公开(公告)号：US20160081192A1

公开(公告)日：2016-03-17

申请号：US14947558

申请日：2015-11-20

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：US20160050743A1

公开(公告)日：2016-02-18

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun TAGUCHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

Abstract translation: 电路板包括能够保持印刷电路板的板构件，包括电子部件的印刷电路板和设置在电子部件上的冷却部件，印刷电路板和电子部件位于板部件和 冷却构件; 以及设置到板构件并允许与印刷电路板电连接的电路。

公开(公告)号：US20150327355A1

公开(公告)日：2015-11-12

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus WÖLFEL

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.

Abstract translation: 一种角度可调的印刷电路板结构，其具有相对于彼此成角度地布置的两个印刷电路板部分。 印刷电路板结构包含至少一个导电元件，其至少主要嵌入在印刷电路板结构中，并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘。 两个接触垫位于不同的印刷电路板部分上。 印刷电路板部分可相对于彼此具有角度可调节和/或成角度，同时维持接触焊盘和至少一个传导元件之间的连接，并且通过经印刷的弯曲边缘弯曲至少一个导电元件 电路板部分。 如横截面所示，导电元件沿着弯曲边缘比垂直方向具有更大的程度。

公开(公告)号：US20150264802A1

公开(公告)日：2015-09-17

申请号：US14426876

申请日：2013-07-29

Applicant: VALEO SYSTEMES DE CONTROLE MOTEUR

Inventor： Hubert Lescot ,  Yoann Legendre

IPC: H05K1/02 ,  H05K5/04

CPC classification number: H05K1/0215 ,  H05K1/0231 ,  H05K1/053 ,  H05K5/04 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10409

Abstract: An electrical device and electrical compressor. The electrical device (102) comprises an electrical circuit (104) comprising a metal substrate (202), a layer of dielectric material (206) extending over the metal substrate (202), and a metal strip (208) extending over the layer of dielectric material (206). It further comprises a linking conductive part (218) intended to be connected to an electrical ground (106) and having a first contact end (220) intended to be pressed against the metal strip (208), and a pushing device (224) intended to take a first position, called the closed position, in which the pushing device (224) presses against a support portion (226) of the linking conductive part (218) so as to press the first contact end (220) against the metal strip (208), the support portion (226) being located away from the first contact end (220), and a second position, called the open position, in which the pushing device (224) allows the first contact end (220) to be separated from the metal strip (208).

Abstract translation: 电气设备和电动压缩机。 电气设备（102）包括电路（104），该电路包括金属基底（202），在金属基底（202）上延伸的介电材料层（206） 电介质材料（206）。 其还包括用于连接到电接地（106）并且具有旨在被压靠在金属条（208）上的第一接触端（220）的连接导电部分（218），以及推动装置（224） 以将第一位置称为关闭位置，其中推动装置（224）压靠连接导电部分（218）的支撑部分（226），以将第一接触端（220）压靠在金属带 （208），所述支撑部分（226）远离所述第一接触端（220）定位，以及称为所述打开位置的第二位置，所述推动装置（224）允许所述第一接触端（220）为 与金属条（208）分离。

公开(公告)号：US09072178B2

公开(公告)日：2015-06-30

申请号：US13842121

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hae Sock Chung ,  Doo Young Kim ,  Na Rim Ha ,  Youn Sik Jin ,  Tae Ok Kim

IPC: H01G4/228 ,  H05K1/02 ,  H01G4/12 ,  H05K1/18 ,  H01G4/30 ,  H01G4/38

CPC classification number: H05K1/0231 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01G4/38 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/43

Abstract: There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.

Abstract translation: 提供了一种层叠型多层陶瓷电子部件，包括：陶瓷体，多个第一和第二内部以及形成在陶瓷元件的彼此相对的两个表面上的第一和第二外部电极; 以及第一和第二金属框架，其被设置为彼此面对并且允许陶瓷体的第一和第二外部电极分别附接到其上，其中两个或更多个陶瓷体在第一和第二金属框架之间沿长度方向 第一和第二金属框架之间具有间隔，并且各个陶瓷体具有不同的电容水平。

公开(公告)号：US08998622B2

公开(公告)日：2015-04-07

申请号：US13601884

申请日：2012-08-31

Applicant: Taylor H. Gilbert ,  Sean S. Corbin

Inventor： Taylor H. Gilbert ,  Sean S. Corbin

IPC: H01R12/00 ,  H05K1/00 ,  H01R12/52 ,  H01R4/04 ,  H01R43/26 ,  H05K3/36 ,  H01R12/62

CPC classification number: H01R12/52 ,  H01R4/04 ,  H01R12/00 ,  H01R12/62 ,  H01R43/26 ,  H05K1/00 ,  H05K3/361 ,  H05K2201/0281 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/1034

Abstract: Electronic devices may be provided with electronic components and electrical connectors coupled between the electronic components. A connector may be formed in a small gap between the electronic components. The connector may be a thin sheet of flexible conductive material with a conductive adhesive on one surface. The connector may be installed between the components using an applicator that is attached to the connector. The applicator may be a pull-tab liner having a first surface that is tacky and a second opposing surface that is non-stick. The applicator may have an extended portion that can be held by a technician while installing the connector. The connector may be installed by inserting the connector and applicator between the components, pinching the components against the connector and applicator, and removing the applicator by pulling the extended portion to peel the applicator from the connector.

