公开(公告)号：US09527944B2

公开(公告)日：2016-12-27

申请号：US13693935

申请日：2012-12-04

Applicant: NITTO DENKO CORPORATION

Inventor： Akiko Tanaka ,  Aimi Matsuura ,  Katsuhiko Kamiya ,  Masatsugu Higashi ,  Mizue Yamasaki

IPC: C08F265/06 ,  C08F271/02 ,  C09D151/00 ,  G06F3/00 ,  H05K1/03 ,  C08F265/04 ,  C09J7/02 ,  C09J151/00 ,  G06F3/044

CPC classification number: C08F265/06 ,  C08F265/04 ,  C08F271/02 ,  C08L25/04 ,  C09D151/003 ,  C09J7/29 ,  C09J151/003 ,  C09J2201/602 ,  C09J2203/318 ,  C09J2425/00 ,  C09J2451/00 ,  G06F3/044 ,  H05K1/0306 ,  C08F212/08

Abstract: Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 μm.

Abstract translation: 提供一种透明导电膜用粘合剂层，其具有图案化的透明导电薄膜，该透明导电薄膜作为透明导电膜的压敏粘合剂层具有透明性，并且可以防止图案化的透明导电薄膜降低外观 导电膜。 一种用于具有图案化透明导电薄膜的透明导电膜的压敏粘合剂层，其中所述压敏粘合剂层由丙烯酸类压敏粘合剂组合物制成，所述组合物包含：100重量份由丙烯酸类聚合物获得的丙烯酸类聚合物 包含（甲基）丙烯酸烷基酯的单体组分的聚合; 和30〜150重量份的苯乙烯系低聚物，所述粘合剂层的折射率为1.50以上，所述粘合剂层的厚度为30度时的雾度为2％以下 μm。

公开(公告)号：US20160334549A1

公开(公告)日：2016-11-17

申请号：US15130808

申请日：2016-04-15

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.

Inventor： Meng LI ,  Gang LI

IPC: G02B1/16 ,  G02B5/30 ,  C09J7/02

CPC classification number: G02B1/16 ,  C09J7/243 ,  C09J7/29 ,  C09J2201/134 ,  C09J2201/602 ,  C09J2203/318 ,  C09J2400/243 ,  C09J2400/263 ,  C09J2400/283 ,  C09J2423/046 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  G02B5/3025 ,  G02B5/3033

Abstract: The present disclosure provides an antistatic film and a polarizer attachment device. The antistatic film includes a static electricity elimination layer configured to eliminate static charges and an adhesive layer arranged at one surface of the static electricity elimination layer. According to the present disclosure, it is able to directly attach the antistatic film onto a bearing platform of the polarizer attachment device.

Abstract translation: 本公开提供了一种抗静电膜和偏振器附着装置。 所述抗静电膜包括构造成消除静电荷的静电消除层和布置在所述静电消除层的一个表面处的粘合剂层。 根据本公开，能够将抗静电膜直接附着在偏光板安装装置的轴承平台上。

公开(公告)号：US09490228B2

公开(公告)日：2016-11-08

申请号：US14229003

申请日：2014-03-28

Applicant: Kyoung Soo Park ,  Soon Young Kwon ,  Ji Yeon Kim ,  Young Woo Park ,  Jae Sun Han ,  Ja Young Hwang

Inventor： Kyoung Soo Park ,  Soon Young Kwon ,  Ji Yeon Kim ,  Young Woo Park ,  Jae Sun Han ,  Ja Young Hwang

IPC: H01L23/00 ,  C09J9/02 ,  C09J7/00 ,  C09J11/00 ,  H05K3/32 ,  C08K7/16 ,  C08K9/02

CPC classification number: H01L24/29 ,  C08K7/16 ,  C08K9/02 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13013 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29471 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/15788 ,  H05K3/323 ,  Y10T428/24959 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).

