公开(公告)号：US07766665B2

公开(公告)日：2010-08-03

申请号：US12364445

申请日：2009-02-02

Applicant: Fred Jessup ,  Erik Cegnar ,  Mike Maughan ,  David G. Alexander

Inventor： Fred Jessup ,  Erik Cegnar ,  Mike Maughan ,  David G. Alexander

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/09172 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/10598 ,  H05K2203/0455

Abstract: A system for directly connecting multiple printed circuit boards (PCB) circuits without the need for peripheral connectors. Multiple PCBs are electrically and mechanically interfaced with one or more plated holes or tabs on at least one first PCB and one or more plated tabs or holes on at least one second PCB. The plated tab(s)/hole(s) from said second PCB mate with the corresponding plated tab(s)/hole(s) from said first PCB to form a mechanical and electrical interconnect.

Abstract translation: 用于直接连接多个印刷电路板（PCB）电路而不需要外围连接器的系统。 多个PCB电气和机械地与至少一个第一PCB上的一个或多个电镀孔或突片相接合，并且在至少一个第二PCB上具有一个或多个镀覆的突片或孔。 来自所述第二PCB的电镀突片/孔与来自所述第一PCB的相应的电镀突片/孔匹配以形成机械和电互连。

公开(公告)号：US20100118443A1

公开(公告)日：2010-05-13

申请号：US12588906

申请日：2009-11-02

Applicant: Tetsuya Ohsawa ,  Toshiki Naito

Inventor： Tetsuya Ohsawa ,  Toshiki Naito

IPC: G11B5/48 ,  H05K3/00

CPC classification number: H05K1/189 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10545 ,  H05K2201/10598 ,  Y10T29/49027 ,  Y10T29/49124

Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion on which a magnetic head is mounted, and an auxiliary portion capable of being folded back with respect to the board main body portion so as to face a back surface of the board main body portion. The conductive pattern includes a first conductive pattern including a first terminal electrically connected to an external circuit, and a second terminal electrically connected to the magnetic head, and a second conductive pattern including a third terminal electrically connected to the external circuit, and a fourth terminal electrically connected to an electronic element. Both of the first terminal and the second terminal are disposed on the board main body portion. The third terminal is disposed on the board main body portion or on the auxiliary portion, and the fourth terminal is disposed on the auxiliary portion.

Abstract translation: 具有电路的悬挂板包括导电图案，安装有磁头的板主体部分和能够相对于板主体部分折叠以便面向板的后表面的辅助部分 主体部分。 导电图案包括：第一导电图案，包括电连接到外部电路的第一端子和与磁头电连接的第二端子;以及第二导电图案，其包括电连接到外部电路的第三端子，以及第四端子 电连接到电子元件。 第一端子和第二端子都设置在板主体部分上。 第三端子设置在板主体部分或辅助部分上，第四端子设置在辅助部分上。

公开(公告)号：US07696614B2

公开(公告)日：2010-04-13

申请号：US12335057

申请日：2008-12-15

Applicant: Hiroyuki Fukusako ,  Kazunori Seno

Inventor： Hiroyuki Fukusako ,  Kazunori Seno

IPC: H05K7/20

CPC classification number: H01L23/50 ,  G02F1/13452 ,  H01L23/3677 ,  H01L23/4985 ,  H01L23/552 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0393 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: A driver module structure includes a flexible circuit board (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible circuit board (2), and an electrically conductive heat-radiating member (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8). The flexible circuit board (2) has a cavity (9) that exposes a portion of the ground wiring pattern (8). The exposed portion of the ground wiring pattern (8) and the heat-radiating member (4) are connected to establish electrical continuity via a member (11) that is fitted into the cavity (9).

Abstract translation: 驱动器模块结构包括设置有布线图案（7）的柔性电路板（2），安装在柔性电路板（2）上的半导体器件）和接合到半导体器件的导电散热构件 。 布线图案（7）包括接地布线图案（8）。 柔性电路板（2）具有露出接地布线图形（8）的一部分的空腔（9）。 接地布线图案（8）和散热构件（4）的暴露部分被连接以经由装配到空腔（9）中的构件（11）建立电连续性。

公开(公告)号：US20100055976A1

公开(公告)日：2010-03-04

申请号：US12548804

申请日：2009-08-27

Applicant: Yasuhiro OHMORI ,  Masahiko NAKAMURA

Inventor： Yasuhiro OHMORI ,  Masahiko NAKAMURA

IPC: H01R13/60

CPC classification number: H05K3/301 ,  F21V19/0085 ,  H01R9/15 ,  H01R33/0872 ,  H01R33/7692 ,  H05K2201/10113 ,  H05K2201/10598

Abstract: The present invention provides a connection structure of a circuit board and a connecting device of the present invention including: a connecting device electrically and mechanically connectable to an electronic component; and a circuit board having a surface to mount the connecting device thereon. The connecting device has a locking piece for attaching the connecting device to the surface of the circuit board. The circuit board has an elongated locking hole for receiving the locking piece. The locking piece is adapted to be locked at a lip of the locking hole by sliding or turning the locking piece in a predetermined direction inside the locking hole.

