公开(公告)号：US09992865B2

公开(公告)日：2018-06-05

申请号：US15045544

申请日：2016-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong Min ,  Myung-Sam Kang ,  Young-Gwan Ko ,  Min-Jae Seong

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/00 ,  H05K1/113 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672 ,  H05K2201/09872 ,  H05K2201/10674

Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.

公开(公告)号：US20180096754A1

公开(公告)日：2018-04-05

申请号：US15691169

申请日：2017-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minwoo SONG ,  Jungho KIM ,  Euichan JUNG ,  Jiwoo LEE

IPC: H01B11/00 ,  H02J7/00 ,  G03B13/36 ,  G03B5/04 ,  G01P13/00 ,  G01P15/08

CPC classification number: H01B11/002 ,  G01P13/00 ,  G01P15/0802 ,  G03B5/04 ,  G03B13/36 ,  G03B2205/0069 ,  H02J7/0068 ,  H02J7/025 ,  H02K1/22 ,  H04N5/225 ,  H04N5/23287 ,  H05K1/0228 ,  H05K1/189 ,  H05K2201/093 ,  H05K2201/09672

Abstract: An electronic device and a noise control method thereof are provided. The electronic device includes a cable having a first layer forming a first power line and a second layer forming a second power line. The first and second layers are arranged in a vertical stack structure. The cable cancels a magnetic field generated by a current in charging and discharging a battery cell of the electronic device, and removes a noise due to a magnetic field generated from a coil-contained component of the electronic device. Other various embodiments are possible.

公开(公告)号：US09905973B2

公开(公告)日：2018-02-27

申请号：US14949958

申请日：2015-11-24

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher

IPC: H01R13/6473 ,  H01R13/6461 ,  H01R24/62 ,  H01R13/6466 ,  H05K1/16 ,  H01R24/64 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R13/6473 ,  H01R13/6466 ,  H01R24/64 ,  H05K1/0219 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/117 ,  H05K1/165 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Communications plugs are provided that include a housing that receives the conductors of the communication cable. A printed circuit board is mounted at least partially within the housing. A plurality of plug contacts are on the printed circuit board, and the printed circuit board includes a plurality of conductive paths that electrically connect respective ones of the conductors to respective ones of the plug contacts. First and second of the conductive paths are arranged as a first differential pair of conductive paths that comprise a portion of a first differential transmission line through the communications plug, where the first differential transmission line includes a first transition region where the impedance of the first differential transmission line changes by at least 20% and a second transition region impedance of the first differential transmission line changes by at least 20%.

公开(公告)号：US09893008B2

公开(公告)日：2018-02-13

申请号：US15193355

申请日：2016-06-27

Applicant: Texas Instruments Incorporated

Inventor： Thomas Dyer Bonifield ,  Byron Williams ,  Shrinivasan Jaganathan ,  David Larkin ,  Dhaval Atul Saraiya

IPC: H05K1/09 ,  H01L23/522 ,  H05K1/03 ,  H05K1/16 ,  H01L23/62 ,  H05K1/02 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11 ,  H01L23/498 ,  H01L23/528 ,  H01L23/532 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/5223 ,  H01L23/49811 ,  H01L23/5227 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/5329 ,  H01L23/538 ,  H01L23/62 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/14335 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0088 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0175 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09672 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.

公开(公告)号：US09825348B2

公开(公告)日：2017-11-21

申请号：US15083986

申请日：2016-03-29

Applicant: Sony Semiconductor Solutions Corporation

Inventor： Hidekazu Kikuchi ,  Takayuki Mogi ,  Yoshiyuki Akiyama ,  Hirofumi Kawamura

IPC: H04B7/00 ,  H01P5/02 ,  H04B7/24 ,  H01P3/12 ,  H01P5/107 ,  H04B3/56 ,  H01R13/66 ,  H01R103/00 ,  H01R13/6461 ,  H01R24/28 ,  H01R24/76 ,  H05K1/02

CPC classification number: H01P5/02 ,  H01P1/208 ,  H01P3/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/024 ,  H01P5/082 ,  H01P5/087 ,  H01P5/1022 ,  H01P5/107 ,  H01P5/18 ,  H01P5/182 ,  H01P5/188 ,  H01R13/6461 ,  H01R13/665 ,  H01R24/28 ,  H01R24/76 ,  H01R2103/00 ,  H04B3/56 ,  H04B7/24 ,  H05K1/0225 ,  H05K1/0239 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09754

Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

公开(公告)号：US20170332488A1

公开(公告)日：2017-11-16

申请号：US15666540

申请日：2017-08-01

Applicant: NHK SPRING CO., LTD.

