公开(公告)号：US07997760B2

公开(公告)日：2011-08-16

申请号：US11916734

申请日：2006-06-02

Applicant: Ryuji Suzuki ,  Kyosuke Takemoto

Inventor： Ryuji Suzuki ,  Kyosuke Takemoto

IPC: F21S4/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  F21V29/505 ,  F21V29/763 ,  F21V29/83 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K1/021 ,  H05K1/053 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10106 ,  H05K2203/135 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An enamel substrate for mounting light emitting elements includes a core metal, an enamel layer that is covering on a surface of the core metal, and one or more through holes. In this enamel substrate for mounting light emitting elements, the core metal is exposed at inner surfaces of the through holes.

Abstract translation: 用于安装发光元件的搪瓷基板包括芯金属，覆盖在芯金属表面上的搪瓷层和一个或多个通孔。 在用于安装发光元件的该搪瓷基板中，芯状金属在通孔的内表面露出。

公开(公告)号：US07948766B2

公开(公告)日：2011-05-24

申请号：US12504251

申请日：2009-07-16

Applicant: Gregory M. Jandzio ,  Anders P. Pedersen ,  Gary A. Rief ,  Walter M. Whybrew

Inventor： Gregory M. Jandzio ,  Anders P. Pedersen ,  Gary A. Rief ,  Walter M. Whybrew

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0243 ,  H01Q3/26 ,  H01Q21/0006 ,  H01Q21/0037 ,  H05K3/429 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/10553 ,  H05K2203/049 ,  Y10T29/49165

Abstract: A method is for making a structural printed wiring board panel that includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.

Abstract translation: 一种用于制造结构印刷线路板面板的方法，该结构印刷线路板面板包括具有相对的外表面和层间互连的多层印刷线路板，其路由RF，功率和控制信号。 连接区域形成在至少一个面上或之上，用于连接层间互连和任何电气部件。 金属面板固定在至少一个外表面上，为多层印刷线路板增加结构刚性。 金属面板可以具有定位成允许接近连接区域的孔。 RF部件可以由面板承载并且可操作地连接到连接区域。 天线元件可以定位在相同或相对的面板上并且可操作地连接到RF部件以形成相控阵列印刷线路板（PWB）面板。

公开(公告)号：US07832092B2

公开(公告)日：2010-11-16

申请号：US12041457

申请日：2008-03-03

Applicant: Takehiro Shirai ,  Masayuki Iwase

Inventor： Takehiro Shirai ,  Masayuki Iwase

IPC: H05K3/36

CPC classification number: G02B6/4201 ,  G02B6/3885 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10121 ,  H05K2203/0323 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.

Abstract translation: 印刷布线板包括多个导体板，其包括至少一个导体板，该导体板用作与外部电路电连接的引线，导体板彼此空间分离; 在导体板上或横跨导体板上形成绝缘层，或者两者在导体板上并跨过导体板; 以及形成在所述绝缘层上的多个布线图案。 至少一个导体板通过通孔与至少一个布线图形电连接。

公开(公告)号：US20100230144A1

公开(公告)日：2010-09-16

申请号：US11340298

申请日：2006-01-26

Applicant: Christopher Schreiber ,  Christopher Dunn

Inventor： Christopher Schreiber ,  Christopher Dunn

IPC: H05K1/09

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/16 ,  H05K3/4076 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09827 ,  Y10T428/30 ,  Y10T428/31678

Abstract: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

Abstract translation: 磁盘驱动器悬挂互连及其方法。 互连在金属接地层和导电金属层之间具有金属接地层，金属导电层和绝缘层。 诸如滑块的电路部件沿着从电路部件和导电层到金属接地层的通过绝缘层的孔的接地路径电连接到导电层。 为了改善电连接，通过绝缘层将接合层提供到与接地层结合的接地层上。 导电体以导电金属层和连接层结合关系沉积在导电金属层和连接层两者上，并且电路部件因此被导体结合到接地层。

公开(公告)号：US07777136B2

公开(公告)日：2010-08-17

申请号：US11873435

申请日：2007-10-17

Applicant: Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

Inventor： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

Abstract: A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

Abstract translation: 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

公开(公告)号：US20100188059A1

公开(公告)日：2010-07-29

申请号：US12667031

申请日：2008-06-24

Applicant: Yoh Takano

Inventor： Yoh Takano

IPC: G05F1/10 ,  H02M3/06

CPC classification number: H05K1/0231 ,  H01L23/142 ,  H01L23/50 ,  H01L23/642 ,  H01L24/45 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/09554 ,  H05K2201/10287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: An insulating resin layer (30) is formed on a metal substrate (20), and a wiring is formed on the insulating resin layer (30). A circuit composed of a circuit element (50) and a passive element (60) is formed on the wiring (40), and the metal substrate (20) is covered with an over coat (80) and a sealing resin member (90). The insulating resin layer (30) is provided with an opening (31) so that a part of the metal substrate (20) is exposed therefrom. The exposed part of the metal substrate (20) is connected to one terminal of a capacitor (62) through a conductive wire (42), and the other terminal of the capacitor (62) is connected to the ground potential.

