公开(公告)号：US08598601B2

公开(公告)日：2013-12-03

申请号：US13892814

申请日：2013-05-13

Applicant: LG Innotek Co., Ltd.

Inventor： Jun Seok Park

IPC: H01L29/267

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.

Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光器件的透镜，其中所述屏幕部件的横截面形状的宽度大于所述屏幕部件的横截面形状的高度，其中所述透镜设置在所述屏幕部件上，并且其中 透镜连接到屏幕部件的最上表面。

公开(公告)号：US08003997B2

公开(公告)日：2011-08-23

申请号：US13036947

申请日：2011-02-28

Applicant: Park Jun Seok

Inventor： Park Jun Seok

IPC: H01L29/267

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract translation: 本发明公开了一种发光器件封装，包括：金属基底; 电路层，设置在所述金属基座的上侧，用于提供导电路径; 安装在具有比所述金属基底上的第一区域更小的厚度的第二区域中的发光器件; 绝缘层，夹在元基体和电路层之间; 设置在所述电路层的上侧的电极层; 以及用于电连接电极层和发光器件的导线。 此外，提供了一种发光器件封装，其由于将发光器件放置在金属基底的小厚度部分上而提高了发光效率。

公开(公告)号：US20240032210A1

公开(公告)日：2024-01-25

申请号：US18265581

申请日：2021-12-14

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Taiji YANAGIDA ,  Hiroki SHIMODA

IPC: H05K5/00 ,  H05K1/05 ,  H05K1/02 ,  H05K5/03

CPC classification number: H05K5/0069 ,  H05K1/05 ,  H05K1/0212 ,  H05K5/03 ,  H05K2201/06 ,  H05K2201/0206

Abstract: Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; a case accommodating the heat-generating components; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion exposed to an outside of the case and configured to come into thermal contact with an external heat-dissipation target; insulating films covering a contact surface of the heat-dissipating portion, the contact surface being configured to come into contact with the heat-dissipation target; and a thermal conductive filling member that is in thermal contact with the heat-dissipating portion via the insulating films and disposed between the insulating films and the heat-dissipation target.

公开(公告)号：US20230380060A1

公开(公告)日：2023-11-23

申请号：US18364547

申请日：2023-08-03

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA MATERIALS CO., LTD.

Inventor： Takayuki NABA ,  Keiichi YANO ,  Hiromasa KATO

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/38

CPC classification number: H05K1/0306 ,  H05K1/0265 ,  H05K3/388 ,  H05K1/0271 ,  H05K2201/06

Abstract: A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

公开(公告)号：US11778786B2

公开(公告)日：2023-10-03

申请号：US17558655

申请日：2021-12-22

Applicant: TE Connectivity Services GmbH

Inventor： Alan Weir Bucher

IPC: H05K7/20 ,  F28F3/06 ,  H05K1/02

CPC classification number: H05K7/20445 ,  F28F3/06 ,  H05K1/0203 ,  H05K7/2049 ,  H05K7/20472 ,  H05K2201/06

Abstract: A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.

公开(公告)号：US20230232590A1

公开(公告)日：2023-07-20

申请号：US17576700

申请日：2022-01-14

Applicant: Dell Products L.P.

Inventor： Eric Michael Tunks ,  Joseph Andrew Vivio ,  Tyler Baxter Duncan

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20163 ,  H05K7/20209 ,  H05K7/20409 ,  H05K1/0201 ,  H05K2201/06

Abstract: A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

公开(公告)号：US20230164905A1

公开(公告)日：2023-05-25

申请号：US17982913

申请日：2022-11-08

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0212 ,  H05K1/144 ,  H05K2201/06

Abstract: An electronic circuit includes an upper substrate and a lower substrate. An electronic integrated circuit chip is positioned between the upper and lower substrates. The chip includes contact elements coupled to the upper substrate. A first region made of a first material is arranged between the chip and a heat transfer area crossing the lower substrate. A second region filled with a second material couples the lower and upper substrates and laterally surrounds the first region. The first material has a thermal conductivity greater than a thermal conductivity of the second material.

公开(公告)号：US09860986B2

公开(公告)日：2018-01-02

申请号：US15310530

申请日：2015-03-05

Applicant: Auto-Kabel Management GmbH

Inventor： Wacim Tazarine ,  Simon Betscher ,  Frank Gronwald ,  Sohejl Rafati

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  F02N11/08

CPC classification number: H05K1/14 ,  F02N11/0862 ,  F02N11/087 ,  F02N2011/0874 ,  F02N2250/02 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/0287 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/07 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

Abstract: Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.

公开(公告)号：US09826623B2

公开(公告)日：2017-11-21

申请号：US14893255

申请日：2013-12-12

Applicant: KANEKA CORPORATION

Inventor： Aki Koukami ,  Kazuo Hagiwara ,  Keisuke Oguma ,  Kazuhide Fujimoto

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/29 ,  H01L23/373 ,  H05K3/28 ,  H05K1/18 ,  H01L23/31

CPC classification number: H05K1/0209 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/06 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

公开(公告)号：US20170271569A1

公开(公告)日：2017-09-21

申请号：US15612821

申请日：2017-06-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok PARK

IPC: H01L33/64 ,  H01L27/15 ,  H01L33/40 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  F21K9/00 ,  H01L33/52 ,  H05K1/05 ,  H05K1/18 ,  H05K3/24

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package can include a base including a flat top surface; first and second electrical circuit layers on the flat top surface; a light emitting diode on a region of the flat top surface; an optical member to pass light; and a guiding member having a closed loop shape surrounding the region for guiding the optical member, in which the first and second electrical circuit layers respectively include first and second portions disposed between the flat top surface and a bottom surface of the guiding member, in which the first and second electrical circuit layers respectively include first and second extension portions that respectively extend from the first and second portions to locations outside of an outer edge of the guiding member in different directions.