Inventor： Katsumi MIZUNO ,  Daiki IKEDA

IPC: H05K1/05 ,  H05K3/20 ,  H05K1/03 ,  H05K3/44

CPC classification number: H05K1/056 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0373 ,  H05K3/103 ,  H05K3/20 ,  H05K3/202 ,  H05K3/44 ,  H05K2201/0137 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/1105

Abstract: According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

公开(公告)号：US09742051B2

公开(公告)日：2017-08-22

申请号：US15006377

申请日：2016-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui

IPC: H01P3/02 ,  H01P11/00 ,  H05K1/02 ,  H01P3/08 ,  H01F17/06

CPC classification number: H01P3/02 ,  H01F2017/065 ,  H01P11/003 ,  H05K1/024 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/086 ,  H05K2201/09672

Abstract: A high-frequency signal transmission line includes a body including a plurality of first base layers and a second base layer stacked on one another in a stacking direction. The first base layers have a first relative permeability, and the second base layer has a relative permeability lower than the first relative permeability. A first signal line and a second signal line extending along the first signal line are provided in the body. In a cross section perpendicular or substantially perpendicular to a first direction in which the first signal line extends, the second base layer occupies at least a portion of an area between the first signal line and the second signal line. In the cross section perpendicular or substantially perpendicular to the first direction, the plurality of first base layers define a loop enclosing the first signal line, the second signal line and the second base layer.

公开(公告)号：US09699888B2

公开(公告)日：2017-07-04

申请号：US14838642

申请日：2015-08-28

Applicant: FUJITSU LIMITED

Inventor： Taiga Fukumori

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K1/0251 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10674

Abstract: A circuit substrate includes: a plurality of signal wirings formed at different positions of the circuit substrate in a thickness direction and extending in parallel in the circuit substrate; and ground layers or power supply layers formed at both sides of the circuit substrate in the thickness direction by interposing the plurality of the signal wirings between the ground layers or between the power supply layers, wherein the plurality of signal wirings are electrically coupled with each other by a plurality of conductors formed at an interval narrower than an interval by which a resonance is caused.

公开(公告)号：US20170186533A9

公开(公告)日：2017-06-29

申请号：US14531079

申请日：2014-11-03

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01F41/02 ,  H05K1/18 ,  H05B33/08

CPC classification number: H01F41/0206 ,  H01F17/0013 ,  H01F41/046 ,  H01F2017/006 ,  H01F2017/0066 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0845 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/165 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0005 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/281 ,  H05K3/427 ,  H05K3/4697 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/0919 ,  H05K2201/09672 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2203/0126 ,  H05K2203/0384 ,  H05K2203/0571 ,  H05K2203/063 ,  H05K2203/1545

Abstract: An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

公开(公告)号：US09651812B1

公开(公告)日：2017-05-16

申请号：US12902958

申请日：2010-10-12

Applicant: Tao Peng

Inventor： Tao Peng

IPC: G02F1/1335 ,  G02F1/1333 ,  G06F3/041

CPC classification number: G02F1/13338 ,  G06F3/041 ,  G06F3/0416 ,  G06F3/044 ,  H05K1/11 ,  H05K2201/0379 ,  H05K2201/09672 ,  H05K2201/09681 ,  H05K2201/0969

Abstract: An apparatus including a first layer formed from a first conductive material having a first coefficient of thermal expansion and a second layer, coupled to the first layer, the second layer formed from a second conductive material having a second coefficient of thermal expansion, where the second layer is partially filled.