公开(公告)号：US08716839B2

公开(公告)日：2014-05-06

申请号：US13896739

申请日：2013-05-17

Applicant: Fujitsu Limited

Inventor： Manabu Watanabe ,  Masateru Koide ,  Kenji Fukuzono ,  Takashi Kanda

IPC: H01L23/544 ,  H01L29/40 ,  H01L29/06

CPC classification number: H01L21/50 ,  H01L21/82 ,  H01L29/06 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/2018

Abstract: A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Abstract translation: 半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。

公开(公告)号：US20140092569A1

公开(公告)日：2014-04-03

申请号：US14040358

申请日：2013-09-27

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Keizou SAKURAI

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/1461 ,  H05K3/3452 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/0588 ,  H05K2203/061 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A wiring board includes a base wiring board 10 and a frame wiring board 20. The base wiring board 10 has an element mounting portion 1a and a frame-shaped frame joining portion 1b on the upper surface and a solder resist layer 4 deposited in a portion between the element mounting portion 1a and the frame joining portion 1b. In the wiring board 10, a first joining pad 6 provided in the frame joining portion 1b and a second joining pad 16 provided in a lower surface of the frame wiring board 20 are joined together via a solder bump H so that a gap may be formed between the frame joining portion 1b and the frame wiring board 20. The base wiring board 10 has a resin injection hole 8 penetrating through the base wiring board 10 in the frame joining portion 1b, and the gap is filled with a sealing resin 18.

Abstract translation: 布线基板包括基底布线板10和框架布线板20.基布线板10具有在上表面上的元件安装部分1a和框架形框架接合部分1b以及沉积在部分上的阻焊层4 在元件安装部分1a和框架接合部分1b之间。 在布线板10中，设置在框架接合部分1b中的第一接合焊盘6和设置在框架接线板20的下表面中的第二接合焊盘16通过焊料凸块H接合在一起，从而可以形成间隙 框架接合部分1b和框架接线板20之间。底部布线板10具有穿过框架接合部分1b中的基底布线板10的树脂注入孔8，并且间隙填充有密封树脂18。

公开(公告)号：US20140055957A1

公开(公告)日：2014-02-27

申请号：US14072199

申请日：2013-11-05

Applicant: Huawei Device Co., Ltd.

Inventor： Jun Yang ,  Liechun Zhou ,  Hualin Li ,  Xijie Wu

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract translation: 在本发明的实施例中公开了与电子组装技术领域有关的复合材料和电子装置。 解决了内部结构过于复杂的现有电子设备的技术问题。 复合材料包括导电导热层，粘胶层和绝缘层，其中导电层和绝缘层粘贴在粘胶层的两侧; 粘胶胶层是导电的。 电子设备包括电路板和复合材料。 在对应于电子部件和/或屏蔽框架的位置的绝缘层处形成间隙，粘胶层露出，复合材料通过粘胶胶层粘贴到电子部件和/或屏蔽框架上。 本发明应用于简化电子设备的结构。

公开(公告)号：US20130344716A1

公开(公告)日：2013-12-26

申请号：US13919243

申请日：2013-06-17

Applicant: TELLABS OY

Inventor： Alf BJORKLOF ,  Antti HOLMA

IPC: H01R13/04 ,  H01R43/20

CPC classification number: H01R13/04 ,  H01R43/205 ,  H05K3/222 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A method for manufacturing a circuit board system includes attaching (501), to a circuit board, electrical components that constitute together with the circuit board a first functional entity and a second functional entity that are disconnected from each other so that operations of the first and second functional entities are substantially free from mutual interactions. The method includes directing (502) electrical activity, for example testing and/or data loading, to the first functional entity and/or to the second functional entity. Subsequently, the method includes providing (503) at least one galvanic connection between the first and second functional entities by pushing one or more press-fit pins in holes of the circuit board in order to enable the first and second functional entities to co-operate with each other. The method allows functional entity-specific testing, data loading, and other electrical activity after e.g. a soldering process and prior to possible functionality testing (504).

Abstract translation: 一种用于制造电路板系统的方法，包括：将与所述电路板一起构成的第一功能实体和第二功能实体与电路板连接（501），所述第一功能实体和第二功能实体彼此断开连接，使得所述第一和第 第二功能实体基本上没有相互作用。 该方法包括将电活动（例如测试和/或数据加载）引导（502）到第一功能实体和/或第二功能实体。 随后，该方法包括在第一和第二功能实体之间提供（503）至少一个电流连接，通过将一个或多个压配合引脚推入电路板的孔中，以使第一和第二功能实体能够合作 与彼此。 该方法允许功能实体特异性测试，数据加载和其他电活动。 焊接过程和可能的功能测试之前（504）。

公开(公告)号：US08591053B2

公开(公告)日：2013-11-26

申请号：US12894331

申请日：2010-09-30

Applicant: Christophe Thullier ,  Jean-Marc Nicolai

Inventor： Christophe Thullier ,  Jean-Marc Nicolai

IPC: F21V21/00 ,  F21V21/34

CPC classification number: F21V21/34 ,  F21S41/143 ,  F21S41/155 ,  F21S41/192 ,  F21Y2115/10 ,  H01R12/57 ,  H01R12/62 ,  H05K1/147 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/049 ,  H05K2203/167

Abstract: A light source support on a first printed circuit for a lighting and/or signalling module, comprising a first housing intended to accommodate the first printed circuit and presenting an opening for the light source; means of positioning and fixation of the support; and means of positioning of a flexible printed circuit, intended to position the flexible printed circuit in relation to the first printed circuit, so as to link them electrically.

