公开(公告)号：US20030176021A1

公开(公告)日：2003-09-18

申请号：US10436939

申请日：2003-05-13

Inventor： Ford B. Grigg

IPC: H01L021/44

CPC classification number: G03F7/70416 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/4839 ,  H01L21/67132 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/86 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/85424 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0393 ,  H05K3/0023 ,  H05K3/0097 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1545 ,  Y02P80/30 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Stiffeners for tapes, films, or other connective structures, which are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes, are fabricated by stereolithographic processes and may include one or two or more layers. The stiffeners are configured to prevent torsional flexion or bending of the connective structure to which they are to be secured. The stiffeners may reinforce sprocket or indexing holes in connective structures. The stiffeners may include apertures through which intermediate conductive elements or other structures secured to the connective structure may be exposed or protrude. The stereolithographic method for fabricating stiffeners may include use of a machine vision system that recognizes the position and orientation of one or more connective structures on which at least an element of each of the stiffeners is to be fabricated so that the application of material thereto may be controlled.

Abstract translation: 通过立体光刻工艺制造通过胶带自动化粘合方法将用于胶带，薄膜或其它连接结构的用于固定到半导体器件部件（例如半导体管芯或基底）上的加强件，并且可以包括一个或两个或 多层 加强件被构造成防止其固定到的连接结构的扭转弯曲或弯曲。 加强件可以加强连结结构中的链轮或分度孔。 加强件可以包括孔，通过该孔可以将固定到连接结构的中间导电元件或其它结构暴露或突出。 用于制造加强件的立体光刻方法可以包括使用机器视觉系统，其识别一个或多个连接结构的位置和取向，在该结构结构上，要制造每个加强件的至少一个元件，使得其上的材料的施加可以是 受控。

公开(公告)号：US20030116350A1

公开(公告)日：2003-06-26

申请号：US10023651

申请日：2001-12-21

Applicant: SONY CHEMICALS CORP.

Inventor： Yutaka Kaneda

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H05K3/20 ,  H05K1/0271 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09354 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09881 ,  H05K2201/2009 ,  H05K2203/0369 ,  H05K2203/0759 ,  H05K2203/1476 ,  H05K2203/167

Abstract: A process for manufacturing a flexible wiring board with easy handling at reduced production costs comprises the steps of forming a first wiring pattern and a guide pattern around the outer periphery of the first wiring pattern on a copper foil, and forming an insulating film on the first wiring pattern and guide pattern.

Abstract translation: 制造易于处理的柔性布线板的制造方法包括以下步骤：在铜箔上形成第一布线图案周围的第一布线图案和引导图案，并在第一布线图案上形成绝缘膜 布线图案和导向图案。

公开(公告)号：US20030039101A1

公开(公告)日：2003-02-27

申请号：US10217415

申请日：2002-08-14

Applicant: TDK Corporation

Inventor： Minoru Takaya ,  Toshikazu Endo

IPC: H05K007/00

CPC classification number: H05K1/0366 ,  H01L2224/97 ,  H05K1/0271 ,  H05K1/036 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/061 ,  H05K2203/065

Abstract: The present invention relates to a module component for which degradation of electrical properties caused by absorption of moisture in the air can be prevented. An intermediate layer comprises a first layer, a second layer and a core layer. The core layer comprises a material having a higher strength than the first layer and the second layer, has a network structure that extends out in planar fashion, has an outer periphery thereof positioned further to the inside than the outer peripheries of the first layer and the second layer, and is sealed between the first layer and the second layer. An upper layer is laminated on the upper surface of the intermediate layer. A lower layer is laminated on the lower surface of the intermediate layer. Mounted components are mounted on any one of the upper layer and the lower layer.

Abstract translation: 本发明涉及一种可以防止由吸收空气中的水分引起的电性能降低的模块部件。 中间层包括第一层，第二层和芯层。 芯层包括具有比第一层和第二层更高的强度的材料，具有以平面方式延伸出的网状结构，其外周比第一层的外周更位于内侧，并且 第二层，并且密封在第一层和第二层之间。 上层被层叠在中间层的上表面上。 下层层压在中间层的下表面上。 安装的部件安装在上层和下层中的任何一个上。

公开(公告)号：US06512678B2

公开(公告)日：2003-01-28

申请号：US09823870

申请日：2001-03-30

Applicant: Rob W. Sims ,  Uppalapati V. Ramgopal ,  Ronald C. Flamm ,  Michael Z. Eckblad

Inventor： Rob W. Sims ,  Uppalapati V. Ramgopal ,  Ronald C. Flamm ,  Michael Z. Eckblad

IPC: H05K700

CPC classification number: H05K1/0271 ,  H05K1/18 ,  H05K7/1461 ,  H05K2201/2009

Abstract: An apparatus, and method for using same, is described for a distributed load board stiffener. The apparatus may include a body having a central axis portion and multiple protusions extending away from the central axis portion towards respective ends. Each of the ends of the protrusions having a mounting point to mount a printed circuit board to a chassis support. The protrusions may operate to mount the board stiffener to a printed circuit board away from trace routing areas disposed centrally on the printed circuit board. The protrusions may operate to distribute a load around a periphery of the printed circuit board.

