公开(公告)号：US08105710B2

公开(公告)日：2012-01-31

申请号：US12096668

申请日：2006-12-14

Applicant: Masao Kondou ,  Yasuo Akai ,  Yoshihisa Ikeda ,  Tomoyuki Shose

Inventor： Masao Kondou ,  Yasuo Akai ,  Yoshihisa Ikeda ,  Tomoyuki Shose

IPC: H01M6/12 ,  H01M2/00 ,  H01M2/02 ,  H01M2/04

CPC classification number: H05K3/3426 ,  H01M2/0222 ,  H01M2/10 ,  H01M2/204 ,  H01M2/30 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/09681 ,  Y02P70/613

Abstract: A battery 10A with leads has a low-profile external casing acting 11 as one of a pair of electrode terminals and a closure plate 12 acting as the other of the electrode terminals. The closure plate 12 hermetically seals an opening of the external casing 11 via an insulating gasket. A pair of lead plates 13 and 14 are each welded to a different one of the electrode terminals 11 and 12. One of the lead plates 13 and 14 is secured to a circuit board X. The lead plate 14 that is secured to the circuit board has a net-like structure.

Abstract translation: 具有引线的电池10A具有作为一对电极端子和作为另一个电极端子的封闭板12之一的低外形外壳。 闭合板12通过绝缘垫片密封外壳11的开口。 一对引线板13和14分别焊接到不同的一个电极端子11和12中。一个引线板13和14被固定到电路板X上。引线板14固定到电路板 有网状结构。

公开(公告)号：US08030578B2

公开(公告)日：2011-10-04

申请号：US11496593

申请日：2006-08-01

Applicant: Yoshiyuki Hiroshima

Inventor： Yoshiyuki Hiroshima

IPC: H05K1/11

CPC classification number: H05K3/3442 ,  B23K1/0016 ,  B23K2101/36 ,  H05K2201/0373 ,  H05K2201/10242 ,  H05K2203/1178 ,  Y02P70/613

Abstract: The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes a column-like electrode body 11 soldered to the electronic component 12 and to the substrate 13. The electrode has grooves as an air discharging device discharging the air 15a in air voids 15 generated within the solder 14 between joint surfaces 11a, 11b of the electrode body 11 and the electronic component 12 or the substrate 13 when the electrode body 11 is soldered to the electronic component 12 or the substrate 13.

Abstract translation: 本发明是一种电极10，其被设置为焊接到电子部件12上，并且当将电子部件12安装在基板13上时焊接到基板13.电极10包括焊接的柱状电极体11 电子部件12和基板13.电极具有作为排气装置的槽，该排气装置在电极体11的接合表面11a，11b和电子部件12之间在焊料14内产生的空气中排出空气15a，或 电极体11被焊接到电子部件12或基板13时的基板13。

公开(公告)号：US20110201214A1

公开(公告)日：2011-08-18

申请号：US12837517

申请日：2010-07-16

Applicant: Ryou MATSUBARA ,  Shouichi Mimura ,  Hirotsugu Fusayasu ,  Masafumi Kumoi ,  Toshiyuki Nakaie

Inventor： Ryou MATSUBARA ,  Shouichi Mimura ,  Hirotsugu Fusayasu ,  Masafumi Kumoi ,  Toshiyuki Nakaie

IPC: H01R12/14 ,  H01R24/00 ,  H05K1/11

CPC classification number: H01R43/16 ,  H01R12/724 ,  H01R13/6582 ,  H05K1/111 ,  H05K1/141 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/10818 ,  Y02P70/611

Abstract: A receptacle structure includes a housing structure, a terminal insulating board, a first terminal and a second terminal. The housing structure is configured to be mounted on a printed wiring board and to accommodate a plug. The terminal insulating board includes a top face and a bottom face that is opposite to the top face. The terminal insulating board is disposed inside the housing structure with the bottom face facing towards the printed wiring board. The first terminal is connected to the printed wiring board via the first rear connection part and to the terminal insulating board. The second terminal is connected to the printed wiring board via the first front connection part and to the terminal insulating board. The first front connection part has a width narrower than the first rear connection part and is connected to the printed wiring board away from the first rear connection part.

