公开(公告)号：US09107313B2

公开(公告)日：2015-08-11

申请号：US14133157

申请日：2013-12-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hyun Lim ,  Jung Eun Kang ,  Heung Soo Park ,  Seog Moon Choi ,  Kwang Soo Kim ,  Joon Seok Chae ,  Sung Keun Park

IPC: H05K7/06 ,  H05K3/10 ,  H05K1/02 ,  H05K3/44 ,  H05K1/05

CPC classification number: H05K3/10 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/108 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/4913

Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Abstract translation: 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。

公开(公告)号：US08978474B2

公开(公告)日：2015-03-17

申请号：US13194574

申请日：2011-07-29

Applicant: Matthew S. Bottkol ,  Richard D. Elliott ,  Michael Y. Feng ,  Thomas F. Marinis ,  Michael F. Mcmanus ,  Shan Mohiuddin ,  Peter G. Sherman ,  John E. Pritchett ,  Jeffery W. Warren ,  Charles H. Lange

Inventor： Matthew S. Bottkol ,  Richard D. Elliott ,  Michael Y. Feng ,  Thomas F. Marinis ,  Michael F. Mcmanus ,  Shan Mohiuddin ,  Peter G. Sherman ,  John E. Pritchett ,  Jeffery W. Warren ,  Charles H. Lange

IPC: G01P15/08 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/0201 ,  H05K2201/047 ,  H05K2201/062 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/4913

Abstract: A micro-electro-mechanical systems (MEMS) inertial measurement system facilitates accurate location and/or attitude measurements via passive thermal management of MEMS inertial sensors. Accuracy of the system is also improved by subjecting the inertial sensors to programmed single-axis gimbal motion, and by performing coarse and fine adjustments to the attitude estimates obtained by the system based on the programmed motion and on the passive thermal management of the sensors.

Abstract translation: 微机电系统（MEMS）惯性测量系统通过MEMS惯性传感器的被动热管理有助于精确定位和/或姿态测量。 通过对惯性传感器进行编程的单轴万向运动，并且通过基于编程的运动和传感器的被动热管理对系统获得的姿态估计进行粗略和精细的调整，也提高了系统的精度。

公开(公告)号：US20140111946A1

公开(公告)日：2014-04-24

申请号：US14143465

申请日：2013-12-30

Applicant: ABB AG

Inventor： Stefan GUTERMUTH

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H05K1/0201 ,  H05K1/0203 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972

Abstract: An arrangement for cooling subassemblies of an automation or control system is disclosed, wherein the subassemblies each comprise at least one printed circuit board (LP) having electronic components of different temperature sensitivity arranged thereon. The printed circuit board (LP) has at least one first portion for temperature-sensitive components and at least one second portion for temperature-insensitive components that generate waste heat. Interspaces are arranged between the first portion and the second portion, the interspaces each forming a thermally insulated trench. Means can be provided which keep away the heat over the temperature-sensitive components in a suitable manner and dissipate the waste heat from the printed circuit board (LP) before the heat reaches the temperature-sensitive components.

Abstract translation: 公开了一种用于冷却自动化或控制系统的子组件的装置，其中每个子组件包括至少一个布置有不同温度敏感度的电子部件的印刷电路板（LP）。 印刷电路板（LP）具有用于温度敏感部件的至少一个第一部分和用于产生废热的不敏感温度部件的至少一个第二部分。 间隙布置在第一部分和第二部分之间，间隙各自形成绝热沟槽。 可以提供能够以合适的方式将热量超过温度敏感部件的装置，并且在热到达温度敏感部件之前散发来自印刷电路板（LP）的废热。

公开(公告)号：US20130048618A1

公开(公告)日：2013-02-28

申请号：US13695870

申请日：2011-03-23

Applicant: Jan van Aalst ,  Drago Kovacic ,  Bostjan Podobnik

Inventor： Jan van Aalst ,  Drago Kovacic ,  Bostjan Podobnik

IPC: B23K26/36

CPC classification number: H05K3/027 ,  B23K26/36 ,  B23K2101/38 ,  H05K2201/062 ,  H05K2201/09363

