公开(公告)号：US11855766B2

公开(公告)日：2023-12-26

申请号：US17733086

申请日：2022-04-29

Applicant: Intel Corporation

Inventor： Francesc Guim Bernat ,  Susanne M. Balle ,  Rahul Khanna ,  Sujoy Sen ,  Karthik Kumar

IPC: H04L43/08 ,  G06F16/901 ,  H04B10/25 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F1/20 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/4401 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04L41/14 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/356 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/00 ,  H05K7/14 ,  G06F15/16 ,  G06F9/38 ,  G06F9/50 ,  H04L41/12 ,  H04L41/5019 ,  H04L43/16 ,  H04L47/24 ,  H04L47/38 ,  H04L67/1004 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H05K5/02 ,  H04W4/80 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  H04L43/065 ,  H04L61/00 ,  H04L67/51 ,  H04J14/00 ,  H04L41/147 ,  H04L67/1008 ,  H04L41/0813 ,  H04L67/1029 ,  H04L41/0896 ,  H04L47/70 ,  H04L47/78 ,  H04L41/082 ,  H04L67/00 ,  H04L67/1012 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L49/55 ,  H04L67/10 ,  H04W4/02 ,  H04L45/02 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L47/80 ,  H05K1/02 ,  H04L45/52 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L47/765 ,  H04L67/1014 ,  G06F12/10 ,  G06Q10/06 ,  G06Q10/0631 ,  G07C5/00 ,  H04L12/28 ,  H04L41/02 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L41/046 ,  H04L49/15

CPC classification number: H04L43/08 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G06F1/183 ,  G06F1/20 ,  G06F3/064 ,  G06F3/0613 ,  G06F3/0625 ,  G06F3/0653 ,  G06F3/0655 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/30036 ,  G06F9/4401 ,  G06F9/544 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/1668 ,  G06F13/409 ,  G06F13/4022 ,  G06F13/4068 ,  G06F15/161 ,  G06F16/9014 ,  G08C17/02 ,  G11C5/02 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/3086 ,  H03M7/4056 ,  H03M7/4081 ,  H04B10/25891 ,  H04L41/145 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/0003 ,  H05K7/1442 ,  B25J15/0014 ,  B65G1/0492 ,  G05D23/1921 ,  G05D23/2039 ,  G06F3/061 ,  G06F3/067 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/0647 ,  G06F3/0658 ,  G06F3/0659 ,  G06F9/3887 ,  G06F9/505 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F13/161 ,  G06F13/1694 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C2200/00 ,  G11C5/06 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04J14/00 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L41/024 ,  H04L41/046 ,  H04L41/082 ,  H04L41/0813 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/555 ,  H04L61/00 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/34 ,  H04L67/51 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0005 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/00 ,  Y02P90/30 ,  Y04S10/50 ,  Y04S10/52 ,  Y10S901/01

Abstract: Technologies for dynamically managing resources in disaggregated accelerators include an accelerator. The accelerator includes acceleration circuitry with multiple logic portions, each capable of executing a different workload. Additionally, the accelerator includes communication circuitry to receive a workload to be executed by a logic portion of the accelerator and a dynamic resource allocation logic unit to identify a resource utilization threshold associated with one or more shared resources of the accelerator to be used by a logic portion in the execution of the workload, limit, as a function of the resource utilization threshold, the utilization of the one or more shared resources by the logic portion as the logic portion executes the workload, and subsequently adjust the resource utilization threshold as the workload is executed. Other embodiments are also described and claimed.

公开(公告)号：US11838113B2

公开(公告)日：2023-12-05

申请号：US16656009

申请日：2019-10-17

Applicant: INTEL CORPORATION

Inventor： Alberto J. Munoz ,  Murugasamy K. Nachimuthu ,  Mohan J. Kumar ,  Wojciech Powiertowski ,  Sergiu D. Ghetie ,  Neeraj S. Upasani ,  Sagar V. Dalvi ,  Chukwunenye S. Nnebe ,  Jeanne Guillory

IPC: H04L29/06 ,  H04L43/08 ,  G06F16/901 ,  H04B10/25 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F1/20 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/4401 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04L41/14 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/356 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/00 ,  H05K7/14 ,  G06F15/16 ,  G06F9/38 ,  G06F9/50 ,  H04L41/12 ,  H04L41/5019 ,  H04L43/16 ,  H04L47/24 ,  H04L47/38 ,  H04L67/1004 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H05K5/02 ,  H04W4/80 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  H04L43/065 ,  H04L61/00 ,  H04L67/51 ,  H04J14/00 ,  H04L41/147 ,  H04L67/1008 ,  H04L41/0813 ,  H04L67/1029 ,  H04L41/0896 ,  H04L47/70 ,  H04L47/78 ,  H04L41/082 ,  H04L67/00 ,  H04L67/1012 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L49/55 ,  H04L67/10 ,  H04W4/02 ,  H04L45/02 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L47/80 ,  H05K1/02 ,  H04L45/52 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L47/765 ,  H04L67/1014 ,  G06F12/10 ,  G06Q10/06 ,  G06Q10/0631 ,  G07C5/00 ,  H04L12/28 ,  H04L41/02 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L41/046 ,  H04L49/15

