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11.发明申请公开(公告)号：US20160278218A1
公开(公告)日：2016-09-22
申请号：US15170444
申请日：2016-06-01
Applicant: Intel Corporation
Inventor： Yikang Deng
CPC classification number: H05K3/42 , G01N21/64 , G01N21/643 , G01N21/6456 , G01N21/95 , G01N2021/6439 , G01N2021/646 , H05K1/0269 , H05K1/0274 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/0011 , H05K3/426 , H05K3/4644 , H05K2201/0302 , H05K2201/0326 , H05K2201/0329 , H05K2203/163 , Y10T29/49165
Abstract: A microelectronic substrate having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material. In one embodiment, the plated through hole may comprise a hole defined to extend from a first surface to an opposing second surface of the substrate core, wherein a conductive material layer is formed on a sidewall(s) of the substrate core hole and a conductive fill material, having a fluorescent component, is disposed to fill the remaining substrate core hole after forming the conductive material layer. In another embodiment of the present description, the fluorescent conductive fill material is used for the detection of defects.
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公开(公告)号：US20160044780A1
公开(公告)日：2016-02-11
申请号：US14820978
申请日：2015-08-07
Applicant: IBIDEN CO., LTD.
Inventor： Yasushi INAGAKI , Kota NODA
CPC classification number: H05K1/111 , H05K1/0271 , H05K1/0296 , H05K1/09 , H05K1/115 , H05K3/007 , H05K3/06 , H05K3/061 , H05K3/188 , H05K3/202 , H05K3/205 , H05K3/4007 , H05K3/4069 , H05K2201/0302 , H05K2201/0341 , H05K2201/0367 , H05K2201/09563 , H05K2201/098 , H05K2203/06 , Y02P70/611
Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.
Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层 覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。
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13.发明申请Transparent conductive electrodes comprising surface functionalized metal nanowires, their structure design, and method of making such structures 有权包括表面官能化金属纳米线的透明导电电极，其结构设计和制造这种结构的方法公开(公告)号：US20150162112A1
公开(公告)日：2015-06-11
申请号：US14361057
申请日：2014-04-03
Applicant: Nuovo Film, Inc.
Inventor： Hakfei Poon
CPC classification number: H01B13/30 , G06F3/041 , G06F2203/04103 , G06F2203/04112 , H01B1/02 , H01B1/22 , H01L31/022466 , H01L31/1884 , H05K1/0274 , H05K1/0298 , H05K1/03 , H05K1/09 , H05K2201/0302 , H05K2201/032
Abstract: Discloses herein is a method to make a transparent conductive electrode. The methods comprises providing a substrate, forming a film comprising a first region having a plurality of metal nanowires, wherein at least some of metal nanowires are surface functionalized and inert to oxidation or acid reactions; evaporating away the solvent in the metal nanowire film; exposing the nanowire film to a chemical reagent; forming a second region comprising nanowires, and annealing the film having the first and second region, wherein the resistivity difference between the first and second region is more than 1000.
Abstract translation: 本文公开了制造透明导电电极的方法。 所述方法包括提供基底，形成包含具有多个金属纳米线的第一区域的膜，其中至少一些金属纳米线被表面官能化并对氧化或酸反应是惰性的; 蒸发掉金属纳米线膜中的溶剂; 将纳米线膜暴露于化学试剂; 形成包括纳米线的第二区域，以及退火具有第一和第二区域的膜，其中第一和第二区域之间的电阻率差大于1000。
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14.发明授权Device components with surface-embedded additives and related manufacturing methods 有权具有表面嵌入添加剂的器件组件及相关制造方法公开(公告)号：US08749009B2
公开(公告)日：2014-06-10
申请号：US13205526
申请日：2011-08-08
Applicant: Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
IPC: H01L31/00 , H01L31/048 , H01L31/0216
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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15.发明申请公开(公告)号：US20120204950A1
公开(公告)日：2012-08-16
申请号：US13503772
申请日：2010-11-02
Applicant: Shlomo Magdassi , Michael Grouchko , Michael Layani
Inventor： Shlomo Magdassi , Michael Grouchko , Michael Layani
IPC: H01L31/0216 , H01L23/48 , B32B3/26 , B32B3/24 , H01L21/283 , B05D5/12 , B82Y40/00 , B82Y30/00
CPC classification number: H05B33/28 , B05D3/107 , B05D5/061 , B05D5/12 , C23C4/18 , C23C16/513 , C23C26/00 , H01B1/02 , H01B1/026 , H01B1/10 , H01L31/022466 , H01L31/1884 , H01L33/42 , H01L2924/0002 , H01L2933/0016 , H05K1/0225 , H05K1/0278 , H05K1/0306 , H05K1/0313 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/095 , H05K1/097 , H05K3/125 , H05K3/14 , H05K2201/0257 , H05K2201/026 , H05K2201/0302 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2201/0391 , H05K2201/0969 , H05K2201/10053 , H05K2201/10106 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/0545 , H05K2203/1173 , H05K2203/125 , Y02E10/50 , Y10T428/24273 , Y10T428/24331 , Y10T428/249978 , Y10T428/249979 , H01L2924/00
Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.
