05K1/181 ,  H05K2201/10371

Abstract: According to various embodiments, there may be provided an electronic device including a Printed Circuit Board (PCB), at least one electronic component mounted in a shielding area of the PCB, and a shield cover formed of a metal material and fixed to an upper surface of the PCB to shield the shielding area. The shield cover may include an upper surface including a first plate and a second plate configured to be extended along a boundary of the first plate, a lateral surface which is configured to have a constant height along a boundary of the second plate, and an open portion configured to be exposed to up to one area of the first plate through the second plate from the lateral surface. An exposed area of the first plate may be exposed to a notch-shaped space configured to be more inwardly recessed than a virtual extension line of an outer boundary of the second plate in the open portion. Other various embodiments may also be possible.

公开(公告)号：US09999122B2

公开(公告)日：2018-06-12

申请号：US15783191

申请日：2017-10-13

Applicant: Laird Technologies, Inc.

Inventor： John Song ,  George William Rhyne

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K1/14

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

公开(公告)号：US09980381B2

公开(公告)日：2018-05-22

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： Seng Huan Chuah ,  Friedrich Josef Bollmann ,  Khai Jin Choo ,  Weng Kong Hor ,  Sih Hau Tan

IPC: H05K1/11 ,  H05K1/14 ,  H04M1/02 ,  H05K5/06 ,  H05K1/02

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

公开(公告)号：US09968004B2

公开(公告)日：2018-05-08

申请号：US15271635

申请日：2016-09-21

Applicant: LAIRD TECHNOLOGIES, INC.

Inventor： Mohammadali Khorrami ,  Paul Francis Dixon

IPC: H05K7/20 ,  H05K1/02 ,  H01P1/201 ,  H05K9/00 ,  H01L23/34 ,  H01P3/12

CPC classification number: H05K7/2039 ,  H01L23/34 ,  H01L23/3737 ,  H01P1/201 ,  H01P3/12 ,  H05K1/0203 ,  H05K1/0216 ,  H05K9/0032 ,  H05K9/0081 ,  H05K2201/10371

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.

公开(公告)号：US09961819B2

公开(公告)日：2018-05-01

申请号：US15107373

申请日：2015-03-04

Applicant: HUAWEI DEVICE (DONGGUAN) CO., LTD.

Inventor： Fuqiang Ma ,  Haixing Ding

IPC: B29C65/54 ,  B32B37/12 ,  B32B43/00 ,  H05K13/04 ,  H05K9/00 ,  H05K3/30 ,  H05K5/06

CPC classification number: H05K13/0469 ,  H05K3/30 ,  H05K3/321 ,  H05K5/064 ,  H05K9/0028 ,  H05K2201/10371

Abstract: An auxiliary adhesive dispensing apparatus is connected to a printed circuit board (PCB) through an opening on a side surface of a shielding cover above the PCB, and the auxiliary adhesive dispensing apparatus includes a flow guiding groove, an adhesive-injection opening connected to an end of the flow guiding groove, and a fixing part connecting the flow guiding groove and the PCB. The auxiliary adhesive dispensing apparatus is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing.