公开(公告)号：US5805037A

公开(公告)日：1998-09-08

申请号：US780020

申请日：1996-12-23

Applicant: Roger J. Forse ,  William L. Olson

Inventor： Roger J. Forse ,  William L. Olson

IPC: H01P3/08 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01P3/088 ,  H05K1/0253 ,  H05K1/0219 ,  H05K2201/09536 ,  H05K2201/09663 ,  H05K3/4602

Abstract: A distributed transmission line structure (10) includes a ground plane (26) affixed to a substrate (12). The substrate (12) is formed of a generally nonconductive material. A first metallic strip (14) is affixed to the substrate (12) and is electrically connected to the ground plane (26) through a first through-hole (34). A second metallic strip (16) is affixed to the substrate (12) and is spaced apart from the first metallic strip (14) by a gap (28) and is electrically connected to the ground plane (26) through a second through-hole (38). A dielectric layer (20) overlies the substrate (12), the first metallic strip (14), and the second metallic strip (16). A third metallic strip (18) is affixed to the dielectric layer (20) and is disposed to overlie the gap (28). The third metallic strip (18) has a width less than the gap (28). The impedance of the distributed transmission line structure (10) is substantially constant over a predetermined range of thickness of the dielectric layer (20).

Abstract translation: 分布式传输线结构（10）包括固定到基板（12）的接地平面（26）。 基板（12）由大致非导电材料形成。 第一金属条（14）固定到基板（12）上，并通过第一通孔（34）与接地平面（26）电连接。 第二金属条（16）固定到基板（12）上并且通过间隙（28）与第一金属条（14）间隔开，并且通过第二通孔电连接到接地平面（26） （38）。 介电层（20）覆盖在基底（12），第一金属条（14）和第二金属条（16）上。 第三金属条（18）固定到电介质层（20）上并且设置成覆盖间隙（28）。 第三金属条（18）的宽度小于间隙（28）。 分布式传输线结构（10）的阻抗在电介质层（20）的预定厚度范围内基本上是恒定的。

公开(公告)号：US5764491A

公开(公告)日：1998-06-09

申请号：US799472

申请日：1997-02-13

Applicant: Thanh T. Tran

Inventor： Thanh T. Tran

IPC: G06F1/26 ,  H05K1/00 ,  H05K1/02 ,  H01R9/09 ,  H05K1/16 ,  H05K7/06 ,  H05K9/00

CPC classification number: H05K1/0265 ,  G06F1/26 ,  H05K1/0216 ,  H05K1/0233 ,  H05K1/0262 ,  H05K1/0298 ,  H05K2201/044 ,  H05K2201/086 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2201/10159

Abstract: A power distribution system for a multi-layer circuit board includes a board having a component layer with signal runs formed thereon, a ground layer, an insulation layer, and a power supply system. The power supply system includes a supply bus, discrete voltage supply planes, and isolation devices mounted on the component layer, each connecting one of the discrete voltage supply planes to the supply bus. The component layer has a first area for components which perform a first function and a second area for components which perform a second function. The discrete voltage supply planes include a first supply plane corresponding to the first area and a second supply plane corresponding to the second area. The first supply plane is disposed directly beneath and is shaped substantially the same as the first area, and the second supply plane is disposed directly beneath and is shaped substantially the same as the second area. The first supply plane, the second supply plane, and the supply bus lie in a plane between the insulation layer and the component layer.

Abstract translation: 一种用于多层电路板的配电系统包括具有其上形成有信号线的部件层的基板，接地层，绝缘层和电源系统。 电源系统包括一个供电总线，分立的电压供应平面和安装在组件层上的隔离装置，每个将一个离散电压供应平面连接到电源总线。 组件层具有用于执行第一功能的组件的第一区域和用于执行第二功能的组件的第二区域。 离散电压供给平面包括对应于第一区域的第一供应平面和对应于第二区域的第二供应平面。 第一供应平面直接设置在下方并且被形成为与第一区域基本相同，并且第二供应平面直接设置在下方并且被成形为与第二区域基本相同。 第一供电面，第二供电面和供电总线位于绝缘层与构成层之间的平面内。

公开(公告)号：US5727727A

公开(公告)日：1998-03-17

申请号：US853983

申请日：1997-05-09

Applicant: George J. Ead

Inventor： George J. Ead

IPC: B23K1/00 ,  H01L21/52 ,  H01L23/373 ,  H05K3/00 ,  H05K3/34 ,  B23K1/20

CPC classification number: H05K3/341 ,  H01L23/3735 ,  H01L24/743 ,  H05K3/3452 ,  H01L2224/48091 ,  H01L2224/743 ,  H01L2924/10158 ,  H01L2924/12042 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/042 ,  H05K3/0061 ,  H05K3/3431 ,  Y02P70/613 ,  Y10T428/12701

Abstract: The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap to reduce formation of voids.