Abstract translation: 本发明提供了本发明的电路板和连接装置的连接结构，包括：电气和机械连接到电子部件的连接装置; 以及具有用于将连接装置安装在其上的表面的电路板。 连接装置具有用于将连接装置连接到电路板的表面的锁定片。 电路板具有用于接收锁定件的细长锁定孔。 锁定片适于通过沿锁定孔内的预定方向滑动或转动锁定片而锁定在锁定孔的唇缘处。

公开(公告)号：US07670144B2

公开(公告)日：2010-03-02

申请号：US11563311

申请日：2006-11-27

Applicant: Eiichi Ito ,  Koji Tsuda ,  Tadashi Minakuchi ,  Mitsuhiro Matsumoto

Inventor： Eiichi Ito ,  Koji Tsuda ,  Tadashi Minakuchi ,  Mitsuhiro Matsumoto

IPC: H01R33/00

CPC classification number: H05K3/103 ,  H05K1/0287 ,  H05K2201/0715 ,  H05K2201/09263 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10598

Abstract: There is provided a method of manufacturing a conductive layer of in a signal transmission substrate. The method includes sewing conductive thread in sheet-like material having an insulating property so as to form one of a plurality of low resistance regions using the conductive thread in a high resistance region formed by the sheet-like material, moving the conductive thread from an end point of a previously sewed low resistance region to a start point of a low resistance region to be sewed subsequently, repeating the sewing and moving steps to form the plurality of low resistance regions in the high resistance region, and forming a plurality of holes in the conductive layer by press working so that an electrical component attached to at least one of the plurality of holes is able to transmit a signal between neighboring ones of the plurality of low resistance regions.

Abstract translation: 提供了一种在信号传输基板中制造导电层的方法。 该方法包括将具有绝缘性的片状材料中的导电线缝合，以便在由片状材料形成的高电阻区域中使用导电线形成多个低电阻区域中的一个，将导电线从 先前缝合的低电阻区域的终点到随后要缝制的低电阻区域的起始点，重复缝合和移动步骤以在高电阻区域中形成多个低电阻区域，并且形成多个孔 所述导电层通过冲压加工使得附接到所述多个孔中的至少一个孔的电气部件能够在所述多个低电阻区域中的相邻电阻区域之间传输信号。

公开(公告)号：US20090316369A1

公开(公告)日：2009-12-24

申请号：US12142928

申请日：2008-06-20

Applicant: Brett C. Ong ,  William A. De Meulenaere ,  Michael S. White

Inventor： Brett C. Ong ,  William A. De Meulenaere ,  Michael S. White

IPC: H05K1/00

CPC classification number: H05K1/141 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10446 ,  H05K2201/10598 ,  H05K2201/10606 ,  H05K2203/304

Abstract: A brace for a circuit board vertically mounted on a motherboard includes a first attachment member capable of attaching to an edge of the circuit board distal from the motherboard; a second attachment member capable of attaching to a side edge of the motherboard; and a rigid support connecting the first attachment member and the second attachment member. The rigid support is shaped such that the circuit board is held substantially perpendicular to the motherboard when the brace is attached. An interference minimization device for minimizing the interference of a circuit board vertically mounted on a motherboard includes an attachment member capable of attaching to the circuit board at an end distal from the motherboard; a mating wall that is substantially parallel to the circuit board and abuts the circuit board when the interference minimization device is attached to the circuit board; and a tapered wall that widens from the distal end of the circuit board towards the motherboard.

Abstract translation: 垂直安装在母板上的电路板的支架包括能够连接到远离母板的电路板的边缘的第一附接构件; 第二附接构件，其能够附接到母板的侧边缘; 以及连接第一附接构件和第二附接构件的刚性支撑件。 刚性支撑件被成形为使得当安装支架时电路板基本上垂直于母板保持。 用于最小化垂直安装在母板上的电路板的干扰的干扰最小化装置包括能够远离母板的端部附接到电路板的附接构件; 当所述干扰最小化装置附接到所述电路板时，所述配合壁基本上平行于所述电路板并抵靠所述电路板; 以及从电路板的远端朝向主板变宽的锥形壁。

公开(公告)号：US07619899B2

公开(公告)日：2009-11-17

申请号：US10919998

申请日：2004-08-17

Applicant: Brandon Rubenstein ,  Stephan Barsun

Inventor： Brandon Rubenstein ,  Stephan Barsun

IPC: H05K1/14

CPC classification number: H05K7/1428 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, the opening can be configured to maintain a threaded device and to allow the threaded device to move within the opening. The threaded device can be configured to engage a securing device for adjustably securing the at least one extended portion to the circuit board.

