公开(公告)号：US20150250059A1

公开(公告)日：2015-09-03

申请号：US14715627

申请日：2015-05-19

Applicant: TELLABS OY

Inventor： Antti HOLMA ,  Peter KOKKO

IPC: H05K3/30 ,  H05K3/22

CPC classification number: H05K3/303 ,  H05K1/02 ,  H05K3/22 ,  H05K3/222 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A method for manufacturing a circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. Furthermore, the protection element provides electrical connections between functional entities of the circuit board system.

Abstract translation: 提出了一种用于制造包括电气部件的机械保护的电路板系统的方法。 电路板系统包括配备有电气部件（103-111）的电路板（101）和附接到电路板的没有电气部件的区域的保护元件（102）。 保护元件在垂直于电路板的方向上具有厚度，并且其形状使得电子部件在垂直于电路板的方向上未被屏蔽。 因此，保护​​元件构成保护电气元件的障碍物，但是仍然允许例如在飞行探针测试中从垂直于电路板的方向访问电气部件。 此外，保护元件在电路板系统的功能实体之间提供电连接。

公开(公告)号：US20150114706A1

公开(公告)日：2015-04-30

申请号：US14511397

申请日：2014-10-10

Applicant: Curtiss-Wright Controls, Inc.

Inventor： Michael Rose ,  Robert Sullivan

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/0216 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/20 ,  H05K3/4038 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/1059

Abstract: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.

Abstract translation: 电路板包括多个层，第一和第二参考导电通孔在垂直方向上延伸穿过多个层的至少一部分，第一和第二信号导电通孔在垂直方向上延伸并且在水平方向间隔开 从所述第一和第二参考导电通孔穿过所述多个层的至少一部分，以及在所述第一和第二信号导电通孔之间沿垂直方向延伸的电介质区域。 空气通道在垂直方向上延伸穿过第一和第二信号导电通孔之间的电介质区域。 反焊盘在第一和第二参考导电通孔之间沿水平方向延伸，并且在水平方向上包围第一和第二信号导电通孔，空气通孔和电介质区域。

公开(公告)号：US08974094B2

公开(公告)日：2015-03-10

申请号：US13778488

申请日：2013-02-27

Applicant: General Electric Company

Inventor： Tamás Vásárhelyi ,  József Fülöp ,  Tímea Seszták ,  Zsolt Bagoly ,  Jácint Gergely

IPC: F21V19/00 ,  F21K99/00 ,  F21V23/00 ,  H05K1/00 ,  H01R12/51

CPC classification number: F21K9/90 ,  F21V23/004 ,  H01R12/515 ,  H05K1/00 ,  H05K1/117 ,  H05K2201/09027 ,  H05K2201/09163 ,  H05K2201/1059 ,  Y10T29/49117 ,  Y10T29/49155

Abstract: A lamp includes a collar with internal and outer surfaces, where two or more connection pins extend from the internal surface of the collar. At least two connection pins have a head portion distal from the collar internal surface. The head portions include a slot. The lamp includes a light source with at least two external lead-in wires. The lead-in wires are located within respective slots and are mechanically coupled to respective surfaces of the slots in a press-fit manner which may be free of wrapping, winding, twisting, or soldering. A PCB disposed inside the lamp has two opposing surfaces and a rim between the two opposing surfaces. There are conductive surfaces disposed on at least one of the rim and one of the opposing surfaces at positions corresponding to connection pin slots. The PCB is located between connection pins with the conductive surfaces in electrical communication with the lead-in wires.

Abstract translation: 灯包括具有内表面和外表面的套环，其中两个或多个连接销从套环的内表面延伸。 至少两个连接销具有远离套环内表面的头部。 头部包括槽。 该灯包括具有至少两个外部引入线的光源。 引入线位于相应的槽内，并且以压配合的方式机械地联接到槽的相应表面，压配合方式可以没有包裹，缠绕，扭转或焊接。 布置在灯内的PCB具有两个相对的表面和两个相对表面之间的边缘。 在对应于连接销槽的位置处，设置在轮辋和相对表面中的至少一个上的导电表面。 PCB位于连接引脚之间，导电表面与引入线电连通。

公开(公告)号：US08902605B2

公开(公告)日：2014-12-02

申请号：US13495671

申请日：2012-06-13

Applicant: Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

Inventor： Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

IPC: H01R9/00

CPC classification number: H01R12/58 ,  H01R12/718 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/049 ,  H05K2201/1059 ,  H05K2201/10946

Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

Abstract translation: 用于将表面安装部件附接到印刷电路板的表面安装部件适配器，组件和相关方法。 表面安装部件适配器包括衬底，衬底上的表面安装部件保持器和柔性引线，每个柔性引线都具有附接到表面安装部件保持器的基端，以及被配置为接合电路板上的电镀通孔的自由端。 表面安装部件保持器构造成接合表面安装部件的电触点。 表面贴装组件将表面安装适配器与表面贴装组件相结合。 在表面安装部件方法中，形成表面安装组件，并且柔性引线的自由端附接到电路板上相应数量的电镀通孔。

公开(公告)号：US20140345124A1

公开(公告)日：2014-11-27

申请号：US14283989

申请日：2014-05-21

Applicant: Patrik PATZNER ,  Carsten KASCHUBE ,  Christoph GMELIN ,  Andreas OTTO ,  Markus REINHARD ,  Ronny WOLF

Inventor： Patrik PATZNER ,  Carsten KASCHUBE ,  Christoph GMELIN ,  Andreas OTTO ,  Markus REINHARD ,  Ronny WOLF

IPC: H05K3/30

CPC classification number: H05K3/325 ,  H05K1/115 ,  H05K3/308 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10878 ,  H05K2203/0285 ,  Y10T29/49139

Abstract: A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin.

Abstract translation: 一种用于电路板中的导电压配合销的无焊接电压配合接触的方法包括：提供具有厚度，至少一个电导体路径和垂直于电路板引导的接触开口的电路板，并且具有金属化 内墙; 提供具有纵向轴线并具有适于压配合到所述接触开口中并且具有基本圆形横截面的压配合区域的导电压配合销; 并且通过在压配合销上施加沿着压配合销的纵向轴线的力，将压配合销压入接触开口中，通过施加超声波作用在压配合销上， 适合针。

公开(公告)号：US08721117B2

公开(公告)日：2014-05-13

申请号：US12675589

申请日：2008-08-20

Applicant: Seok Hoon Kang ,  Jun Seok Park

Inventor： Seok Hoon Kang ,  Jun Seok Park

IPC: F21S4/00 ,  H01R12/00 ,  H05K1/00

CPC classification number: F21S2/005 ,  F21V23/06 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133612 ,  H01R12/716 ,  H01R12/724 ,  H01R12/732 ,  H05K1/142 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: A lighting device comprises: a first substrate comprising a first connector and a first connection terminal, the first connector being connected to an external power supply or driving device, the first connection terminal being electrically connected to the first connector; and a second substrate connected electrically to the first connection terminal and comprising a light emitting device.

Abstract translation: 照明装置包括：第一基板，包括第一连接器和第一连接端子，所述第一连接器连接到外部电源或驱动装置，所述第一连接端子电连接到所述第一连接器; 以及第二基板，电连接到第一连接端子并且包括发光器件。

公开(公告)号：US08715006B2

公开(公告)日：2014-05-06

申请号：US13493632

申请日：2012-06-11

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R13/648

CPC classification number: H01R13/6594 ,  H01R12/585 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09618 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2203/0207 ,  H05K2203/0242

Abstract: A circuit board including a board substrate having opposite first and second sides. The board substrate has a thickness measured along a z-axis that is perpendicular to the first and second sides. The circuit board also includes plated thru-hole (PTH) vias extending along the z-axis from the first side into the board substrate. The PTH vias are arranged to form multiple signal pairs. The circuit board also includes signal traces that are directly coupled to the PTH vias and extend perpendicular to the z-axis in the board substrate. The signal traces and the PTH vias are configured to transmit differential signals. The circuit board also includes ground columns that extend along the z-axis in the board substrate. The ground columns are distributed relative to the signal pairs to form shield arrays. Each of the shield arrays surrounds one of the signal pairs, wherein the ground columns comprise microvias.

Abstract translation: 一种电路板，包括具有相对的第一和第二侧面的板基板。 板基板具有沿着垂直于第一和第二侧的z轴测量的厚度。 电路板还包括沿着z轴从第一侧延伸到板基板的电镀通孔（PTH）通孔。 PTH通孔被布置成形成多个信号对。 电路板还包括直接耦合到PTH通孔并垂直于板基板中的z轴延伸的信号迹线。 信号迹线和PTH通孔配置为传输差分信号。 电路板还包括沿着板基板中的z轴延伸的接地柱。 接地柱相对于信号对分布以形成屏蔽阵列。 每个屏蔽阵列围绕信号对中的一个，其中接地列包括微孔。

公开(公告)号：US20130343008A1

公开(公告)日：2013-12-26

申请号：US13915644

申请日：2013-06-12

Applicant: TELLABS OY

Inventor： Antti HOLMA ,  Peter KOKKO

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K3/303 ,  H05K1/02 ,  H05K3/22 ,  H05K3/222 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A circuit board system including mechanical protection of electrical components includes a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. The body of the protection element can be made of same material as the electrically insulating body of the circuit board. Thus, the thermal expansion co-efficient of the protection element can be substantially the same as that of the circuit board.