Abstract translation: 本发明的特征在于使焊料在两个表面之间的间隙中流动的方法。 焊料供应被加热以使其在间隙中回流和流动。 焊料被引导作为间隙中的主流流动并且作为外围流从主流朝间隙的边缘流动以减少空隙的形成。

公开(公告)号：US5554825A

公开(公告)日：1996-09-10

申请号：US338920

申请日：1994-11-14

Applicant: Stephen M. Parker ,  Thomas J. Lynch

Inventor： Stephen M. Parker ,  Thomas J. Lynch

IPC: H01B7/08 ,  H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0224 ,  H01B7/0861 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09663

Abstract: A cable (1) on an end of an electrical cable, is constructed with, a flexible and flat conductive shield (7), a flexible ribbon of insulation (3) separating the shield (7) from multiple flexible signal conductors (2) extending along the insulation (3), and at least one flexible ground conductor (6) between the insulation (3) and the shield (7), the signal conductors (2) are spaced apart on pitch spacings, with a signal conductor (2) being absent from at least one of the pitch spacings, and the ground conductor (6) extending above said one of the pitch spacings.

Abstract translation: 电缆端部的电缆（1）由柔性和平坦的导电屏蔽（7）构成，柔性的绝缘层（3）将屏蔽层（7）与多个柔性信号导体（2）分开延伸 沿着绝缘体（3）和绝缘体（3）和屏蔽（7）之间的至少一个柔性接地导体（6），信号导体（2）以间距间隔与信号导体（2）间隔开， 不在所述间距间隔中的至少一个上，并且所述接地导体（6）在所述间距间隔之上延伸。

公开(公告)号：US5492478A

公开(公告)日：1996-02-20

申请号：US167963

申请日：1994-05-12

Applicant: Rowland S. White

Inventor： Rowland S. White

IPC: H01R4/24 ,  H01R12/72 ,  H01R24/62 ,  H01R31/06 ,  H05K1/11 ,  H05K1/14 ,  H05K3/42 ,  H01R9/24

CPC classification number: H01R4/2429 ,  H01R12/721 ,  H05K1/117 ,  H01R24/62 ,  H01R31/06 ,  H05K1/0295 ,  H05K1/142 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K3/42 ,  Y10S439/922 ,  Y10S439/951

Abstract: An electrical connection system, for example a dropside patch panel, comprises a mounting rail (12) which receives first connectors (14) arranged with their contacts facing away from the rail (12). Cable introduced between the rail and the connectors is separated into individual conductors which are terminated at contacts (34, 36) via slots (30) in the rail walls. A second connector (16) carries standard data or voice sockets communications (19) which are connected to the first connector via edge contact carrying PCBs (38) which engage in slots (40) in the first connectors. The PCB edge connectors have a discontinuity on one surface, and one half of the contact is connected to the contact on the other side of the PCB to provide a jumpered interconnection between upper (34) and lower (36) rows of contacts of the first connectors in a first position of the second connectors, and contact between the upper rows of contacts and the standard sockets (19) when the second connectors are moved further into the slots (40) to occupy a second position. The slots (40) are formed to receive the PCBs (38) from either end.

