Abstract:
A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
Abstract:
A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.
Abstract:
Provided are a method and a system for designing an embedded system using a design process for building a general-purpose computer. Specifically, the embedded system design includes adding and removing add-on cards as needed during the development of the embedded system design. The add-on cards are easily obtainable and connect to a circuit board of the embedded system by selecting lines originating from the circuit board. The lines not selected are passed on to other add-on cards connected to previously connected add-on cards. After all the lines from the circuit board are either selected to connect to logic of the add-on cards or remain unselected, information regarding the add-on cards are used to generate a configuration image. The configuration image is transmitted to a programmable processor of the circuit board to enable communication on the selected lines, thus permitting the embedded system to function.
Abstract:
A testing apparatus, system and method for testing computer memory modules are disclosed. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.
Abstract:
A multi-pin connector for connecting a signal line on a backboard side and a signal line on a daughter board side has open pins where the signal lines are not connected. In order to prevent transmission loss on the signal lines caused by these open pins, terminating resistances are connected to both ends of the open pins, and ends of the terminating resistances opposite to the open pins are connected to ground or to a power supply.
Abstract:
A slot apparatus for a memory module on a printed circuit board. The slot apparatus includes a first memory slot set, a second memory slot set, a terminal resistor, and a serial resistance. The first and second memory slot sets are disposed on the printed circuit board. The terminal resistor is disposed between the first and second memory slot sets. The serial resistance is disposed on the printed circuit board and is electrically connected to the first and second memory slot sets through the printed circuit board. The terminal resistor is respectively and electrically connected to the first and second memory slot sets through the printed circuit board. The terminal resistor and the first and second memory slot sets are connected to a terminator voltage.
Abstract:
The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number of signaling paths across the backplane at speeds of 2.5 Gbps or greater, as well as distribution of significant amounts of power to router components. The disclosed techniques and features allow relatively thick (e.g., three- or four-ounce copper) power distribution planes to be combined with large numbers of high-speed signaling layers in a common backplane. Using traditional techniques, such a construction would not be possible because of the number of layers required and the thickness of the power distribution layers. The disclosed embodiments use novel layer arrangements, material selection, processing techniques, and panel features to produce the desired high-speed layers and low-noise high-power distribution layers in a single mechanically stable board.
Abstract:
A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate.
Abstract:
A circuit board comprising at least one slot provided on a surface of the circuit board. An add-in card can be mated to the slot. The slot comprises a first electrical connection adapted to couple to an add-in card of a first type and a second electrical connection adapted to couple to an add-in card of a second type. The first or second types of add-in cards are different.
Abstract:
A memory system has a circuit board provided with a first slot connector into which a first memory module is inserted. A second slot connector is provided into which a second memory module is inserted. The first and the second memory modules are connected via a flexible bridge. The flexible bridge extends from respective ends of the memory modules opposite to that ends thereof which are inserted into the connector slots. The flexible bridge provides a signal bus between the memory modules.