Abstract translation: 包括电气部件的机械保护的电路板系统包括配备有电气部件（103-111）的电路板（101）和附接到电路板的没有电气部件的区域的保护元件（102）。 保护元件在垂直于电路板的方向上具有厚度，并且其形状使得电子部件在垂直于电路板的方向上未被屏蔽。 因此，保护​​元件构成保护电气元件的障碍物，但是仍然允许例如在飞行探针测试中从垂直于电路板的方向访问电气部件。 保护元件的主体可以由与电路板的电绝缘体相同的材料制成。 因此，保护​​元件的热膨胀系数可以与电路板的热膨胀系数基本相同。

公开(公告)号：US08575745B2

公开(公告)日：2013-11-05

申请号：US13223600

申请日：2011-09-01

Applicant: Seiji Oka ,  Shiori Idaka ,  Hiroshi Yoshida

Inventor： Seiji Oka ,  Shiori Idaka ,  Hiroshi Yoshida

IPC: H01L23/48 ,  H01L23/04

CPC classification number: H05K3/325 ,  H01L2924/0002 ,  H05K2201/0311 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/1059 ,  Y02P70/611 ,  H01L2924/00

Abstract: A power semiconductor device includes a conductive insertion member as an external terminal projecting from a surface of the power semiconductor device facing a printed wiring board. The printed wiring board includes a conductive fitting member mounted on a pad part of the printed wiring board. The fitting member receives the insertion member therein when the power semiconductor device is connected to the printed wiring board. The insertion member has a recessed portion formed on a side surface of the insertion member. The fitting member has a projecting portion with elasticity formed on an inner side surface of the fitting member. The elasticity causes the projecting portion of the fitting member to contact the recessed portion of the insertion member under pressure when the insertion member is inserted into the fitting member.

Abstract translation: 功率半导体器件包括作为外部端子的导电插入构件，其从面向印刷线路板的功率半导体器件的表面突出。 印刷线路板包括安装在印刷线路板的焊盘部分上的导电配件。 当功率半导体器件连接到印刷线路板时，配件构件在其中容纳插入构件。 插入构件具有形成在插入构件的侧表面上的凹部。 装配构件具有形成在装配构件的内侧表面上的弹性的突出部分。 当插入构件插入到装配构件中时，弹性使得装配构件的突出部分在压力下接触插入构件的凹部。

公开(公告)号：US08534641B2

公开(公告)日：2013-09-17

申请号：US12746394

申请日：2008-10-16

Applicant: Gerhard Schalowski ,  Bernd Kellner ,  Volker Weeber ,  Rainer Fuerst ,  Heiko Fresser ,  Martin Haas ,  Wolfgang Mailaender ,  Bernd Lutz

Inventor： Gerhard Schalowski ,  Bernd Kellner ,  Volker Weeber ,  Rainer Fuerst ,  Heiko Fresser ,  Martin Haas ,  Wolfgang Mailaender ,  Bernd Lutz

IPC: F16K31/02

CPC classification number: B60T8/3675 ,  H01R12/58 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: The invention relates to a connecting element for the electric connection of a solenoid valve to a circuit board, having a first electric contact element for electrically contacting the solenoid valve, a second electric contact element for electrically contacting the circuit board, and at least one tolerance adjusting element, and a related fluid assembly. According to the invention the connecting element is configured as one piece, and the first electric contact element and the second electric contact element are connected to each other via the at least one tolerance adjusting element. A first modifiable tolerance adjusting element enables a length adjustment in at least one spatial direction in order to predetermine a desired spatial positioning of the first contact element and the second contact element relative to each other.

Abstract translation: 本发明涉及一种用于将电磁阀电连接到电路板的连接元件，其具有用于电接触电磁阀的第一电接触元件，用于电接触电路板的第二电接触元件和至少一个公差 调节元件和相关的流体组件。 根据本发明，连接元件被构造为一体，并且第一电接触元件和第二电接触元件经由至少一个公差调节元件彼此连接。 第一可修改的公差调整元件能够在至少一个空间方向上进行长度调节，以便预先确定第一接触元件和第二接触元件相对于彼此的期望的空间定位。