Abstract translation: 一种电连接系统，例如一个侧面接线板，包括安装导轨（12），该安装导轨（12）容纳第一连接器（14），其布置成使得它们的触头背离导轨（12）。 引导在轨道和连接器之间的电缆被分离成通过轨道壁中的狭槽（30）端接在触点（34,36）上的单个导体。 第二连接器（16）承载标准数据或语音插座通信（19），其通过接合在第一连接器中的槽（40）中的经由边缘接触的PCB（38）连接到第一连接器。 PCB边缘连接器在一个表面上具有不连续性，并且接触件的一半连接到PCB的另一侧上的触点，以在第一个的上部（34）和下部（36）触点之间提供跨接的互连 连接器处于第二连接器的第一位置，并且当第二连接器进一步移动到槽（40）中以占据第二位置时，触头的上排和标准插座（19）之间的接触。 槽（40）形成为从任一端接收PCB（38）。

公开(公告)号：US5446244A

公开(公告)日：1995-08-29

申请号：US635497

申请日：1990-12-12

Applicant: Masatoshi Kawanabe ,  Kenichi Sowa ,  Akihisa Mori ,  Tomoyuki Sawada

Inventor： Masatoshi Kawanabe ,  Kenichi Sowa ,  Akihisa Mori ,  Tomoyuki Sawada

IPC: B23K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  B23K101/42 ,  B23K31/12

CPC classification number: H05K1/111 ,  B23K1/0016 ,  H05K3/3421 ,  H05K1/0269 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed wiring pattern for preventing poorly soldered connection that tends to occur when soldering surface mounting chip components and lead terminals of mounting components on the printed wiring pattern is capable of making the detection of a poorly soldered site a simple task.

Abstract translation: PCT No.PCT / JP90 / 00929 Sec。 371 1990年12月12日第 102（e）1990年12月12日PCT PCT 1990年7月19日提交的印刷布线图案，用于防止焊接表面安装芯片部件和安装部件的引线端子在印刷布线图案上容易发生的焊接不良的连接图案 使得焊接不良网站的检测变得简单。

公开(公告)号：US5172852A

公开(公告)日：1992-12-22

申请号：US877003

申请日：1992-05-01

Applicant: Lonnie L. Bernardoni ,  Kenneth R. Thompson ,  Anthony B. Suppelsa

Inventor： Lonnie L. Bernardoni ,  Kenneth R. Thompson ,  Anthony B. Suppelsa

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/042 ,  H05K2203/0485 ,  H05K2203/0545 ,  H05K3/3473 ,  H05K3/3489 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step. A flux (25) is then applied to the solder pad terminal portions (16), and the electronic component (14) is placed on the circuit carrying substrate so that each of component terminals is in the flux and contacts the terminal portions of the solder pads. The entire assembly is then heated to melt the solder, thereby causing the melted solder to flow across the solder pad bridging portion and form a fillet between the solder pad terminal portion and the component terminal.

Abstract translation: 电子部件（14）通过允许部件保持与衬底的平坦焊盘更好地接触的方法被焊接到电路承载衬底（11）。 电路承载基板（11）具有设置在其上的多个焊盘（12），每个焊盘由端子部分（16），焊料储存部分（18）和桥接部分（17）组成。 端子部分通过桥接部分连接到储存器部分。 桥接部分通常是垫的颈缩部分。 电子部件（14）具有与焊盘（12）的端子部分（16）对应的多个可焊接端子（15）。 每个焊盘储存器部分涂覆有焊料储存器（23）。 涂覆到储存器部分上的焊料的量足以在随后的加热步骤期间在部件（14）和焊盘端子部分（16）之间提供圆角。 然后将焊剂（25）施加到焊料焊盘端子部分（16），并且将电子部件（14）放置在电路承载基板上，使得每个部件端子处于焊剂中​​并与焊料的端子部分接触 垫 然后将整个组件加热以熔化焊料，从而使熔融的焊料流过焊料焊盘桥接部分并在焊料焊盘端子部分和部件端子之间形成圆角。

公开(公告)号：US5131140A

公开(公告)日：1992-07-21

申请号：US661040

申请日：1991-02-26

Applicant: Paul R. Zimmer

Inventor： Paul R. Zimmer

IPC: G01R31/28 ,  H05K1/02 ,  H05K3/22

CPC classification number: H05K1/0216 ,  G01R31/281 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/0979 ,  H05K2203/162 ,  H05K3/222 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: In method for electrically connecting sections of a split plane in a printed circuit board, conductive strips are placed on a surface plane of the printed circuit board, along borders of the sections of the split plane. The conductive strips are connected to the sections of the split plane through vias. For every first section and second section which are to be electrically connected, a single piece of conductive material is connected to a conductive strip placed on a border of the first section and is connected to a conductive strip placed on a border of the second section. Testing may then be performed to determine electromagnetic properties of the printed circuit board for different combinations of the sections being connected together. From the results of the testing the optimal borders for the split plane can be determined.