Abstract: A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

Abstract translation: 使用激光束对导电层的限定区域进行部分分离的方法包括从基板上的导电层形成具有限定路径的导体轨道，该路径限定主轴。 该区域被分割成区域。 沿着每个区域的相应周边设置有线性凹槽。 每个区域具有带状，使得凹部沿着不平行于任一主轴线的基本直线的路径延伸。 使用激光辐射来加热待除去的区域之一，直到导电层与基底的粘合性大大降低，并且在外部影响下将被去除的区域以表面宽度方式从衬底上分离。 激光束参数被设置为使得仅去除导电层而不影响下面的衬底。

公开(公告)号：US20130025369A1

公开(公告)日：2013-01-31

申请号：US13194574

申请日：2011-07-29

Applicant: Matthew S. Bottkol ,  Richard D. Elliott ,  Michael Y. Feng ,  Thomas F. Marinis ,  Michael F. McManus ,  Shan Mohiuddin ,  Peter G. Sherman ,  John E. Pritchett ,  Jeffery W. Warren ,  Charles H. Lange

Inventor： Matthew S. Bottkol ,  Richard D. Elliott ,  Michael Y. Feng ,  Thomas F. Marinis ,  Michael F. McManus ,  Shan Mohiuddin ,  Peter G. Sherman ,  John E. Pritchett ,  Jeffery W. Warren ,  Charles H. Lange

IPC: G01P15/08 ,  H05K3/30

CPC classification number: H05K1/0201 ,  H05K2201/047 ,  H05K2201/062 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/4913

Abstract: A micro-electro-mechanical systems (MEMS) inertial measurement system facilitates accurate location and/or attitude measurements via passive thermal management of MEMS inertial sensors. Accuracy of the system is also improved by subjecting the inertial sensors to programmed single-axis gimbal motion, and by performing coarse and fine adjustments to the attitude estimates obtained by the system based on the programmed motion and on the passive thermal management of the sensors.

Abstract translation: 微机电系统（MEMS）惯性测量系统通过MEMS惯性传感器的被动热管理有助于精确定位和/或姿态测量。 通过对惯性传感器进行编程的单轴万向运动，并且通过基于编程的运动和传感器的被动热管理对系统获得的姿态估计进行粗略和精细的调整，也提高了系统的精度。

公开(公告)号：US08335077B2

公开(公告)日：2012-12-18

申请号：US12812724

申请日：2008-01-31

Applicant: Christopher N. Rijken ,  Mark D. Tupa ,  Michael R. Durham

Inventor： Christopher N. Rijken ,  Mark D. Tupa ,  Michael R. Durham

IPC: H05K7/20

CPC classification number: H05K7/20518 ,  G01K1/20 ,  H05K1/0201 ,  H05K1/18 ,  H05K2201/0187 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2203/304 ,  Y10T29/49135

Abstract: A system contains a temperature sensitive device and a printed circuit board. The temperature sensitive device is coupled to the printed circuit board. An aperture is cut out of the printed circuit board between the temperature sensitive device and a heat generating device to act as an insulator for the temperature sensitive device.

Abstract translation: 系统包含温度敏感设备和印刷电路板。 温度敏感器件耦合到印刷电路板。 在印刷电路板之间，在感温装置和发热装置之间切出孔，作为温度敏感装置的绝缘体。

公开(公告)号：US08330050B2

公开(公告)日：2012-12-11

申请号：US12582224

申请日：2009-10-20

Applicant: Hideaki Sakaguchi ,  Kei Murayama

Inventor： Hideaki Sakaguchi ,  Kei Murayama

IPC: H05K1/03 ,  H05K1/16

CPC classification number: H05K1/0201 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/10329 ,  H01L2924/15311 ,  H05K1/053 ,  H05K2201/062 ,  H05K2201/09663 ,  H05K2201/10522 ,  H05K2201/10674 ,  Y10T156/1056 ,  Y10T156/1064 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board comprises a first pad which is provided on a first surface side of a substrate and on which a first electronic component is to be mounted, and a second pad which is provided on the first surface side of the substrate and on which a second electronic component having a larger amount of heat generation in an operation than that of the first electronic component is to be mounted, a first through electrode which penetrates the substrate and has one of ends connected electrically to the first pad, a second through electrode which penetrates the substrate and has one of ends connected electrically to the second pad, a through trench penetrating the substrate in a portion positioned between a first mounting region for the first electronic component and a second mounting region for the second electronic component, and a heat intercepting member provided in the through trench.