Abstract translation: 本发明提供了用于制造导电透明膜的方法和包括其的电子或光电子器件。
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Patent Agency Ranking
公开(公告)号：US20240074046A1
公开(公告)日：2024-02-29
申请号：US17899336
申请日：2022-08-30
Applicant: Intel Corporation
Inventor： Ziyin Lin , Karumbu Nathan Meyyappan , Dingying Xu
CPC classification number: H05K1/11 , H05K1/181 , H05K3/46 , H05K2201/0302 , H05K2201/10378
Abstract: Technologies for integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails socket can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a foam cap layer that seals the liquid metal interconnects, electrically coupling the nails to the liquid metal interconnects. A fabric layer adjacent to the foam cap layer helps secure the foam cap layer, preventing small pieces of the foam cap layer that may be dislodged during repeated insertion into a bed of nails socket from becoming separated from the foam cap layer. The fabric layer can provide additional benefits, such as removing more of the liquid metal from the nails when the integrated circuit component is removed from the bed of nails socket.
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17.发明公开公开(公告)号：US20230337353A1
公开(公告)日：2023-10-19
申请号：US17720685
申请日：2022-04-14
Applicant: Hamilton Sundstrand Corporation
Inventor： John Dickey , Kevin Kilroy
CPC classification number: H05K1/0207 , H05K1/021 , H05K1/09 , H05K1/181 , H05K3/107 , H05K2201/0302 , H05K2201/032 , H05K2201/10166
Abstract: Circuit board assemblies include a circuit board portion having a recess formed therein, an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion, an electrically and thermally conductive layer adapted and configured to interface with an external chassis, and a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.
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公开(公告)号：US09980393B2
公开(公告)日：2018-05-22
申请号：US14704597
申请日：2015-05-05
Inventor： Yong Sung Eom , Kwang-Seong Choi , Hyun-cheol Bae , Jung Hyun Noh , Jong Tae Moon
CPC classification number: H05K3/1216 , C25D5/02 , H01B1/02 , H01B1/22 , H05K1/09 , H05K1/095 , H05K3/102 , H05K3/188 , H05K3/246 , H05K2201/0245 , H05K2201/0302 , H05K2203/0425
Abstract: A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.
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公开(公告)号：US20180070442A1
公开(公告)日：2018-03-08
申请号：US15693523
申请日：2017-09-01
Applicant: FANUC CORPORATION
Inventor： Takeshi SAWADA , Yuichi OKOCHI , Norihiro SAIDO
CPC classification number: H05K1/0268 , G01R31/021 , H05K1/141 , H05K3/321 , H05K3/3436 , H05K2201/0302
Abstract: To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.
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公开(公告)号：US09807848B2
公开(公告)日：2017-10-31
申请号：US14792092
申请日：2015-07-06
Inventor： Shlomo Magdassi , Michael Grouchko , Michael Layani
IPC: H05B33/28 , H01B1/02 , H01B1/10 , H01L31/0224 , C23C4/18 , C23C26/00 , H01L31/18 , H05K1/03 , H05K1/09 , H05K3/12 , C23C16/513 , B05D3/10 , B05D5/06 , B05D5/12 , H01L33/42 , H05K1/02 , H05K3/14
CPC classification number: H05B33/28 , B05D3/107 , B05D5/061 , B05D5/12 , C23C4/18 , C23C16/513 , C23C26/00 , H01B1/02 , H01B1/026 , H01B1/10 , H01L31/022466 , H01L31/1884 , H01L33/42 , H01L2924/0002 , H01L2933/0016 , H05K1/0225 , H05K1/0278 , H05K1/0306 , H05K1/0313 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/095 , H05K1/097 , H05K3/125 , H05K3/14 , H05K2201/0257 , H05K2201/026 , H05K2201/0302 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2201/0391 , H05K2201/0969 , H05K2201/10053 , H05K2201/10106 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/0545 , H05K2203/1173 , H05K2203/125 , Y02E10/50 , Y10T428/24273 , Y10T428/24331 , Y10T428/249978 , Y10T428/249979 , H01L2924/00
Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.
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