公开(公告)号：US20160273564A1

公开(公告)日：2016-09-22

申请号：US14664391

申请日：2015-03-20

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： James Michael BONICATTO ,  Andrew William HILL ,  Nathan Michael THOME ,  John GODFREY ,  Robyn MCLAUGHLIN ,  Santosh SHETTY

IPC: F16B5/00 ,  H05K7/14 ,  H05K13/00

CPC classification number: F16B5/00 ,  H01R12/7047 ,  H05K3/30 ,  H05K7/1407 ,  H05K7/1417 ,  H05K2201/10303 ,  H05K2201/1031 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y02P70/611

Abstract: Examples of the disclosure enable a printed circuit board to be coupled to a chassis. In some examples, a coupling mechanism includes a first body including a head portion and a shaft portion that has an inner surface defining a channel. The coupling mechanism includes a second body including a head portion and a shaft portion. At least a part of the second body shaft portion is positionable within the channel. An outer surface of the second body shaft portion is sized to enable the second body shaft portion to expand radially or move laterally within the channel when the part of the second shaft portion is positioned within the channel. Examples of the disclosure enable the printed circuit board to be coupled to a chassis in low-profile, reduced-stress manner.

Abstract translation: 本公开的示例使得印刷电路板能够耦合到底架。 在一些示例中，联接机构包括包括头部和具有限定通道的内表面的轴部的第一主体。 联接机构包括包括头部和轴部的第二主体。 第二主体轴部分的至少一部分可定位在通道内。 第二主体轴部分的外表面的尺寸设定成使得当第二轴部分的部分位于通道内时，第二主体轴部能够在通道内径向扩张或横向移动。 本公开的实例使得印刷电路板能够以低调，低应力的方式耦合到底盘。

公开(公告)号：US09402311B2

公开(公告)日：2016-07-26

申请号：US14435686

申请日：2013-10-25

Applicant: NSK Ltd.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H05K7/00 ,  H05K1/09 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/495 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H01L23/00

CPC classification number: H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

Abstract translation: 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。

公开(公告)号：US09380710B2

公开(公告)日：2016-06-28

申请号：US14166897

申请日：2014-01-29

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher

IPC: H01R24/00 ,  H05K3/10 ,  H01R13/6477 ,  H01R24/64 ,  H05K1/02 ,  H01R13/6469 ,  H05K1/16 ,  H05K3/40

CPC classification number: H01R13/6477 ,  H01R4/023 ,  H01R13/6461 ,  H01R13/6464 ,  H01R13/6469 ,  H01R24/64 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/165 ,  H05K3/10 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/1034 ,  Y02P70/611 ,  Y10T29/49155

Abstract: Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.

Abstract translation: 提供了用于通信连接器的印刷电路板，其包括由具有第一介电常数的第一绝缘材料形成的电介质基板。 第一和第二对输入端子和第一和第二对输出端子设置在电介质基板上。 第一差分传输线将第一对输入端子电连接到第一对输出端子，并且第二差分传输线路将第二对输入端子电连接到第二对输出端子。 电介质基板包括位于第一差动传输线的导电路径之间的开口，该开口包含具有第二介电常数的第二绝缘材料。

公开(公告)号：US09343863B2

公开(公告)日：2016-05-17

申请号：US13871266

申请日：2013-04-26

Applicant: OLYMPUS CORPORATION

Inventor： Mikio Nakamura ,  Takanori Sekido

IPC: H01R43/00 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R43/00 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/1034 ,  H05K2201/10962 ,  H05K2201/10977 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49208

Abstract: A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.

Abstract translation: 安装组件包括其中安装部件安装在构件的至少一个主面上并且形成构件连接电极的构件; 以及连接构件，其具有以使得所述平行部的长度方向平行于所述构件的主面的方式配置的柱状平行部，所述平行部的一端侧与所述构件连接电极连接。

公开(公告)号：US09306308B2

公开(公告)日：2016-04-05

申请号：US14315673

申请日：2014-06-26

Applicant: JOINSET CO., LTD. ,  Sun-Ki Kim

Inventor： Sun-Ki Kim ,  Tae-Man Kang

IPC: H01R13/24 ,  H01R4/02 ,  H01R12/57 ,  H01R12/71 ,  H05K3/34

CPC classification number: H01R13/2428 ,  H01R4/028 ,  H01R12/57 ,  H01R12/718 ,  H01R13/2421 ,  H05K3/341 ,  H05K2201/1031 ,  Y02P70/611

Abstract: Provided is a surface-mount type electric connecting terminal which is disposed between opposing conductive objects and is configured to electrically connecting the objects while easily adjusting pressing force and recovery force. The electric connecting terminal includes a cylindrical fixed member which is made from a metallic material; a cylindrical movable member which is slidably inserted in the fixed member and is made from a metallic material; and an electrical conductive spring which is accommodated in the fixed member and whose one end contacts with the bottom of the fixed member and the other end contacts with the bottom of the movable member for thereby allowing the movable member to elastically slide against the fixed member.

公开(公告)号：US09272371B2

公开(公告)日：2016-03-01

申请号：US13905979

申请日：2013-05-30

Applicant: AGC Automotive Americas R&D, Inc. ,  AGC Flat Glass North America, Inc.