Abstract translation: 对于分布式负载板加强件描述了一种装置及其使用方法。 该装置可以包括具有中心轴部分和多个突起的主体，所述多个突起远离中心轴部分朝向相应的端部延伸。 突起的每个端部具有将印刷电路板安装到底架支架的安装点。 突起可以操作以将板加强件安装到印刷电路板上，远离布置在印刷电路板中心的迹线路由区域。 突起可以操作以将负载分布在印刷电路板的周边周围。

公开(公告)号：US06492698B2

公开(公告)日：2002-12-10

申请号：US09739530

申请日：2000-12-15

Applicant: Brian H. Kim ,  James-Yu Chang

Inventor： Brian H. Kim ,  James-Yu Chang

IPC: H01L3100

CPC classification number: H05K1/189 ,  G02B6/4201 ,  G02B6/4249 ,  G02B6/4292 ,  H01L23/5387 ,  H01L31/0203 ,  H01L31/024 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/2009 ,  H01L2924/00

Abstract: Packaging for components of an optical module. The packaging includes a flexible circuit coupled to two stiffeners. The packaging has a first sub-assembly with the first stiffener for receiving a first component. The packaging also has a second sub-assembly with the second stiffener for receiving a second component and for coupling to an external circuit. The packaging has a flexible portion with a first end for coupling to the first sub-assembly and a second end for coupling to the second sub-assembly. The flexible portion allows the first sub-assembly to be oriented with respect to the second sub-assembly to form an angle that is greater than zero degrees and less than 180 degrees.

Abstract translation: 包装光学模块的组件。 该包装包括耦合到两个加强件的柔性电路。 包装具有第一子组件，第一子组件具有用于接收第一组件的第一加强件。 该包装还具有第二子组件，第二加强件用于接收第二部件并用于耦合到外部电路。 该包装具有柔性部分，其具有用于联接到第一子组件的第一端和用于联接到第二子组件的第二端。 柔性部分允许第一子组件相对于第二子组件定向以形成大于零度且小于180度的角度。

公开(公告)号：US06260265B1

公开(公告)日：2001-07-17

申请号：US09552277

申请日：2000-04-19

Applicant: Charles D. Kownacki ,  Paul M. Deters

Inventor： Charles D. Kownacki ,  Paul M. Deters

IPC: H05K302

CPC classification number: H05K1/0271 ,  H05K1/18 ,  H05K7/1461 ,  H05K2201/10598 ,  H05K2201/2009 ,  Y10T29/49155 ,  Y10T29/49815 ,  Y10T29/4995 ,  Y10T428/12201

Abstract: A rigid bar of material is fastened to a circuit board to increase its stiffness. The bar is preferably a high modulus plastic such as liquid crystal polymer. Flexible fingers which surround a central opening are formed integrally with the bar and pop into throughbores in the circuit board. Each finger has at least one arcuate protrusion and, preferably several, which can engage the bottom of the circuit board. A rigid pin which may be made of steel is slid into the central opening and has an interference fit therewith to hold it in place to prevent flexible fingers from moving inwardly so the stiffener is held fast to the circuit board. In one embodiment, the stiffener has an I-beam cross section and arches enhancing the resistance to bending.

Abstract translation: 刚性的材料条被紧固到电路板以增加其刚度。 该棒优选为高模量塑料，例如液晶聚合物。 围绕中心开口的柔性指状物与棒一体地形成并流入电路板中的通孔中。 每个手指具有至少一个弓形突起，并且优选几个，其可接合电路板的底部。 可以由钢制成的刚性销滑入中心开口并与其配合，以将其保持在适当的位置，以防止柔性指状物向内移动，使得加强件被快速地保持在电路板上。 在一个实施例中，加强件具有I形梁横截面和拱形，增强了抗弯曲性。

公开(公告)号：US06239372B1

公开(公告)日：2001-05-29

申请号：US09085231

申请日：1998-05-27

Applicant: Bernhard Gartner ,  Matthias Schnell ,  Joerg Wolke ,  Peter Schaefer ,  Hans-Erich Steinmann ,  Guenter Trogisch

Inventor： Bernhard Gartner ,  Matthias Schnell ,  Joerg Wolke ,  Peter Schaefer ,  Hans-Erich Steinmann ,  Guenter Trogisch

IPC: H02G1502

CPC classification number: B81B7/007 ,  B81B7/0006 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0195 ,  H05K2201/057 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: An electrical connection in which a flexible, elastic conductor track carrier is affixed by a connecting end to an electrical component and embedded in potting compound. To prevent breakage at the fastening point at the transition from the potting compound to the outside, the conductor track carrier is reinforced with additional layers of insulating material.