Abstract translation: 描述了将电子模块定位和固定到电路板相关联的示例系统和方法。 在一个实施例中，电子模块包括被配置为连接到电路板的至少一个可连接部分和具有穿过其中的开口的至少一个延伸部分。 在一个示例中，开口可以被配置为维持螺纹装置并允许螺纹装置在开口内移动。 螺纹装置可以被配置成接合固定装置，用于将至少一个延伸部分可调节地固定到电路板。

公开(公告)号：US20090241538A1

公开(公告)日：2009-10-01

申请号：US12411967

申请日：2009-03-26

Applicant: Kumiko YOSHINAGA ,  Yuichi Yanagisawa

Inventor： Kumiko YOSHINAGA ,  Yuichi Yanagisawa

IPC: B60T17/02 ,  H05K7/20 ,  H05K3/00

CPC classification number: H05K7/20509 ,  B60T8/368 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/308 ,  H05K3/42 ,  H05K7/142 ,  H05K2201/1059 ,  H05K2201/10598 ,  Y10T29/49124

Abstract: An electronic device including a circuit board onto which an electronic part is installed, a radiating member, and at least one fitting member that fixes the radiating member to the circuit board, the fitting member being formed with a resilient portion that is configured to produce a resilient restoring force and holds the radiating member in a state fixed to the circuit board by the resilient restoring force.

Abstract translation: 一种电子设备，包括其上安装有电子部件的电路板，散热构件和将散热构件固定到电路板的至少一个配件，该配合构件形成有弹性部，该弹性部被构造成产生 弹性恢复力，并且通过弹性恢复力将散热构件保持在固定到电路板的状态。

公开(公告)号：US07594740B2

公开(公告)日：2009-09-29

申请号：US11842145

申请日：2007-08-21

Applicant: John Popovich ,  Gregory W. Honegger

Inventor： John Popovich ,  Gregory W. Honegger

IPC: F21V33/00

CPC classification number: F21V29/70 ,  A47C7/725 ,  F21K9/00 ,  F21K9/60 ,  F21K9/90 ,  F21V7/0025 ,  F21V7/005 ,  F21V19/001 ,  F21V29/507 ,  F21V29/74 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10S362/80 ,  Y10T29/49133 ,  Y10T29/49826

Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Abstract translation: 提供了一种模块化发光二极管（LED）安装配置，其包括具有以串联阵列布置的多个预先封装的LED的光源模块。 该模块包括适于将由LED产生的热量传导到相邻散热器的导热体部分。 因此，LED能够以比正常允许的更高的电流工作。 因此，增加LED的亮度和性能而不降低LED的寿命。 LED模块可用于采用一个或多个模块的各种照明应用。

公开(公告)号：US20090190318A1

公开(公告)日：2009-07-30

申请号：US12362103

申请日：2009-01-29

Applicant: Seiji Komatsu

Inventor： Seiji Komatsu

IPC: H01R12/14 ,  H01R13/627 ,  H01R12/00

CPC classification number: H01R12/707 ,  H01R12/7017 ,  H05K3/301 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: A holding member, for an electronic component inserted into a through hole provided in an electronic circuit board which includes a plate-shaped base that is fixed to the electronic component, a first leg and a second leg. The first leg extends from the base, and is inserted into the through hole. The first leg has a catch that projects laterally and outwardly with respect to an inserting direction in which the first leg is inserted into the through hole and locked with an edge of the through hole after the first leg is inserted. The second leg extends from the base and is inserted into the through hole together with the first leg. The second leg elastically deforms when the second leg comes into contact with an inner surface of the through hole, presses the first leg to an opposite side inner surface of the through hole, and elastically holds the catch in a state in which the catch is locked with the edge of the through hole after the second leg is inserted.

Abstract translation: 一种保持构件，用于插入到设置在电子电路板中的通孔中的电子部件，该电子电路板包括固定到电子部件的板状基座，第一腿部和第二腿部。 第一条腿从基部延伸，并插入到通孔中。 第一腿部具有相对于第一腿部插入通孔中的插入方向横向向外突出并且在插入第一腿部之后与通孔的边缘锁定的卡扣。 第二条腿从基部延伸并与第一条腿一起插入到通孔中。 当第二腿与通孔的内表面接触时，第二腿弹性变形，将第一腿按压到通孔的相对侧内表面，并且将卡扣弹性地保持在卡锁的状态 在插入第二条腿后的通孔的边缘。