Abstract translation: 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。 在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径 的导电粒子）。

公开(公告)号：US20160280965A1

公开(公告)日：2016-09-29

申请号：US14997130

申请日：2016-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji MOTOMURA

IPC: C09J7/02 ,  C09J9/02 ,  H05K3/00 ,  C09J5/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: C09J9/02 ,  C09J163/00 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2481/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2924/351 ,  H05K1/141 ,  H05K3/323 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10727 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

Abstract translation: 膜材料包括基板和布置在基板的一个主表面上的膜层。 膜层含有未固化或半固化状态的纤维状第一树脂和热固性第二树脂，第一树脂的线膨胀系数CF小于固化状态下的第二树脂的线膨胀系数CR。

公开(公告)号：US09441086B2

公开(公告)日：2016-09-13

申请号：US14650733

申请日：2013-12-13

Applicant: Dow Corning Corporation

Inventor： John Albaugh ,  Brian Chislea ,  Adriana Zambova

IPC: C08K3/08 ,  C09J9/02 ,  C08K3/04 ,  H05K1/03 ,  C08K9/02 ,  C09J183/04 ,  H01B1/22 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20

CPC classification number: C08K3/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08K3/04 ,  C08K3/041 ,  C08K5/56 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L83/00 ,  C09J9/02 ,  C09J183/04 ,  C09J2201/602 ,  H01B1/22 ,  H05K1/0373 ,  C08L83/04

Abstract: A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.

Abstract translation: 一种含有可固化的有机硅氧烷组合物，银和除了银以外的至少一种导电金属的可固化的硅氧烷组合物，可固化的有机硅组合物可以由总银浓度为50至小于60重量％表征，触变指数可调 根据TI测试方法测量的3至10，而组合物可固化至根据体积电阻率测试方法测量的体积电阻率小于0.001欧姆厘米的导电硅酮粘合剂，而不增加导电性金属的总浓度 可固化硅氧烷组合物至72重量％或更高，导电硅氧烷粘合剂，包括导电硅树脂粘合剂的电气装置，以及制造电气装置的方法。

公开(公告)号：US09437346B2

公开(公告)日：2016-09-06

申请号：US14049243

申请日：2013-10-09

Applicant: Kyoung Hun Shin ,  Do Hyun Park ,  Hyun Joo Seo ,  Young Ju Shin ,  Kyu Bong Kim ,  Woo Jun Lim

Inventor： Kyoung Hun Shin ,  Do Hyun Park ,  Hyun Joo Seo ,  Young Ju Shin ,  Kyu Bong Kim ,  Woo Jun Lim

IPC: H01B1/22 ,  H01L23/60 ,  H01L23/00

CPC classification number: H01B1/22 ,  C09J2201/602 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/32135 ,  H01L2224/32225 ,  H01L2224/81903 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

Abstract: A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

Abstract translation: 使用各向异性导电粘合剂组合物连接的半导体器件，所述各向异性导电粘合剂组合物包含热固性聚合引发剂; （甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯，其中（甲基）丙烯酸四氢糠酯或（甲基）丙烯酸糠酯以组合物中总重量的1重量％至25重量％的量存在于组合物中 组合固体含量。

公开(公告)号：US20160152872A1

公开(公告)日：2016-06-02

申请号：US14892243

申请日：2014-05-29

Applicant: NITTO DENKO CORPORATION

Inventor： Kenji FURUTA ,  Yoshio TERADA

IPC: C09J11/04 ,  C09J133/08 ,  C09J7/02 ,  C09K5/14

CPC classification number: C09J11/04 ,  C08K3/22 ,  C08K2003/2227 ,  C09J7/38 ,  C09J9/00 ,  C09J133/08 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2433/00 ,  C09K5/14 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/10 ,  C08F220/58

Abstract: A thermally-conductive pressure-sensitive adhesive sheet according to the present invention includes a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 μm.

Abstract translation: 根据本发明的导热粘合片包括含有导热颗粒的压敏粘合剂层。 片材的一侧是粘合面，另一面是非粘合面。 导热性粘合片可以在粘合剂层的一侧或多于一侧包含非粘合层。 在这种情况下，非粘合层的厚度与粘合剂层的厚度的比优选为0.04〜0.6。 导热性粘合片的热阻优选为6K·cm 2 / W以下。 导热性粘合片的总厚度优选为50〜500μm。

公开(公告)号：US09273234B2

公开(公告)日：2016-03-01

申请号：US13726797

申请日：2012-12-26

Applicant: HUHTAMAKI FILMS GERMANY GMBH & CO. KG

Inventor： Siegfried Schmitzer ,  Jürgen Panhans

IPC: B32B15/085 ,  C09J7/02 ,  B32B15/09 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  C08L65/00

