公开(公告)号：US20170221677A1

公开(公告)日：2017-08-03

申请号：US15500392

申请日：2015-07-29

Applicant: Hitachi High-Technologies Corporation

Inventor： Kengo ASAI ,  Hiroyasu SHICHI ,  Hisayuki TAKASU ,  Toru IWAYA

IPC: H01J37/302 ,  H01J37/08 ,  H01J37/305

CPC classification number: H01J37/302 ,  H01J27/04 ,  H01J37/08 ,  H01J37/243 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J2237/08 ,  H01J2237/30461 ,  H01J2237/3151

Abstract: To provide an ion gun of a penning discharge type capable of narrowing a beam with a low ion beam current at a low acceleration voltage, an ion milling device including the same, and an ion milling method.An ion milling device that controls half width of a beam profile of an ion beam with which a sample is irradiated from an ion gun to be in a range of 200 μm to 350 μm. The device includes: the ion gun that ionizes a gas supplied from the outside, and emits an ion beam; a gas-flow-rate varying unit that varies a flow rate of the gas supplied to the ion gun; and a current measurement unit that measures a current value of the ion beam emitted from the ion gun. The gas-flow-rate varying unit sets a gas flow rate to be higher than a gas flow rate at which the ion beam current has a maximum value based on the current value measured by the current measurement unit and the flow rate of the gas determined by the gas-flow-rate varying unit.

公开(公告)号：US20160126057A1

公开(公告)日：2016-05-05

申请号：US14890936

申请日：2014-04-28

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Asako KANEKO ,  Hisayuki TAKASU ,  Hirobumi MUTOU ,  Toru IWAYA ,  Mami KONOMI

IPC: H01J37/20 ,  G01K1/14 ,  H01J37/30

CPC classification number: H01J37/20 ,  G01K1/14 ,  G01N1/32 ,  H01J37/30 ,  H01J37/3002 ,  H01J37/3023 ,  H01J37/3053 ,  H01J2237/002 ,  H01J2237/026 ,  H01J2237/08 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01J2237/20271 ,  H01J2237/20285 ,  H01J2237/317

Abstract: The present invention aims at providing an ion milling apparatus for emitting an ion beam to a sample to process the sample and capable of controlling the temperature of the sample with high accuracy regardless of deformation or the like of the sample being irradiated with the ion beam, and proposes an ion milling apparatus including at least one of a shield holding member for supporting a shield for shielding the sample from the ion beam while exposing a part of the sample to the ion beam; a shifting mechanism for shifting a surface of the sample stand in contact with the sample following deformation of the sample during irradiation with the ion beam, the shifting mechanism having a temperature control mechanism for controlling temperature of at least one of the shield holding member and the sample stand; and a sample holding member disposed between the shield and the sample, the sample holding member deforming following deformation of the sample during irradiation with the ion beam, for example.

Abstract translation: 本发明的目的在于提供一种离子铣削装置，用于将离子束发射到样品以处理样品并且能够高精度地控制样品的温度，而不管样品被离子束照射的变形等， 并提出了一种离子铣削装置，其包括屏蔽保持构件中的至少一个，用于支撑用于将样品从离子束屏蔽的屏蔽，同时将一部分样品暴露于离子束; 移动机构，用于使样品台的表面在与离子束照射期间发生变形之后与试样接触而移动，所述移动机构具有温度控制机构，用于控制至少一个屏蔽保持部件和 样品台 以及设置在所述屏蔽体和所述试样之间的样品保持部件，所述样品保持部件例如在用所述离子束照射时，随着所述样品的变形而发生变形。