Abstract translation: 用于照明和/或信号模块的第一印刷电路上的光源支撑件，包括用于容纳第一印刷电路并呈现光源的开口的第一壳体; 定位和固定支撑的手段; 以及用于将柔性印刷电路相对于第一印刷电路定位的柔性印刷电路的定位装置，以使它们电连接。

公开(公告)号：US08578599B2

公开(公告)日：2013-11-12

申请号：US13053417

申请日：2011-03-22

Applicant: Michael S. Kuszaj

Inventor： Michael S. Kuszaj

IPC: H05K3/02

CPC classification number: H05K1/0313 ,  H05K2201/0116 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/249953 ,  Y10T428/249982

Abstract: A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate.

Abstract translation: 制造支撑泡沫电路层压体的方法包括将具有由边缘限定的形状的电介质泡沫基材装配到具有厚度，内缘和外缘的支撑框架，其中电介质泡沫基底的边缘与内部 支撑框架的边缘，并且电介质泡沫基板具有大于支撑框架的厚度的厚度; 将导电层设置在电介质泡沫衬底和支撑框架的侧面上，其中导电层的边缘与支撑框架的内边缘重叠; 并且在热和压力下将导电层共同层叠到电介质泡沫衬底和重叠的支撑框架，以提供支撑的泡沫电路层压体。

公开(公告)号：US08553428B2

公开(公告)日：2013-10-08

申请号：US12601623

申请日：2007-05-24

Applicant: Lars Bolander ,  Tomas Bergsten

Inventor： Lars Bolander ,  Tomas Bergsten

IPC: H05K7/02 ,  H05K7/04

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10325 ,  H05K2201/10636 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A component for mounting on a PCB, intended to support an electronics component, with an extension in the longitudinal, lateral and vertical directions. The component has a first and a second main surface, the second main surface being intended for mounting on the PCB. The component is made in a non conducting material, with a first layer of conducting material arranged on its first main surface, the conducting layer being connected to a conducting layer on the second main surface of the component by electrically conducting means. The component's extension in the vertical direction is smaller than its extension in either the longitudinal or lateral direction.

Abstract translation: 用于安装在PCB上的部件，用于支撑电子部件，在纵向，横向和垂直方向上具有延伸部分。 该部件具有第一和第二主表面，第二主表面用于安装在PCB上。 该部件由非导电材料制成，其第一导电材料层布置在其第一主表面上，导电层通过导电装置连接到元件的第二主表面上的导电层。 部件在垂直方向的延伸小于其在纵向或横向上的延伸。

公开(公告)号：US20130258631A1

公开(公告)日：2013-10-03

申请号：US13437451

申请日：2012-04-02

Applicant: Robert Winston Carter

Inventor： Robert Winston Carter

IPC: H05K7/00 ,  H01R4/02

CPC classification number: H05K7/00 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A Printed Circuit Assembly has a multiplicity of connectors with each connector containing insulating matrices with each matrix containing a multiplicity of conducting or non-conducting standoffs with each standoff contacting one or more printed circuit boards. The standoffs permit controlled-impedance electrical connections, thermal management and mechanical rigidity of the overall assembly making the assembly suitable for use in any environment including the most harsh extremes.

Abstract translation: 印刷电路组件具有多个连接器，每个连接器包含绝缘矩阵，每个矩阵包含多个导电或非导电支座，每个支座接触一个或多个印刷电路板。 支架允许整体组件的受控阻抗电气连接，热管理和机械刚度，使组件适合在任何环境中使用，包括最苛刻的极端。

公开(公告)号：US20130114228A1

公开(公告)日：2013-05-09

申请号：US13631156

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Nicholas G. Merz ,  Hong Wang ,  Michael M. Nikkhoo ,  Dennis R. Pyper ,  Christopher Matthew Werner

IPC: H05K9/00 ,  H05K3/30 ,  H05K7/06

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。

公开(公告)号：US08345427B2

公开(公告)日：2013-01-01

申请号：US12939915

申请日：2010-11-04

Applicant: Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Abstract translation: 模块可电连接到计算机系统。 模块包括耦合到第一表面的第一表面和第一多个电路封装。 该模块还包括耦合到第二表面的第二表面和第二多个电路封装。 第二表面面向第一表面。 模块还包括位于第一表面和第二表面之间的至少一个热导管。 所述至少一个热导管与所述第一多个电路封装件和所述第二多个电路封装体热连通。