CPC classification number: C09J7/0232 ,  B32B15/085 ,  B32B15/09 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2250/242 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/21 ,  B32B2307/748 ,  C08L65/00 ,  C09J7/405 ,  C09J2201/602 ,  C09J2423/006 ,  C09J2453/006 ,  C09J2483/005 ,  Y10T156/10 ,  Y10T428/31533 ,  Y10T428/31663

Abstract: Release film furnished on at least one side with a release layer (c) based on at least one cured polysiloxane, the film comprising at least one inner layer (a) based on at least one thermoplastic polymer, equipped with at least one at least oligomeric compound having a long-term antistatic effect, as antistat, and at least one layer (b) based on at least one thermoplastic polymer; method for producing the release film, and the use thereof as a detachable protective or masking film.

Abstract translation: 基于至少一种固化的聚硅氧烷在至少一侧上具有释放层（c）的剥离膜，所述膜包含至少一种内层（a），所述至少一层内层（a）基于至少一种热塑性聚合物，其至少配有至少一种至少一种低聚物 具有长期抗静电效果的化合物，作为抗静电剂，以及至少一种基于至少一种热塑性聚合物的层（b）; 脱模膜的制造方法及其作为可拆卸保护膜或掩模膜的用途。

公开(公告)号：US09252346B2

公开(公告)日：2016-02-02

申请号：US14463452

申请日：2014-08-19

Applicant: LG Electronics Inc.

Inventor： Byungjoon Rhee

IPC: H01L27/15 ,  H01L29/267 ,  H01L33/00 ,  H01L31/0203 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/12 ,  H01L29/40 ,  H01L33/62 ,  C09J9/02 ,  H01L23/00 ,  H01L33/36 ,  H01L51/52 ,  H01L33/38 ,  H01L23/482 ,  H01L23/532 ,  H01L23/492

CPC classification number: H01L33/62 ,  C09J9/02 ,  C09J2201/602 ,  H01L23/4828 ,  H01L23/4922 ,  H01L23/5328 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L33/36 ,  H01L33/38 ,  H01L51/5246 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/1411 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29561 ,  H01L2224/29644 ,  H01L2224/29655 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2225/1058 ,  H01L2924/12041 ,  H01L2924/156 ,  H01L2924/35 ,  H01L2924/36 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83

Abstract: A semiconductor device includes an electrode including a plurality of pillars, a semiconductor element configured to be electrically-connected with the electrode, a substrate having electrode patterns, and a conductive adhesive layer located between the substrate and the electrode, the conductive adhesive layer including conductive substances configured to electrically-connect the pillars and the electrode patterns to each other, and including a body which encloses the conductive substances.

Abstract translation: 一种半导体器件包括：包括多个柱的电极，被配置为与电极电连接的半导体元件，具有电极图案的基板和位于基板和电极之间的导电粘合剂层，导电粘合剂层包括导电 构造为将柱和电极图案彼此电连接的物质，并且包括包围导电物质的主体。

公开(公告)号：US20150318227A1

公开(公告)日：2015-11-05

申请号：US14650594

申请日：2014-01-16

Applicant: TORAY INDUSTRIES, INC.

Inventor： Akira SHIMADA ,  Koichi AOKI

IPC: H01L23/29 ,  C09J7/02 ,  C09J179/08 ,  H01L23/495

CPC classification number: H01L23/295 ,  C08G59/4042 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/003 ,  C09J7/28 ,  C09J9/00 ,  C09J163/00 ,  C09J179/08 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2479/08 ,  H01L23/293 ,  H01L23/3737 ,  H01L23/49568 ,  H01L2924/0002 ,  Y10T428/2804 ,  Y10T428/31721 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

Abstract translation: 本发明的目的是提供一种具有高导热性和优异粘合性的粘合剂组合物，其中控制导热填料的分散性，并且可以减轻冷/加热循环试验中的热应力。 一种含有可溶性聚酰亚胺（A），环氧树脂（B）和导热性填料（C）的粘合剂组合物，其特征在于含有三种具有特定结构的二胺残基，其含量 相对于100重量份的可溶性聚酰亚胺（A），环氧树脂（B）为30〜100重量份。