Abstract translation: 布线板包括：第一垫，其设置在基板的第一表面侧上并且第一电子部件将被安装在该第一焊盘上;第二焊盘，设置在所述基板的第一表面侧上， 要安装比第一电子部件更大量的发热量的电子部件，穿过基板并具有与第一焊盘电连接的一端的第一贯通电极，穿过第一贯通电极的第二贯通电极 所述基板具有电连接到所述第二焊盘的端部之一，穿过所述基板的通孔，位于所述第一电子部件的第一安装区域和所述第二电子部件的第二安装区域之间的部分中， 设置在通沟中。

公开(公告)号：US08148643B2

公开(公告)日：2012-04-03

申请号：US11875486

申请日：2007-10-19

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K1/03

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20120049384A1

公开(公告)日：2012-03-01

申请号：US13260893

申请日：2010-03-26

Applicant: Zvi Yaniv ,  Mohshi Yang ,  Peter B. Laxton

Inventor： Zvi Yaniv ,  Mohshi Yang ,  Peter B. Laxton

IPC: H01L23/48 ,  H05K1/11 ,  H05K3/02 ,  H01L21/768 ,  H05K1/09 ,  B82Y99/00 ,  B82Y40/00

CPC classification number: H05K1/092 ,  B22F3/105 ,  B22F7/04 ,  B22F2998/00 ,  B23K26/32 ,  B23K26/34 ,  B23K35/0244 ,  B23K2101/36 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/268 ,  H01L21/288 ,  H01L21/4867 ,  H01L21/76877 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/10 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/4664 ,  H05K2201/062 ,  H05K2203/107 ,  Y10T29/49156 ,  B22F1/0018 ,  H01L2924/00

Abstract: Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

Abstract translation: 导电线被沉积在衬底上以产生用于在电子部件之间传导电力的迹线。 在基板上形成图案化的金属层，然后在图案化的金属层和基板上涂覆具有低热导率的材料层。 通过具有低热导率的材料层形成通孔，从而暴露图案化金属层的部分。 然后将导电油墨膜涂覆在具有低热导率的材料层上并进入通孔中，从而涂覆图案化金属层的部分，然后烧结。 涂覆在图案化金属层的部分上的导电油墨的膜不像在具有低热导率的材料层上涂覆导电油墨的膜那样吸收与烧结相同的能量。 具有低热导率的材料层可以是聚合物，例如聚酰亚胺。

公开(公告)号：US08068346B2

公开(公告)日：2011-11-29

申请号：US10838406

申请日：2004-05-04

Applicant: Josef Maier ,  Daniel M. Lynch

Inventor： Josef Maier ,  Daniel M. Lynch

IPC: H05K7/00

CPC classification number: H01L25/162 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/10166 ,  H01L2924/00

Abstract: A circuit board is provided with a plurality of MOSFETs (metal oxide semiconductor field effect transistors) each of which include a field effect transistor and an associated control circuit. The control circuits are mounted in a control section of the board remote from a power section mounting the MOSFETs. The present invention reduces the assembly steps required in the prior art wherein the MOSFET and its control circuit were mounted as preassembled units to the board. Moreover, the number of MOSFETs per unit area of board is increased by the present invention.

Abstract translation: 电路板设置有多个MOSFET（金属氧化物半导体场效应晶体管），每个MOSFET包括场效应晶体管和相关联的控制电路。 控制电路安装在远离安装MOSFET的电源部分的板的控制部分中。 本发明减少了现有技术中所需的组装步骤，其中MOSFET及其控制电路作为预先组装的单元安装到板上。 此外，通过本发明，板单位面积的MOSFET的数量增加。