公开(公告)号：US11827512B2

公开(公告)日：2023-11-28

申请号：US17251236

申请日：2018-09-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Eric Martin ,  Rogelio Cicili ,  Tsuyoshi Yamashita

IPC: B81B7/00 ,  B81B1/00 ,  B81B3/00 ,  B81C1/00 ,  B41J2/045

CPC classification number: B81B7/0006 ,  B41J2/0455 ,  B41J2/0458 ,  B41J2/04541 ,  B41J2/04543 ,  B81B1/00 ,  B81B3/0021 ,  B81C1/00071 ,  B81C1/00095 ,  B81C1/00119 ,  B81B2201/05 ,  B81B2203/0338

Abstract: Examples include a fluidic die. The fluidic die comprises an array of field effect transistors including field effect transistors of a first size and field effect transistors of a second size. At least one connecting member interconnects at least some of the field effect transistors of the array of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having at least one field effect transistor of the first size. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a first respective field effect transistor of the second size interconnected to at least one other field effect transistor of the array.

公开(公告)号：US20180050901A1

公开(公告)日：2018-02-22

申请号：US15240709

申请日：2016-08-18

Applicant: STMicroelectronics Asia Pacific Pte Ltd ,  STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

Inventor： Teck Khim Neo ,  Mauro Pasetti ,  Franco Consiglieri ,  Luca Molinari ,  Andrea Nicola Colecchia ,  Simon Dodd

IPC: B81B7/00 ,  B05B1/24

CPC classification number: B81B7/008 ,  B05B1/24 ,  B05B17/06 ,  B41J2/04501 ,  B41J2/04541 ,  B41J2/04543 ,  B41J2/14016 ,  B41J2/14072 ,  B81B2201/05 ,  B81B2207/012 ,  B81B2207/091

Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

公开(公告)号：US09707557B2

公开(公告)日：2017-07-18

申请号：US14486290

申请日：2014-09-15

Applicant: Cambridge Enterprise Limited

Inventor： Wolfgang Andreas Bauer ,  Wilhelm T. S. Huck ,  Martin Fischlechner

IPC: F15C1/02 ,  B01L3/00 ,  B05D7/22 ,  B05C7/04 ,  B81C1/00 ,  B01F17/00

CPC classification number: B01L3/502707 ,  B01F17/00 ,  B01J2219/00511 ,  B01J2219/0059 ,  B01J2219/00637 ,  B01J2219/00783 ,  B01J2219/00788 ,  B01J2219/00831 ,  B01J2219/00833 ,  B01J2219/00837 ,  B01J2219/0097 ,  B01L2200/0636 ,  B01L2300/0867 ,  B01L2300/16 ,  B01L2300/161 ,  B05C7/04 ,  B05D7/22 ,  B05D7/222 ,  B81B2201/0214 ,  B81B2201/05 ,  B81B2201/052 ,  B81B2201/058 ,  B81C1/00119 ,  B81C1/00206 ,  Y10T137/8593

Abstract: We describe a method of layer-by-layer deposition of a plurality of layers of material onto the wall or walls of a channel of a microfluidic device, the method comprising: loading a tube with a series of segments of solution, a said segment of solution bearing a material to be deposited; coupling said tube to said microfluidic device; and injecting said segments of solution into said microfluidic device such that said segments of solution pass, in turn, through said channel depositing successive layers of material to perform said layer-by-layer deposition onto said wall or walls of said channel. Embodiments of the methods are particularly useful for automated surface modification of plastic, for example PDMS (Poly(dimethylsiloxane)), microchannels. We also describe methods and apparatus for forming double-emulsions.

公开(公告)号：US09138918B2

公开(公告)日：2015-09-22

申请号：US14455745

申请日：2014-08-08

Applicant: Honeywell International Inc.

Inventor： Robert Jon Carlson

IPC: C23F1/00 ,  B29C33/38 ,  H01L21/306 ,  C23F1/02 ,  B81C99/00 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B81B7/00

CPC classification number: B29C33/3842 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B29K2909/00 ,  B29K2995/0037 ,  B81B7/00 ,  B81B2201/05 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C99/009 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/034 ,  C23F1/02 ,  H01L21/30604 ,  Y10T428/24496

Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

Abstract translation: 本发明涉及用作至少部分微机电特征的模具的图案化气凝胶基层。 气凝胶的密度小于MEMS制造中使用的典型材料的密度，例如多晶硅，氧化硅，单晶硅，金属，金属合金等。 因此，可以以明显高于在较致密的材料中形成结构特征的速率的速率在气凝胶层中形成结构特征。 本发明还包括一种图案化气凝胶层以产生这种基于气凝胶的模具的方法。 本发明还包括使用基于气凝胶的模具制造微机电特征的方法。 该方法包括将致密材料层直接沉积在已经形成在气凝胶层中的微机电特征的至少一部分的轮廓上。

公开(公告)号：US20150224498A1

公开(公告)日：2015-08-13

申请号：US14384764

申请日：2013-03-11

Applicant: TOTAL PETROCHEMICALS FRANCE ,  ECOLE SUPERIEURE DE PHYSIQUE ET CHIMIE INDUSTRIELLES DE LA VILLE DE PARIS ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE - CNRS

Inventor： Ammar Azioune ,  Denis Bartolo ,  Bertrand Levache ,  Vincent Studer

IPC: B01L3/00

CPC classification number: B01L3/502707 ,  B01L2200/12 ,  B81B2201/05 ,  B81C1/00206 ,  Y10T29/49

Abstract: The invention relates to a surface treatment method for treating the inner walls of a microchannel made from a polymeric material that is at least partially photocured or thermoset. Said treatment is carried out via irradiation in the air at a wavelength of less than or equal to 300 nm. The invention also relates to a method for manufacturing a microfluidic device including such a surface treatment step.