Inventor： Timothy P. Hoepfner

IPC: H05K1/18 ,  B23K35/24 ,  B23K35/26 ,  H05B3/84

CPC classification number: B23K35/24 ,  B23K35/0222 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/302 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/181 ,  H05K2201/1031 ,  H05K2203/05

Abstract: A solder joint is disposed on an electrical conductor which comprises silver. The solder joint comprises bismuth and tin. The solder joint has a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone. The bismuth-rich solder bulk is disposed adjacent to the silver-solder reaction zone. The solder joint comprises a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least the bismuth-rich solder bulk of the solder joint. A window pane comprising the solder joint is also disclosed.

Abstract translation: 焊接点设置在包含银的电导体上。 焊点包括铋和锡。 焊点具有包含富铋焊料块和银 - 焊料反应区的微结构。 富含铋的焊料块与银焊料反应区相邻设置。 焊点包括由铋形成并且至少基本上分散在焊料接头的至少富铋焊料体中的多个富含铋的晶粒。 还公开了一种包括焊点的窗玻璃。

公开(公告)号：US20150180146A1

公开(公告)日：2015-06-25

申请号：US14638525

申请日：2015-03-04

Applicant: MEDIMOP Medical Projects Ltd.

Inventor： Reuven Y. FILMAN ,  Tomer SOLOMON

IPC: H01R12/70

CPC classification number: H01R12/7088 ,  H01R12/7076 ,  H01R43/205 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2203/166 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A power supply contact is mountable on a base of a device having a geometry for receiving a power supply and for surface installation of a printed circuit board. The power supply contact includes a base plate mountable on the base of the device, a rail extends upwardly from the base plate, a power supply terminal and an adaptor connecting the rail to the power supply terminal. The rail is in electrical contact with the printed circuit board and the power supply terminal is in electrical contact with the power supply when the printed circuit board and the power supply are installed in the device.

Abstract translation: 电源触点可安装在具有用于接收电源并用于印刷电路板的表面安装的几何形状的装置的基座上。 电源触点包括可安装在装置的底座上的基板，从基板向上延伸的导轨，电源端子和将导轨连接到电源端子的适配器。 当印刷电路板和电源安装在设备中时，轨道与印刷电路板电接触，电源端子与电源电接触。

公开(公告)号：US20150115237A1

公开(公告)日：2015-04-30

申请号：US14365108

申请日：2012-12-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karsten Diekmann ,  Simon Schicktanz

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00

CPC classification number: H01L27/32 ,  F21K9/00 ,  F21S2/005 ,  F21V21/005 ,  F21V23/06 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/0097 ,  H01L51/52 ,  H01L2251/5338 ,  H05K1/118 ,  H05K1/142 ,  H05K1/189 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A light-emitting component arrangement may include at least one flexible printed circuit board, at least one light-emitting component coupled to the flexible printed circuit board, at least one electromechanical connecting part, wherein the connecting part is mechanically fixed to the flexible printed circuit board and is electrically coupled to the light-emitting component, and wherein the connecting part has an electromechanical connection for mechanically and electrically connecting a connecting element which is external to the printed circuit board.

Abstract translation: 发光部件布置可以包括至少一个柔性印刷电路板，耦合到柔性印刷电路板的至少一个发光部件，至少一个机电连接部件，其中连接部分机械地固定到柔性印刷电路 并且电耦合到发光部件，并且其中连接部分具有用于机械地和电连接印刷电路板外部的连接元件的机电连接。

公开(公告)号：US09007776B2

公开(公告)日：2015-04-14

申请号：US13714424

申请日：2012-12-14

Applicant: HTC Corporation

Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Chih-Hung Li ,  Cheng-Te Chen

IPC: H05K7/00 ,  G06F1/16 ,  H04M1/00 ,  H05K1/02 ,  H05K1/14 ,  H04M1/02

CPC classification number: G06F1/1658 ,  G06F1/16 ,  H04M1/00 ,  H04M1/0274 ,  H05K1/0218 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0723 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y02P70/611

Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

Abstract translation: 电子模块包括具有第一表面的第一电路板，具有第二表面的第二电路板，第一表面上的第一电子部件，第二表面上的第二电子部件，第一导电栅栏和第二导电栅栏。 第一导电围栏包围第一电子部件，并具有暴露第一电子部件的第一开口。 第二导电围栏包围第二电子部件，并具有暴露第二电子部件的第二开口。 第一导电栅栏的第一开口接合第二导电栅栏的第二开口，使得第一电子元件和第二电子元件被第一电路板，第二电路板，第一导电栅栏和第二导电栅栏围绕 导电栅栏 第一电子部件中的至少一个高于第一导电围栏。

公开(公告)号：US08994165B2

公开(公告)日：2015-03-31

申请号：US12504225

申请日：2009-07-16

Applicant: Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

Inventor： Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

IPC: H01L23/48 ,  H05K3/32 ,  H01L23/31 ,  H01L25/07 ,  H01L23/00 ,  H01L25/16 ,  H05K3/28

CPC classification number: H05K3/32 ,  H01L23/3121 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/284 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.

Abstract translation: 功率半导体器件包括接合到电路基板的布线图案的电力半导体元件，圆柱形外部端子连通部分和用于形成例如功率半导体元件和圆筒形外部端子连接部分之间的电连接的布线装置。 功率半导体元件，圆筒形外部端子连通部分和布线装置用传递模塑树脂密封。 圆筒形的外部端子连通部分布置在布线图案上，以便大致垂直于布线图案，使得外部端子可插入并可连接到圆柱形外部端子连通部分，并且使得多个圆柱形外部端子连通部分 在作为主电路的每个布线图案上，圆柱形外部端子通信部分二维布置。