CPC classification number: H04L43/08 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G06F1/183 ,  G06F1/20 ,  G06F3/064 ,  G06F3/0613 ,  G06F3/0625 ,  G06F3/0653 ,  G06F3/0655 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/30036 ,  G06F9/4401 ,  G06F9/544 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/1668 ,  G06F13/409 ,  G06F13/4022 ,  G06F13/4068 ,  G06F15/161 ,  G06F16/9014 ,  G08C17/02 ,  G11C5/02 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/3086 ,  H03M7/4056 ,  H03M7/4081 ,  H04B10/25891 ,  H04L41/145 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/0003 ,  H05K7/1442 ,  B25J15/0014 ,  B65G1/0492 ,  G05D23/1921 ,  G05D23/2039 ,  G06F3/061 ,  G06F3/067 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/0647 ,  G06F3/0658 ,  G06F3/0659 ,  G06F9/3887 ,  G06F9/505 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F13/161 ,  G06F13/1694 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C2200/00 ,  G11C5/06 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04J14/00 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L41/024 ,  H04L41/046 ,  H04L41/082 ,  H04L41/0813 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/555 ,  H04L61/00 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/34 ,  H04L67/51 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0005 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/00 ,  Y02P90/30 ,  Y04S10/50 ,  Y04S10/52 ,  Y10S901/01

Abstract: Embodiments are generally directed apparatuses, methods, techniques and so forth to receive a sled manifest comprising identifiers for physical resources of a sled, receive results of an authentication and validation operations performed to authenticate and validate the physical resources of the sled, determine whether the results of the authentication and validation operations indicate the physical resources are authenticate or not authenticate. Further and in response to the determination that the results indicate the physical resources are authenticated, permit the physical resources to process a workload, and in response to the determination that the results indicate the physical resources are not authenticated, prevent the physical resources from processing the workload.

公开(公告)号：US11777377B2

公开(公告)日：2023-10-03

申请号：US16693623

申请日：2019-11-25

Applicant: MAKITA CORPORATION

Inventor： Akihiro Nakamoto

IPC: H02K11/33 ,  H01L25/07 ,  H05K1/18 ,  H02K11/00 ,  H02K11/25 ,  A01D34/78 ,  A01D34/68 ,  H01L23/40 ,  H02K9/22 ,  A01D101/00 ,  H01R12/58

CPC classification number: H02K11/33 ,  A01D34/6806 ,  A01D34/78 ,  H01L23/4006 ,  H01L25/072 ,  H02K9/223 ,  H02K11/0094 ,  H02K11/25 ,  H05K1/18 ,  A01D2101/00 ,  H01L2023/4031 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01R12/58 ,  H02K2211/03 ,  H05K2201/066 ,  H05K2201/10151 ,  H05K2201/10166

Abstract: An electric working machine includes: a motor; a semiconductor element that is provided in a current path to the motor and completes or interrupts the current path; a circuit board on which the semiconductor element is mounted, a control circuit that turns on and off the semiconductor element to control energization to the motor being assembled to the circuit board; and a heat sink for dissipating heat from the semiconductor element. The semiconductor element is attached to the heat sink via a metal-based board.

公开(公告)号：US11710676B2

公开(公告)日：2023-07-25

申请号：US17408227

申请日：2021-08-20

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Bernd Sporer

IPC: H01L23/367 ,  H05K1/18 ,  H05K3/22 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L23/367 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/1056 ,  H05K2203/0195

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

公开(公告)号：US20230205021A1

公开(公告)日：2023-06-29

申请号：US18097023

申请日：2023-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Moonyoung KIM ,  Jeongil KANG ,  Wonmyung WOO

IPC: G02F1/1345 ,  G02F1/1333 ,  H05K1/02

CPC classification number: G02F1/1345 ,  G02F1/133314 ,  H05K1/0203 ,  H05K1/0271 ,  H05K2201/10136 ,  H05K2201/066

Abstract: A display device includes: a display panel; a chassis assembly accommodating the display panel; a rear cover surrounding at least a portion of the chassis assembly; and a control assembly provided between the chassis assembly and the rear cover and, wherein the control assembly includes: a single-side printed circuit board (PCB) including a circuit surface with a circuit pattern printed thereon, and an insulating surface, a circuit module provided on the circuit surface, and a jumper connector including a first protruding portion passing through a first hole of the single-side PCB, a second protruding portion passing through a second hole of the single-side PCB.