Abstract translation: 插座结构包括壳体结构，端子绝缘板，第一端子和第二端子。 壳体结构被配置为安装在印刷线路板上并容纳插头。 端子绝缘板包括顶面和与顶面相对的底面。 端子绝缘板设置在壳体结构内部，底面朝向印刷线路板。 第一端子经由第一后连接部和端子绝缘板与印刷电路板连接。 第二端子经由第一前连接部和端子绝缘板与印刷电路板连接。 第一前连接部分具有比第一后连接部分窄的宽度，并且与第一后连接部分连接到印刷线路板。

公开(公告)号：US07971349B2

公开(公告)日：2011-07-05

申请号：US12382876

申请日：2009-03-26

Applicant: Masaaki Tanaka ,  Kimiharu Kayukawa

Inventor： Masaaki Tanaka ,  Kimiharu Kayukawa

IPC: H05K3/30

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R12/52 ,  H01R43/0256 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0382 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49213 ,  H01L2224/05599

Abstract: In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness greater than a hardness of each of the first and second bumps. The first and second members are positioned with respect to each other such that the first and second bumps face each other. The tip portion of the first bump is brought into contact with a tip portion of the second bump by sticking the projection into the tip portion of the second bump.

Abstract translation: 在第一构件的表面上的第一凸块与第二构件的表面上的第二凸块接合的方法中，第一凸块的前端部设置有硬度大于硬度的突起 第一和第二颠簸。 第一和第二构件相对于彼此定位成使得第一和第二凸起面对彼此。 第一凸起的顶端部通过将突起粘贴到第二凸块的顶端部而与第二凸块的前端部接触。

公开(公告)号：US20110159738A1

公开(公告)日：2011-06-30

申请号：US13059677

申请日：2008-08-22

Applicant: Toshiyuki Imazu ,  Hitoshi Suzuki

Inventor： Toshiyuki Imazu ,  Hitoshi Suzuki

IPC: H01R24/00

CPC classification number: H01R12/51 ,  H01R12/707 ,  H01R12/714 ,  H01R12/716 ,  H01R12/724 ,  H01R13/50 ,  H01R13/504 ,  H01R2107/00 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10189 ,  H05K2201/10969

Abstract: A reinforcing plate fixed to a connector main body is arranged on a bottom surface of the connector main body to come into surface contact with a surface of a substrate while a plurality of holes is provided on a surface, which contacts the substrate, of the reinforcing plate. When the reinforcing plate is soldered to the substrate, therefore, a solder wraps around not only a peripheral edge of the reinforcing plate but also an edge of each of the holes so that a soldering portion between the reinforcing plate and the substrate can be sufficiently ensured.

Abstract translation: 固定到连接器主体的加强板设置在连接器主体的底表面上以与基板的表面进行表面接触，同时在与基板接触的表面上设置多个孔，该加强板与加强件 盘子。 因此，当加强板焊接到基板上时，焊料不仅包围加强板的周缘，而且还包围每个孔的边缘，使得能够充分地确保加强板和基板之间的焊接部分 。

公开(公告)号：US07929314B2

公开(公告)日：2011-04-19

申请号：US12143540

申请日：2008-06-20

Applicant: Arvind K. Sinha ,  Thomas S. Thompson

Inventor： Arvind K. Sinha ,  Thomas S. Thompson

IPC: H01R9/00

CPC classification number: H05K1/111 ,  H05K1/0206 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/0949 ,  H05K2201/0969 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.

Abstract translation: 本公开涉及一种用于改变印刷电路板焊盘结构以增加焊料体积和强度的装置。 本发明提供增加的端排衬垫和引线尺寸，并且利用多个引线对焊盘和焊盘与引线相符的几何结构以形成提供附加焊接表面粘附区域的接头。

公开(公告)号：US07871918B2

公开(公告)日：2011-01-18

申请号：US12368983

申请日：2009-02-10

Applicant: Shyh-Ming Chang

Inventor： Shyh-Ming Chang

IPC: H01L21/44

CPC classification number: H05K3/4007 ,  H01L22/32 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/11515 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13552 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/2919 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09909 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

Abstract translation: 接触结构的制造方法包括首先提供其上已经形成有接触垫的基板。 之后，在接触垫上形成聚合物凸块。 接着，在聚合物凸块上形成导电层。 导电层覆盖聚合物凸块并延伸到聚合物凸块的外部。 延伸到聚合物凸块外部的导电层的部分用作测试垫。