Abstract translation: 绝缘树脂层（30）形成在金属基板（20）上，并且在绝缘树脂层（30）上形成布线。 在布线（40）上形成由电路元件（50）和无源元件（60）构成的电路，金属基板（20）被覆盖（80）和密封树脂部件（90）覆盖， 。 绝缘树脂层（30）设置有开口（31），使金属基板（20）的一部分露出。 金属基板（20）的露出部分通过导线（42）连接到电容器（62）的一个端子，电容器（62）的另一个端子连接到地电位。

公开(公告)号：US20100012360A1

公开(公告)日：2010-01-21

申请号：US12516769

申请日：2007-11-29

Applicant: Kouji Takahashi ,  Yusuke Igarashi ,  Jun Sakano

Inventor： Kouji Takahashi ,  Yusuke Igarashi ,  Jun Sakano

IPC: H05K1/16 ,  H05K1/00 ,  H05K1/09

CPC classification number: H05K1/0206 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0265 ,  H05K1/056 ,  H05K3/202 ,  H05K3/384 ,  H05K3/44 ,  H05K2201/0352 ,  H05K2201/09554 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: A circuit device of the present invention includes a wiring board 45, and circuit elements such as semiconductor elements 32 mounted on the wiring board 45. The wiring board 45 includes: a conductive pattern 12, which is a metal core layer; a first insulating layer 14 and a second insulating layer 16 respectively covering an upper surface and a lower surface of the conductive pattern 12; and a first wiring layer 18 and a second wiring layer 20 formed respectively on an upper surface of the first insulating layer 14 and a lower surface of the second insulating layer 16. The conductive pattern 12 is made of rolled metal. With this configuration, the thermal resistance of the conductive pattern 12, which is the metal core, is reduced, and the thermal dissipation of the entire device can be improved.

Abstract translation: 本发明的电路装置包括布线板45和安装在布线板45上的诸如半导体元件32的电路元件。布线板45包括：导电图案12，其是金属芯层; 分别覆盖导电图案12的上表面和下表面的第一绝缘层14和第二绝缘层16; 以及分别形成在第一绝缘层14的上表面和第二绝缘层16的下表面上的第一布线层18和第二布线层20.导电图案12由轧制金属制成。 利用这种结构，作为金属芯的导电图案12的热阻减小，并且可以提高整个器件的散热。

公开(公告)号：US20100012357A1

公开(公告)日：2010-01-21

申请号：US12548933

申请日：2009-08-27

Applicant: Alan E. Wang ,  Kevin C. Olson

Inventor： Alan E. Wang ,  Kevin C. Olson

IPC: H05K1/03 ,  H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20090261060A1

公开(公告)日：2009-10-22

申请号：US12385576

申请日：2009-04-13

Applicant: Aya Mizushima ,  Toshiki Naito

Inventor： Aya Mizushima ,  Toshiki Naito

IPC: C23F1/00

CPC classification number: H05K3/243 ,  H05K1/056 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2201/09718

Abstract: A production method of a suspension board with circuit includes the steps of forming, on a metal supporting board, an insulating layer formed with a first opening, forming a metal thin film on the insulating layer and on the metal supporting board exposed from the first opening, forming, on a surface of the metal thin film, a conductive layer having terminal portions forming, on the terminal portions, a metal plating layer by electrolytic plating using the metal supporting board as a lead, forming a second opening in a portion of the metal supporting board opposing the first opening, and partially etching the metal supporting board to form the suspension board with circuit and a support frame. In the step of forming the insulating layer, the first opening is formed in the insulating layer in which the supporting frame is formed.

Abstract translation: 具有电路的悬挂板的制造方法包括以下步骤：在金属支撑板上形成由第一开口形成的绝缘层，在绝缘层上形成金属薄膜和在第一开口露出的金属支撑板上 在所述金属薄膜的表面上形成具有端子部分的导电层，所述端子部分在所述端子部分上使用所述金属支撑板作为引线通过电解电镀形成金属镀层，在所述金属镀层的一部分中形成第二开口 金属支撑板与第一开口相对，并且部分地蚀刻金属支撑板以形成具有电路和支撑框架的悬挂板。 在形成绝缘层的步骤中，第一开口形成在形成支撑框架的绝缘层中。

公开(公告)号：US20090225544A1

公开(公告)日：2009-09-10

申请号：US11916734

申请日：2006-06-02

Applicant: Ryuji Suzuki ,  Kyosuke Takemoto

Inventor： Ryuji Suzuki ,  Kyosuke Takemoto

IPC: F21S4/00 ,  F21V19/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  F21V29/505 ,  F21V29/763 ,  F21V29/83 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K1/021 ,  H05K1/053 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10106 ,  H05K2203/135 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An enamel substrate for mounting light emitting elements includes a core metal, an enamel layer that is covering on a surface of the core metal, and one or more through holes. In this enamel substrate for mounting light emitting elements, the core metal is exposed at inner surfaces of the through holes.

Abstract translation: 用于安装发光元件的搪瓷基板包括芯金属，覆盖在芯金属表面上的搪瓷层和一个或多个通孔。 在用于安装发光元件的该搪瓷基板中，芯状金属在通孔的内表面露出。