公开(公告)号：US11659648B2

公开(公告)日：2023-05-23

申请号：US16152659

申请日：2018-10-05

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Marco Gavagnin ,  Jonathan Silvano de Sousa

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/46 ,  H05K1/18 ,  B22F7/08 ,  B33Y80/00 ,  B33Y10/00 ,  H05K3/12 ,  B22F10/20

CPC classification number: H05K1/0206 ,  B22F7/08 ,  B33Y10/00 ,  B33Y80/00 ,  H05K1/021 ,  H05K1/0209 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/181 ,  H05K1/185 ,  H05K3/1241 ,  H05K3/4644 ,  H05K3/4664 ,  B22F10/20 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2203/0126 ,  H05K2203/0195 ,  H05K2203/107

Abstract: A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.

公开(公告)号：US11650624B2

公开(公告)日：2023-05-16

申请号：US17729104

申请日：2022-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun Woo Kim ,  Ji Hoon Park ,  Ji Hun Heo ,  Joo Han Kim ,  Jin Man Kim ,  Bong Jae Rhee ,  Se Young Jang

IPC: G06F3/042 ,  G06K9/00 ,  H04M1/02 ,  G06F1/16 ,  H05K1/18 ,  H05K5/00 ,  G06F3/041 ,  G06V40/13 ,  H05K1/02 ,  H05K5/03 ,  H05K1/14 ,  H01L27/146 ,  H01L23/00 ,  H01L27/32

CPC classification number: G06F1/1626 ,  G06F1/1643 ,  G06F1/1684 ,  G06F3/042 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0421 ,  G06V40/1306 ,  G06V40/1318 ,  G06V40/1329 ,  H04M1/026 ,  H04M1/0266 ,  H04M1/0277 ,  H05K1/181 ,  H05K1/189 ,  H05K5/0017 ,  H05K5/0086 ,  G06F2203/04109 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/323 ,  H01L27/3234 ,  H01L27/3276 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/147 ,  H05K5/03 ,  H05K2201/066 ,  H05K2201/10128 ,  H05K2201/10151 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

公开(公告)号：US20190246488A1

公开(公告)日：2019-08-08

申请号：US16370506

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Evan Piotr Kuklinski ,  Jerrod Peterson ,  Ruander Cardenas ,  Patrick Douglas James

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  F28F2013/006 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/10734

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a printed circuit board, a heat source located on the printed circuit board, and an active loading mechanism secured to the printed circuit board. The active loading mechanism is over the heat source and includes shape memory material. When the shape memory material is not activated, the active loading mechanism applies a first load on the heat source and when the shape memory material is activated, the active loading mechanism applies a second load on the heat source.

公开(公告)号：US20190244877A1

公开(公告)日：2019-08-08

申请号：US16384494

申请日：2019-04-15

Applicant: Cisco Technology, Inc.

Inventor： Phil Slight ,  Vic Chia

IPC: H01L23/40 ,  H05K1/02

CPC classification number: H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K1/0203 ,  H05K1/0209 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10393 ,  H05K2201/10409

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

公开(公告)号：US20190186726A1

公开(公告)日：2019-06-20

申请号：US15849402

申请日：2017-12-20

Applicant: Valeo North America, Inc.

Inventor： Gavin Warner ,  Julien Hemon ,  Jonathan Blandin

IPC: F21V25/02 ,  H05K1/02 ,  F21S41/19 ,  F21V23/00 ,  F21V29/70 ,  F21V29/508

CPC classification number: F21V25/02 ,  F21S41/192 ,  F21V23/002 ,  F21V23/005 ,  F21V29/508 ,  F21V29/70 ,  F21W2103/20 ,  F21W2103/35 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0268 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/1028

Abstract: A circuitry assembly including an electrical component, a peripheral circuitry that supports the electrical component, a support assembly affixed to the peripheral circuitry to evacuate heat excess generated by the electrical component and the peripheral circuitry, a main circuitry separated from the support assembly by a spacing, the main circuitry having a plurality of detection bands, and a plurality of ribbons electrically connecting the peripheral circuitry with the main circuitry and deformable between an undamaged state and a damaged state, wherein in the undamaged state the plurality of ribbons steps over the spacing and the plurality of detection bands and in the damaged state at least one ribbon of the plurality of ribbons contacts at least one detection band of the plurality of detection bands and generate a short circuit.