公开(公告)号：US20100326726A1

公开(公告)日：2010-12-30

申请号：US12818542

申请日：2010-06-18

Applicant: Hisao Tanaka ,  Satoshi Emoto ,  Kenichi Nashirozawa ,  Nana Matsushima ,  Takumi Masuyama

Inventor： Hisao Tanaka ,  Satoshi Emoto ,  Kenichi Nashirozawa ,  Nana Matsushima ,  Takumi Masuyama

IPC: H01R4/02

CPC classification number: H05K3/363 ,  G11B5/4846 ,  H05K3/3452 ,  H05K2201/0373 ,  H05K2201/058 ,  H05K2201/098 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2201/2036

Abstract: A solder joint structure include: a first terminal portion including a plurality of first terminal conductors adjacent to each other; a second terminal portion arranged opposite to the first terminal portion and including a plurality of second terminal conductors which are joined to the first terminal conductors; solders electrically connecting the first terminal conductors and the second terminal conductors; and member for suppressing flow of the solders.

Abstract translation: 焊接结构包括：包括彼此相邻的多个第一端子导体的第一端子部分; 第二端子部分，布置成与第一端子部分相对并且包括多个第二端子导体，第二端子导体连接到第一端子导体; 电连接第一端子导体和第二端子导体的焊料; 以及用于抑制焊料流动的部件。

公开(公告)号：US20100271748A1

公开(公告)日：2010-10-28

申请号：US12453635

申请日：2009-05-18

Applicant: Jung Rag Yoon ,  Kyung Min Lee ,  Jeong Woo Han

Inventor： Jung Rag Yoon ,  Kyung Min Lee ,  Jeong Woo Han

IPC: H01G4/008 ,  H01G4/005 ,  B05D5/12

CPC classification number: H01G4/33 ,  H01G4/01 ,  H01G4/1209 ,  H01G4/1218 ,  H05K1/162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2203/135

Abstract: Provided are an embedded capacitor, an embedded capacitor sheet using the embedded capacitor, and a method of manufacturing the same that may increase a surface area to thereby increase a capacity for each unit area and may provide an embedded capacitor in a sheet to thereby readily lay the embedded capacitor on an embedded printed circuit board. The embedded capacitor may include: a common electrode member 11 including a plurality of grooves 11a; a sealing dielectric layer 12 being formed by sealing a nano dielectric powder with a high dielectric constant in the plurality of grooves 11a formed in the common electrode member 11; a buffer dielectric layer 13 sealing and smoothing an uneven portion of the sealing dielectric layer 12 by applying a paste or a slurry including epoxy of 20 Vol % through 80 Vol % and dielectric powder of 20 Vol % through 80 Vol % with respect to the sealing dielectric layer 12; and an individual electrode member 14 being formed on the buffer dielectric layer 13.

Abstract translation: 提供了嵌入式电容器，使用嵌入式电容器的嵌入式电容器片及其制造方法，其可以增加表面积从而增加每个单位面积的容量，并且可以在片材中提供嵌入式电容器，从而容易地铺设 嵌入式电路板上的嵌入式电容器。 嵌入式电容器可以包括：公共电极构件11，其包括多个槽11a; 密封电介质层12通过在形成在公共电极构件11中的多个槽11a中密封具有高介电常数的纳米介电粉末而形成; 缓冲电介质层13，通过将包含20体积％〜80体积％的环氧树脂的糊剂或包含20体积％〜80体积％的电介质粉末的密封，密封介质层12的不均匀部分密封并平滑， 电介质层12; 以及形成在缓冲介电层13上的单独电极部件14。

公开(公告)号：US20100248506A1

公开(公告)日：2010-09-30

申请号：US12410095

申请日：2009-03-24

Applicant: Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

Inventor： Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

IPC: H01R12/00 ,  H01R43/04

CPC classification number: H05K1/111 ,  H01R43/0256 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/09736 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49218

Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

Abstract translation: 提供了一种方法和表面贴装技术（SMT）焊盘结构，用于实现增强的焊点鲁棒性。 SMT焊盘结构包括基板SMT焊盘。 基座SMT焊盘接收用于焊接到SMT焊盘结构的连接器。 在基座SMT焊盘上限定具有选定几何形状的间隔结构，以增加用于连接器的焊点的厚度。