Abstract translation: 一种电连接，其中柔性弹性导体轨道载体通过连接端固定到电气部件并嵌入灌封混合物中。 为了防止在从灌封化合物到外部的过渡处的紧固点处的断裂，导体轨道载体被附加的绝缘材料层增强。

公开(公告)号：US06169254A

公开(公告)日：2001-01-02

申请号：US08277847

申请日：1994-07-20

Applicant: Bharat B. Pant ,  Richard K. Spielberger

Inventor： Bharat B. Pant ,  Richard K. Spielberger

IPC: H05K100

CPC classification number: H05K1/189 ,  G01R33/0206 ,  H01L23/5387 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/05 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10151 ,  H05K2201/2009 ,  H05K2203/302 ,  H01L2924/00014

Abstract: Apparatus for mounting and making electrical connections to sensor devices for use in three axis sensing including a flexible circuit and a substrate shaped so that when a portion of the flexible tape is secured to the substrate the sensor devices can be mounted on the substrate for sensing in the desired three directions. The sensors are connected to conductors in the flexible tape by wirebonds or by other means.

Abstract translation: 用于安装和连接到用于三轴感测的传感器装置的电连接的装置，包括柔性电路和成形的基板，使得当柔性带的一部分固定到基板上时，传感器装置可以安装在基板上以感测 所需的三个方向。 传感器通过引线键或通过其他方式连接到柔性带中的导体。

公开(公告)号：US6150614A

公开(公告)日：2000-11-21

申请号：US125183

申请日：1998-08-12

Applicant: Bernhard Miller ,  Friedbert Roether ,  Norbert Schneider

Inventor： Bernhard Miller ,  Friedbert Roether ,  Norbert Schneider

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/118 ,  H05K1/0215 ,  H05K1/0281 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K3/0058 ,  H05K3/3447

Abstract: In a conductor foil for conductively connecting electrical and/or electronic components, the conductor foil including printed circuit traces, insulated to the outside and applied on a non-conductive, elastically malleable carrier foil. The conductive foil also includes soldering surfaces connected to the printed circuit traces, for soldering to electric terminals of components, in addition, the conductor foil includes feed line segments through which the printed circuit traces are led to the soldering surfaces, in order, in response to shaking stresses, to avoid damage to the soldering points by vibrations transmitted by the feed line segments. Furthermore, the conductor foil has stiffening segments branching off from the feed line segments, the stiffening segments, in response to shaking stresses, causing a force diversion of the vibrations onto the stiffening segments via the feed line segment movable end, which is not connected to the soldering surfaces.

Abstract translation: PCT No.PCT / DE97 / 01995 Sec。 371日期1998年8月12日 102（e）1998年8月12日PCT PCT 1997年9月9日PCT公布。 WO98 / 28956 PCT公开号 日期1998年7月2日在用于导电连接电气和/或电子部件的导体箔中，导体箔包括印刷电路迹线，绝缘到外部并施加在不导电的，弹性可延展的载体箔上。 导电箔还包括连接到印刷电路迹线的焊接表面，用于焊接到部件的电端子，此外，导体箔包括馈送线段，印刷电路迹线通过引线段引导到焊接表面，以响应 振动应力，以避免由馈电线段传播的振动损坏焊接点。 此外，导体箔具有从进料线段分支出的加强段，加强段响应于振动应力，引起通过馈送线段可移动端将振动转移到加强段上的力，其不连接到 焊接面。

公开(公告)号：US6083039A

公开(公告)日：2000-07-04

申请号：US87697

申请日：1998-06-01

Applicant: Michael Santos Finona

Inventor： Michael Santos Finona

IPC: H01R43/24 ,  H05K1/00 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H01R12/24

CPC classification number: H05K1/117 ,  H01R43/24 ,  H01R12/62 ,  H05K1/0284 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10356 ,  H05K2201/10424 ,  H05K2201/2009 ,  H05K3/301 ,  H05K3/3405

Abstract: Apparatus is provided for connecting the rear termination ends (32, 34) of connector contacts (12, 14) to wires (42, 44) of a cable (40) in a design where the solder connections are encased in molded plastic, which maintains the contacts so their axes (20, 22) extend precisely along forward-rearward directions. This is accomplished by providing a mold with an alignment mold part (110) with holders (114, 120) that either directly engage shoulders (160, 162) of the contacts or that engage shoulders (140, 142) formed on a circuit board (54) with holes (62) that closely receive rear termination ends (32) of a contact.

Abstract translation: 提供了用于将连接器触头（12,14）的后端接端（32,34）连接到电缆（40）的导线（42,44）的设备，其中焊料连接被封装在模塑塑料中，该模制塑料保持 触点使得它们的轴线（20,22）沿前后方向精确地延伸。 这通过为模具提供具有保持器（114,120）的对准模具部件（110）来实现，所述保持器直接接合触头的肩部（160,162）或接合形成在电路板上的肩部（140,142） 54），其具有紧密接收触点的后端接端（32）的孔（62）。