Abstract translation: 电子设备可以设置有电子部件和耦合在电子部件之间的电连接器。 连接器可以形成在电子部件之间的小间隙中。 连接器可以是在一个表面上具有导电粘合剂的柔性导电材料薄片。 可以使用附接到连接器的施加器将连接器安装在组件之间。 施用器可以是具有粘性的第一表面和不粘的第二相对表面的拉片衬里。 涂抹器可以具有在安装连接器的同时由技术人员保持的延伸部分。 连接器可以通过将连接器和施加器插入到部件之间，将部件夹持在连接器和施加器上，并且通过拉动延伸部分从连接器剥离施加器来移除施加器来安装。

公开(公告)号：US20150083456A1

公开(公告)日：2015-03-26

申请号：US14372871

申请日：2013-01-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Tony Y. Chen ,  Song Lu ,  Mohiuddin Ahmed

IPC: H02G15/007

CPC classification number: H02G15/007 ,  F16F1/376 ,  H05K1/0215 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10409 ,  H05K2201/10606

Abstract: The present invention is a conductive isolator including a damping structure, a conductive bridge component positioned within the damping structure, axial contact points between the damping structure and the conductive bridge component and radial contact points between the damping structure and the conductive bridge component.

Abstract translation: 本发明是一种导电隔离器，其包括阻尼结构，位于阻尼结构内的导电桥组件，阻尼结构和导电桥组件之间的轴向接触点以及阻尼结构与导电桥组件之间的径向接触点。

公开(公告)号：US20150064508A1

公开(公告)日：2015-03-05

申请号：US14535897

申请日：2014-11-07

Applicant: LG CHEM, LTD.

Inventor： Youngsun PARK ,  Jeongsuk LEE ,  Keunpyo AHN ,  Chunyeon KIM ,  Joung Ho HA ,  Masayuki WAKEBE

IPC: H01M2/34 ,  H01M10/0525

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H01M2220/30 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/341 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  Y02E60/122

Abstract: A battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state, and a protection circuit module (PCM) electrically connected to the battery cell. The PCM includes a protection circuit board (PCB) electrically connected to the battery cell, the PCB being provided on a region where a circuit is connected with a conductive pattern including a fusing part, having relatively high resistance, configured to fuse itself for interrupting the flow of current when a large amount of current is conducted.

Abstract translation: 一种电池组，包括电池单元，其具有阴极/隔板/阳极结构的电极组件，阴极/隔板/阳极结构与密封状态的电解质一起安装在电池壳体中，以及电连接到电池单元的保护电路模块（PCM）。 PCM包括电连接到电池单元的保护电路板（PCB），PCB设置在电路与包括具有相对高电阻的定影部分的导电图案连接的区域上，该导电图案被配置为熔断自身以中断 进行大量电流时的电流流动。

公开(公告)号：US20140347828A1

公开(公告)日：2014-11-27

申请号：US14059839

申请日：2013-10-22

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shinya Hayashiyama ,  Makoto Tanaka

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L2924/15311 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10734 ,  H05K2201/2009

Abstract: According to one embodiment, an electronic apparatus includes a substrate with a plurality of conductors, a component with a plurality of first terminals, and a deformation suppressing member attached to the substrate. The first terminals of the component are arranged in a first direction and connected to the conductors. When a certain bending deformation occurs in the substrate, the deformation suppressing member is configured to convert the certain bending deformation into a bending deformation in a direction perpendicular with the first direction.

Abstract translation: 根据一个实施例，电子设备包括具有多个导体的基板，具有多个第一端子的部件和附接到基板的变形抑制部件。 元件的第一端子被布置在第一方向上并连接到导体。 当基板发生一定的弯曲变形时，变形抑制部件被构造成将一定的弯曲变形转换成与第一方向垂直的方向的弯曲变形。

公开(公告)号：US20140338964A1

公开(公告)日：2014-11-20

申请号：US14354997

申请日：2013-08-10

Applicant: INCO INNOVATION

Inventor： Jan Berglund

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/0263 ,  H05K2201/0379 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power chain consisting of a chain comprising links that are electrically conductive elements mounted on a circuit board in at least two layers and in such a way that the elements included in the power chain are assembled shifted and overlapping and in electrical contact with each other.

Abstract translation: 一种动力链，包括链条，该链条包括以至少两层安装在电路板上的导电元件的链接，并且使得包括在动力链中的元件被组合移位和重叠并且彼此电接触。