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    ELECTRONIC COMPONENT
    172.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20150270068A1

    公开(公告)日：2015-09-24

    申请号：US14661018

    申请日：2015-03-18

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H01G4/30 ,  H01G4/224 ,  H01G4/228 ,  H01G4/01

    CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/18 ,  H01F27/292 ,  H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H05K1/113 ,  H05K1/141 ,  H05K1/181 ,  H05K3/0097 ,  H05K2201/049 ,  H05K2201/09181

    Abstract: An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.

    Abstract translation: 电子部件包括电子元件，其包括表面上的外部电极和安装有电子元件的基板端子。 基板端子包括第一主表面，与第一主表面相对的第二主表面和连接第一主表面和第二主表面的外周表面。 基板端子包括设置在第二主表面上并电连接到电子元件的外部电极的安装电极，以及设置在第一主表面上并电连接到电路基板的焊盘的连接电极。 连接电极的最大宽度大于安装电极的最大宽度。

    ELECTRONIC COMPONENT
    173.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20150270065A1

    公开(公告)日：2015-09-24

    申请号：US14663725

    申请日：2015-03-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Hirobumi ADACHI

    IPC: H01G2/06 ,  H05K1/16 ,  H05K1/02 ,  H01G4/30

    CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

    Abstract: An electronic component includes an electronic element including outer electrodes on a surface, a substrate terminal on which the electronic element is mounted, and a conductor that covers at least a portion of the substrate terminal. The substrate terminal includes a first main surface, a second main surface at a side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface. The substrate terminal includes a mounting electrode that is provided on the first main surface and is electrically connected to the outer electrodes of the electronic element. The mounting electrode includes adjacent portions that are located to be adjacent to the side surface of the substrate terminal. The conductor covers at least a portion of the adjacent portion.

    Abstract translation: 电子部件包括电子元件，其包括表面上的外部电极，安装有电子元件的基板端子和覆盖基板端子的至少一部分的导体。 基板端子包括第一主表面，与第一主表面相对的一侧的第二主表面和连接第一主表面和第二主表面的侧表面。 基板端子包括设置在第一主表面上并与电子元件的外部电极电连接的安装电极。 安装电极包括邻近基板端子的侧表面邻近的部分。 导体覆盖相邻部分的至少一部分。

    Printed board
    175.
    发明授权
    Printed board 有权
    印刷板

    公开(公告)号：US09095066B2

    公开(公告)日：2015-07-28

    申请号：US12483102

    申请日：2009-06-11

    Applicant: Naoto Kusumoto

    Inventor： Naoto Kusumoto

    IPC: H05K3/34 ,  H05K1/11 ,  H05K1/14

    CPC classification number: H05K1/111 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3431 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10121 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A printed board is provided, which includes at least a first connecting electrode and a second connecting electrode. A solder is provided over the first connecting electrode and the second connecting electrode, and a chip component is provided over the solder. The chip component includes a first terminal electrode and a second terminal electrode. The first connecting electrode is overlapped with the first terminal electrode and is electrically connected to the first terminal electrode through the solder. The second connecting electrode is overlapped with the second terminal electrode and is electrically connected to the second terminal electrode through the solder. Two corner portions of each of the first connecting electrode and the second connecting electrode are overlapped with two corner portions of each of the first terminal electrode and the second terminal electrode.

    Abstract translation: 提供了一种印刷电路板，其包括至少第一连接电极和第二连接电极。 在第一连接电极和第二连接电极之上提供焊料，并且在焊料上方设置芯片部件。 芯片部件包括第一端子电极和第二端子电极。 第一连接电极与第一端子电极重叠，并通过焊料与第一端子电极电连接。 第二连接电极与第二端子电极重叠，并且通过焊料与第二端子电极电连接。 第一连接电极和第二连接电极的两个角部与第一端子电极和第二端子电极的两个角部重叠。

    Electronic component
    176.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号：US09082550B2

    公开(公告)日：2015-07-14

    申请号：US14151099

    申请日：2014-01-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo Hattori ,  Isamu Fujimoto

    IPC: H05K7/00 ,  H05K1/16 ,  H05K1/11 ,  H01G2/06 ,  H05K3/34 ,  H05K1/14 ,  H05K1/18

    CPC classification number: H01G2/065 ,  H01G2/06 ,  H01G4/12 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A multilayer ceramic capacitor includes flat inner electrodes that are laminated on each other. An interposer includes a substrate that is larger than the multilayer ceramic capacitor. A first mounting electrode to mount the multilayer ceramic capacitor is located on a first principal surface of the substrate, and a first external connection electrode for connection to an external circuit board is located on a second principal surface. A recess is located in a side surface of the interposer. A connecting conductor is located in the wall surface of the recess. The connecting conductor is located at a position spaced apart by a predetermined distance from the side surface of the interposer.

    Abstract translation: 多层陶瓷电容器包括彼此层叠的平坦的内部电极。 插入器包括比多层陶瓷电容器大的衬底。 安装多层陶瓷电容器的第一安装电极位于基板的第一主表面上，并且用于连接到外部电路板的第一外部连接电极位于第二主表面上。 凹槽位于插入器的侧表面中。 连接导体位于凹部的壁表面中。 连接导体位于与插入件的侧表面间隔开预定距离的位置处。

    Electronic component
    177.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号：US09042114B2

    公开(公告)日：2015-05-26

    申请号：US14147795

    申请日：2014-01-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo Hattori ,  Isamu Fujimoto

    IPC: H05K7/00 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H01G2/06 ,  H05K3/34 ,  H01G4/228

    CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/228 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    Abstract: An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrode and a second external connection electrode that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes.

    Abstract translation: 电子部件包括插入件和多层陶瓷电容器。 插入器包括包括彼此平行或基本平行的前表面和后表面的基板。 两个第一安装电极和两个第二安装电极位于基板的前表面上，在纵向上的相对端部上。 凹部位于绝缘基板的纵向侧面。 连接导体各自设置在每个凹部的侧壁表面中。 连接导体连接位于基板的背面的第一外部连接电极和第二外部连接电极以及第一安装电极和第二安装电极。

    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME
    178.
    发明申请
    ELECTRONIC ASSEMBLIES INCLUDING A SUBASSEMBLY FILM AND METHODS OF PRODUCING THE SAME 审中-公开
    包括底片的电子组件及其制造方法

    公开(公告)号：US20140335635A1

    公开(公告)日：2014-11-13

    申请号：US13891637

    申请日：2013-05-10

    Applicant: Sridharan Venk ,  Adam Scotch ,  David Hamby

    Inventor： Sridharan Venk ,  Adam Scotch ,  David Hamby

    IPC: H01L23/00 ,  H01L33/48

    CPC classification number: H01L24/80 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K1/141 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10106 ,  H01L2924/00

    Abstract: Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

    Abstract translation: 这里描述的是包括子组件膜的电子组件及其制造方法。 在一些实施例中，通过将电子管芯放置在子组件膜上的管芯放置位置来形成第一子组件。 第二子组件可以通过将第一子组件放置在基底层上的子组件放置位置而形成，使得第一膜上的电接触/迹线与基底层上的子组件连接点处的电触点/迹线重叠。 可以使用具有大于将第一子组件放置在基层上所需的放置精度的自动放置机械来执行模具在子组件薄膜上的放置。 结果，可以避免成本高且耗时的针头放置的手动检查。

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