Abstract translation: 本发明涉及一种用于处理由至少部分光固化或热固性的聚合材料制成的微通道的内壁的表面处理方法。 所述处理通过在空气中以小于或等于300nm的波长的照射进行。 本发明还涉及一种用于制造包括这种表面处理步骤的微流体装置的方法。

公开(公告)号：US20240278285A1

公开(公告)日：2024-08-22

申请号：US18686314

申请日：2022-08-24

Applicant: BIOMENSIO LTD

Inventor： Jyrki KAITILA

IPC: B06B1/06 ,  B81B1/00 ,  B81C1/00 ,  H10N30/076 ,  H10N30/853 ,  H10N30/88

CPC classification number: B06B1/0659 ,  B81B1/002 ,  B81C1/00071 ,  H10N30/076 ,  H10N30/853 ,  H10N30/88 ,  B81B2201/0271 ,  B81B2201/05 ,  B81B2203/0338 ,  B81C2201/0133

Abstract: According to an aspect, there is provided a structure for a thin-film bulk acoustic resonator. The structure comprises a substrate (101) comprising a cavity (104) having at least one slanted flat surface (103) facing away from the cavity and a piezoelectric bulk material layer (102) deposited on said at least one slanted flat surface.

公开(公告)号：US20240189815A1

公开(公告)日：2024-06-13

申请号：US18531467

申请日：2023-12-06

Applicant: ANALOG DEVICES, INC.

Inventor： David Frank Bolognia

IPC: B01L3/00 ,  B81B7/00

CPC classification number: B01L3/502715 ,  B81B7/0096 ,  B01L2300/0645 ,  B01L2300/0663 ,  B01L2300/123 ,  B01L2300/1827 ,  B01L2300/1894 ,  B81B2201/05 ,  B81B2207/03 ,  B81B2207/07

Abstract: A sensor assembly may include an integrated circuit die. A sensor assembly may include an interconnect connected to the integrated circuit die. A sensor assembly may include an interposer mounted over and connected to the interconnect. A sensor assembly may include a heating element disposed in or on the interposer. A sensor assembly may include a sensor configured to transduce a property of one or more sample fluids. A sensor assembly may include a thermal pathway between the sensor and the heating element.

公开(公告)号：US11752499B2

公开(公告)日：2023-09-12

申请号：US17507112

申请日：2021-10-21

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Sung-Yi Yang ,  Pao-Chuan Wang

IPC: B01L3/00 ,  B81B7/00 ,  B81C3/00 ,  B32B3/30 ,  B32B3/26 ,  B32B7/12 ,  B32B27/08

CPC classification number: B01L3/502707 ,  B01L3/502715 ,  B32B3/266 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B81B7/0025 ,  B81C3/001 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0883 ,  B01L2300/0887 ,  B32B2307/73 ,  B81B2201/05 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81C2203/032

Abstract: A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

公开(公告)号：US11740148B2

公开(公告)日：2023-08-29

申请号：US17021694

申请日：2020-09-15

Applicant: CareFusion 303, Inc.

Inventor： Timothy Adam Walsh ,  Christian Sandmann

IPC: G01L9/00 ,  B81B3/00 ,  A61M5/168 ,  A61M5/172 ,  C30B29/06 ,  H10N30/30

CPC classification number: G01L9/0022 ,  A61M5/16854 ,  A61M5/16877 ,  A61M5/16886 ,  A61M5/172 ,  B81B3/0021 ,  C30B29/06 ,  H10N30/308 ,  A61M2205/3331 ,  A61M2205/3334 ,  A61M2205/3368 ,  B81B2201/0264 ,  B81B2201/05

Abstract: A sensor for use in a fluid flow application is provided. The sensor includes an inlet chamber configured to receive a fluid flow from a first conduit, an outlet chamber configured to provide the fluid flow to a second conduit, and a membrane separating the inlet chamber from the outlet chamber, the membrane including a fluid passage to allow the fluid flow from the inlet chamber to the outlet chamber. The sensor also includes a circuit component disposed on the membrane, having an electrical property configured to change according to a deformation of the membrane, and a conductor formed on a substrate and coupled with the circuit component, to provide an electrical signal based on a change in the electrical property of the circuit component. The membrane includes an epitaxial layer formed on the substrate. Methods for fabricating and using the above sensor are also presented.

公开(公告)号：US20190071663A1

公开(公告)日：2019-03-07

申请号：US16175500

申请日：2018-10-30

Applicant: Purigen Biosystems, Inc.

Inventor： Lewis A. MARSHALL ,  Amy L. HIDDESSEN ,  Nathan P. HOVERTER ,  Klint A. ROSE ,  Juan G. Santiago

IPC: C12N15/10 ,  C12Q1/6806 ,  G01N27/447

CPC classification number: C12N15/101 ,  B01L3/502753 ,  B01L2300/0627 ,  B01L2300/0867 ,  B81B1/004 ,  B81B7/0087 ,  B81B2201/0278 ,  B81B2201/05 ,  B81B2203/0338 ,  C12N15/10 ,  C12Q1/6806 ,  G01N27/44704 ,  G01N27/4473 ,  G01N27/44739 ,  G01N27/44791 ,  G01N27/44795 ,  C12Q2565/125

Abstract: The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.