Abstract:
An apparatus for thermal ablation testing is provided. The apparatus comprises a chamber; an optically transparent window in the chamber; a sample holder inside the chamber; a test sample in the sample holder; a number of bare-wire thermocouples connected to the test sample, wherein the thermocouples generate temperature data in the form of voltage; a mass balance inside the chamber, wherein the mass balance is configured to hold the sample holder and dynamically detect changes in mass of the test sample; an external radiant heat source configured to heat the test sample through the window; a plasma source configured to generate a number of atomic species in the chamber; and a pyrometer directed at the test sample.
Abstract:
The present invention relates to a technology for increasing the reliability of measurement by preventing the contamination of a self-plasma chamber provided in order to monitor a deposition operation performed in a process chamber, and has a shielding means capable of preventing an inflow of negative electrode material, which is generated by a sputtering phenomenon, into a discharge chamber when a positive charge of plasma, which is generated in the self-plasma chamber, collides with a negative electrode.
Abstract:
A system for depositing material over a sample in a localized region of the sample, the system including: a vacuum chamber; a thermal mass disposed outside the vacuum chamber; a sample support configured to hold a sample within the vacuum chamber during a sample evaluation process; a charged particle beam column configured to direct a charged particle beam into the vacuum chamber toward the sample such that the charged particle beam collides with the sample in a deposition region; a gas injection system configured to deliver a process gas to the deposition region of the sample; and a thermal isolation shield spaced apart from and disposed between the gas injection system and the sample, wherein the thermal isolation shield has a high thermal conductivity and a low emissivity and is thermally coupled to the thermal mass to transfer heat radiated from the gas injection system to the thermal mass.
Abstract:
A film-forming apparatus comprises: a processing chamber defining a processing space, a first sputter-particle emitter and a second sputter-particle emitter having targets, respectively, from which sputter-particles are emitted in different oblique directions in the processing space, a sputter-particle blocking plate having a passage hole through which the sputter particles emitted from the first sputter-particle emitter and the second sputter-particle emitter pass, a substrate support configured to support a substrate and provided at a side opposite the first sputter-particle emitter and the second sputter-particle emitter with respect to the sputter-particle blocking plate in the processing space, a substrate moving mechanism configured to linearly move the substrate supported on the substrate support, and a controller configured to control the emission of sputter-particles from the first sputter-particle emitter and the second sputter-particle emitter while controlling the substrate moving mechanism to move the substrate linearly.
Abstract:
The invention relates to a charged particle lithography system for exposing a target. The system includes a charged particle beam generator for generating a charged particle beam; an aperture array (6) for forming a plurality of beamlets from the charged particle beam; and a beamlet projector (12) for projecting the beamlets onto a surface of the target. The charged particle beam generator includes a charged particle source (3) for generating a diverging charged particle beam; a collimator system (5a,5b,5c,5d; 72;300) for refracting the diverging charged particle beam; and a cooling arrangement (203) for removing heat from the collimator system, the cooling arrangement comprising a body surrounding at least a portion of the collimator system.
Abstract:
Disclosed herein a light source apparatus that is capable of suppressing a light transmission rate of a debris trap to be lowered and a reflection rate in a light condenser mirror to be lowered. In the light source apparatus, a shielding member is provided having an aperture is provided in front of a stationary type foil trap to limit a solid angle of light emitted from a high temperature plasma. Furthermore, the stationary type foil trap is provided with a driving mechanism to allow the foil trap to be revolved such that an adhesion part of the debris of the foil trap is deviated from a position of the foil trap facing the aperture.
Abstract:
Embodiments of improved methods and apparatus for maintaining low non-uniformity over the course of the life of a target are provided herein. In some embodiments, a method of processing a substrate in a physical vapor deposition chamber includes: disposing a substrate atop a substrate support having a cover ring that surrounds the substrate support such that an upper surface of the substrate is positioned at a first distance above an upper surface of the cover ring; sputtering a source material from a target disposed opposite the substrate support to deposit a film atop the substrate while maintaining the first distance; and lowering the substrate support with respect to the cover ring and sputtering the source material from the target to deposit films atop subsequent substrates over a life of the target.
Abstract:
An inductively coupled plasma source for a focused charged particle beam system includes a dielectric liquid that insulates and cools the plasma chamber. A flow restrictor at an electrical potential that is a large fraction of the plasma potential reducing arcing because the voltage drop in the gas occurs primarily at relative high pressure.
Abstract:
A method for manufacturing a TEM-lamella is disclosed. The method includes: disposing a self-supporting protective structure on a surface of a substrate; bonding the protective structure to the substrate; cutting out a lamella from the substrate using a particle beam so that the lamella remains bonded to at least a portion of the protective structure; fastening a first tool to the lamella; and moving away the lamella from a residual portion of the substrate by moving the first tool relative to the substrate.
Abstract:
An insulation structure provided among a plurality of electrodes for extraction of an ion beam from a plasma generating section is provided. The insulation structure includes an insulation member including a first part connected to a first electrode and a second part connected to a second electrode and configured to support the first electrode to the second electrode, a first cover surrounding at least a part of the first part to protect the first part from contamination particles, and a second cover surrounding at least a part of the second part to protect the second part from contamination particles. At least one of the first part and the second part is made of a machinable ceramic or a porous ceramic.