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    Mounting Structure of Module Perpendicularly Disposed On Substrate
    11.
    发明申请
    Mounting Structure of Module Perpendicularly Disposed On Substrate 有权
    模块垂直布置在基板上的安装结构

    公开(公告)号：US20150282320A1

    公开(公告)日：2015-10-01

    申请号：US14666376

    申请日：2015-03-24

    Applicant: NEC Corporation

    Inventor： Wenda HAO

    IPC: H05K1/14 ,  H05K7/14

    CPC classification number: H05K1/141 ,  H05K3/366 ,  H05K7/1485 ,  H05K7/1487 ,  H05K2201/044 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09127

    Abstract: An electronic device includes a substrate having a connector formed on a main face, and a module having a terminal detachably connected to the connector of the substrate. The module includes an extended part which projects below the terminal in an installation direction. The substrate includes a bypass part which bypasses the extended part when the module is connected to the substrate. The bypass part is a cutout or a recess formed in the substrate. The extended part accommodates a plurality of components aligned in the installation direction. The extended part is extended from the lower end of the module by a difference between a first size, corresponding to multiple times the size of each component, and a second size ranging from the upper end of the module to the end of the terminal.

    Abstract translation: 电子设备包括具有形成在主面上的连接器的基板和具有可拆卸地连接到基板的连接器的端子的模块。 该模块包括在安装方向上在终端下方突出的延伸部分。 当该模块连接到基板时，该基板包括旁路部分，旁路部分绕该延伸部分。 旁路部分是形成在基板中的切口或凹部。 延伸部容纳沿安装方向对准的多个部件。 扩展部分从模块的下端通过与每个部件的大小相对应的第一尺寸和从模块的上端到终端的端部的第二尺寸之间的差来延伸。

    Plug Standards-Compliant Circuit Modules and Connectors
    13.
    发明申请
    Plug Standards-Compliant Circuit Modules and Connectors 有权
    符合标准的符合标准的电路模块和连接器

    公开(公告)号：US20150144383A1

    公开(公告)日：2015-05-28

    申请号：US14612046

    申请日：2015-02-02

    Applicant: Avant Technology, Inc.

    Inventor： Paul Goodwin

    IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

    CPC classification number: H05K1/0284 ,  H01R12/7082 ,  H01R12/721 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/0017 ,  H05K2201/09081 ,  H05K2201/10189

    Abstract: A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors.

    Abstract translation: 高速，高可靠性电路模块和连接性策略，符合SFF-8639规范的插座，无论是表示PCIe接口还是高速SAS接口。 本发明通过减少在典型的规范兼容连接器中发现的互连长度和跨平面转移来减少阻抗不连续性。

    Support method, recording medium storing design support program and semiconductor device
    17.
    发明授权
    Support method, recording medium storing design support program and semiconductor device 有权
    设计支持方法，记录介质存储设计支持程序和半导体器件

    公开(公告)号：US08966433B2

    公开(公告)日：2015-02-24

    申请号：US13834899

    申请日：2013-03-15

    Applicant: Fujitsu Limited

    Inventor： Akiyoshi Saitou

    IPC: G06F17/50 ,  H01L27/02 ,  H01L21/48 ,  H01L23/50

    CPC classification number: G06F17/5072 ,  H01L21/4853 ,  H01L23/50 ,  H01L27/02 ,  H01L27/0207 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/0005 ,  H05K2201/09081 ,  H01L2924/00

    Abstract: A design support method includes: selecting, by a computer, a power feed point of an integrated semiconductor circuit on a first board model in which a power supply layer and a ground layer are stacked; determining a first placement position of a first protrusion portion from the first board model on a side of the first board model, the first protrusion portion being corresponding to the power feed point; determining a second placement position of a second protrusion portion from the first board model on the side of the first board model, the second protrusion portion provided so as to separate from the first placement position by a distance; and placing the first protrusion portion and the second protrusion portion on the first placement position and the second placement position, respectively.

    Abstract translation: 一种设计支持方法包括：通过计算机在集成半导体电路的电源层和接地层堆叠的第一板模型上进行选择; 从所述第一板模型确定第一突出部分在所述第一板模型的一侧的第一放置位置，所述第一突出部分对应于所述馈电点; 从所述第一板模型确定第二突出部分在所述第一板模型侧的第二放置位置，所述第二突出部分设置成与所述第一放置位置分开一定距离; 以及将第一突出部分和第二突出部分分别放置在第一放置位置和第二放置位置上。

    Opto-electric hybrid board and manufacturing method therefor
    20.
    发明授权
    Opto-electric hybrid board and manufacturing method therefor 失效
    光电混合电路板及其制造方法

    公开(公告)号：US08644660B2

    公开(公告)日：2014-02-04

    申请号：US13409422

    申请日：2012-03-01

    Applicant: Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue

    Inventor： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue

    IPC: G02B6/26 ,  G02B6/36 ,  G02B6/42 ,  G02B6/10

    CPC classification number: G02B6/42 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4257 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/002 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10121 ,  Y02P70/611 ,  Y10T29/49 ,  Y10T29/49126

    Abstract: Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon. The optical waveguide unit includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions are located at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled in a state in which the bent portions fit into the socket portions.

    Abstract translation: 提供了一种光电混合板和制造方法。 光电混合基板包括光波导单元和安装有光学元件的电路单元。 光波导单元包括用于定位电路单元的插座部分，其形成在下包层的表面上并且由与芯相同的材料形成。 插座部分相对于芯的一个端面位于预定位置处。 电路单元包括通过使电路板的一部分弯曲成立以形成以弯曲的弯曲部分，用于装配到插座部分中。 弯曲部分相对于光学元件位于预定位置。 光波导单元和电路单元在弯曲部分配合到插座部分的状态下耦合。

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