Abstract translation: 在电连接印刷电路板中的开口平面的部分的方法中，导电条沿着分割平面的部分的边界放置在印刷电路板的表面上。 导电条通过通孔连接到分裂平面的部分。 对于要电连接的每个第一部分和第二部分，单个导电材料连接到放置在第一部分的边界上的导电条，并且连接到放置在第二部分的边界上的导电条。 然后可以执行测试以确定印刷电路板的电磁特性，用于连接在一起的部分的不同组合。 从测试结果可以确定分裂平面的最佳边界。

公开(公告)号：US5109269A

公开(公告)日：1992-04-28

申请号：US726780

申请日：1991-07-08

Applicant: Ofer Holzman

Inventor： Ofer Holzman

IPC: H05K3/34 ,  H05K3/40 ,  H05K13/04

CPC classification number: H05K3/341 ,  H05K13/046 ,  H05K3/3426 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/10962 ,  H05K2201/10969 ,  H05K2203/048 ,  H05K3/4015 ,  Y02P70/613 ,  Y10S269/903 ,  Y10T29/49144

Abstract: An SMT electronic component is mounted to a solder-bearing floatation plate by fusible or other heat-responsive releasable mounting means which suspend the component above the floatation plate. The bottom of the floatation plate is effectively substantially the mirror image of a component-positioning pad formed on the board surface adjacent the solder-bearing contact pads corresponding to the electrical contacts on the component. In the assembly process, the floatation plate is placed on the positioning pad. The solder on the bottom of the floatation plate has a melting point lower than the release temperature of the mounting means and the melting point of the solder on the contact pads. With the floatation plate on the component-positioning pad, on heating the solder on the floatation plate liquifies first, wetting the component-positioning pad and floating the floatation plate and component on a thin film of molten solder. Surface tension forces bring the floatation plate into registry with the component-positioning pad. On further heating, the solder on the contact pads liquifies, and the heat-responsive mounting means allows the component to fall freely onto the contact pads. Guide means are provided to prevent rotational and lateral displacement of the component during the fall. The disclosure includes alternative floatation plate constructions and component mounting arrangements.

Abstract translation: SMT电子部件通过可熔或其它热响应的可释放的安装装置安装到焊料浮动板上，该安装装置将浮动板上方的部件悬挂。 漂浮板的底部基本上是形成在板表面上的与形成在组件上的电触点对应的焊料支承接触垫相邻的部件定位焊盘的镜像。 在组装过程中，将浮选板放置在定位垫上。 浮选板底部的焊料的熔点低于安装装置的释放温度和接触焊盘上焊料的熔点。 通过浮动板在组件定位垫上，加热漂浮板上的焊料首先液化，润湿组件定位垫，并将浮选板和组件浮在熔融焊料薄膜上。 表面张力使浮板与元件定位垫对准。 在进一步加热时，接触焊盘上的焊料液化，并且热响应安装装置允许部件自由落入接触焊盘。 提供引导装置以防止部件在坠落期间的旋转和横向位移。 本公开包括替代的漂浮板结构和部件安装布置。

公开(公告)号：US5068631A

公开(公告)日：1991-11-26

申请号：US564998

申请日：1990-08-09

Applicant: Richard A. Vince

Inventor： Richard A. Vince

IPC: H05K1/14 ,  H03H1/00 ,  H05K1/02

CPC classification number: H05K1/0233 ,  H05K1/0225 ,  H05K1/0224 ,  H05K1/0231 ,  H05K2201/086 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09772 ,  H05K2201/1006 ,  H05K2201/10689

Abstract: Electromagnetic filtering for a VLSI device having multiple power input leads is realized by employing a sub-power plane which is physically separate from a main power distribution system on a circuit board. The sub-power plane is placed directly under a corresponding VLSI device. Decoupling capacitors are connected to the sub-power plane and, in turn, to each of the power input leads on the VLSI device. Power is supplied from the main power distribution system to the sub-power plane via a ferrite bead type filter.