公开(公告)号：US20150069113A1

公开(公告)日：2015-03-12

申请号：US14479325

申请日：2014-09-07

Applicant: PRINCETON OPTRONICS INC.

Inventor： Qing Wang ,  Jean-Francois Seurin ,  Chuni Lal Ghosh ,  Laurence Watkins

IPC: H01S5/022 ,  B23K1/00 ,  H01S5/00

CPC classification number: H01S5/02272 ,  B23K1/0016 ,  B23K1/012 ,  B23K2101/42 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01S5/0042 ,  H01S5/02276 ,  H01S5/423 ,  H05K1/0206 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2203/085 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.

Abstract translation: 提供了将VCSEL阵列绑定到底座和印刷电路板的过程。 该工艺特别适用于容易弯曲和翘曲的大面积薄型和超薄型VCSEL阵列。 该过程集成了平坦度测量步骤，并且在使用真空无焊接接合工艺将VCSEL阵列与基座或印刷电路结合之前应用适当的压力组合。 该过程非常有希望在VCSEL阵列与底座或印刷电路板之间进行非常好的质量接合。 该方法应用于构建具有改进的平坦度的光学模块，其可以与构建光电子系统的其它电子部件集成。

公开(公告)号：US08959759B2

公开(公告)日：2015-02-24

申请号：US14171584

申请日：2014-02-03

Applicant: Micron Technology, Inc.

Inventor： Kevin Gibbons ,  Tracy V. Reynolds ,  David J. Corisis

IPC: H01L25/065 ,  H01L25/10 ,  H05K1/18 ,  H05K3/34 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L24/83 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19104 ,  H05K1/111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3436 ,  H05K7/02 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.

Abstract translation: 公开了具有小厚度和相关制造方法的计算机模块。 在一个实施例中，计算机模块可以包括具有模块材料和至少部分延伸到模块材料中的孔的模块衬底。 计算机模块还可以包括由模块衬底承载的微电子封装。 微电子封装包括由封装衬底承载的半导体管芯。 半导体管芯的至少一部分经由孔延伸到衬底材料中。

公开(公告)号：US08881967B2

公开(公告)日：2014-11-11

申请号：US12576715

申请日：2009-10-09

Applicant: Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

Inventor： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

IPC: B23K1/00 ,  B23K26/14 ,  B23K3/06 ,  B23K1/005 ,  B23K26/03 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K1/0056 ,  B23K3/0623 ,  B23K26/03 ,  B23K26/1476 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/107

Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

Abstract translation: 一种用于互连头万向节组件中的两个连接焊盘的装置。 该装置包括用于输送金属块的输送机和用于朝向两个连接垫排出金属块的喷嘴。 喷嘴包括用于从传送器接收金属块的接收部分和设置在接收部分下游的直的引导件。 该直引导件的最大内径小于接收部分的最小内径。 该装置还包括一激光器，用于当金属芯块沿着包括通过所述直引导件的第一部分的路径和直引导件与两者之间的第二部分的路径通过时，将激光束从喷嘴的入口侧施加到金属块 连接垫 激光器被配置为熔化用于将金属块塞附接到两个连接焊盘的金属块。

公开(公告)号：US08721074B2

公开(公告)日：2014-05-13

申请号：US13482094

申请日：2012-05-29

Applicant: Randall Braxton Pugh ,  Adam Toner ,  Praveen Pandojirao-S ,  James Daniel Riall ,  Daniel B. Otts ,  Edward Kernick

Inventor： Randall Braxton Pugh ,  Adam Toner ,  Praveen Pandojirao-S ,  James Daniel Riall ,  Daniel B. Otts ,  Edward Kernick

IPC: G02C7/08

CPC classification number: H05K3/301 ,  G02C7/04 ,  G02C7/083 ,  G02C7/101 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10568 ,  H05K2201/10727 ,  H05K2201/10916 ,  H05K2201/10984

Abstract: Ophthalmic lenses, including contact lenses may be enhanced through the incorporation of both active and passive electrical components. Electrical interconnects and die attachment configurations are required to ensure electrical connectivity between the components and the optic portion of the lens as well as providing a means for mounting planar devices on spherical surfaces. Electrical interconnects and die attachment for powered ophthalmic devices, including contact lenses includes realizing conductive traces on optical plastic, attaching planar dies to spherical surfaces and underfilling, overmolding and light blocking to complete the lens.

Abstract translation: 包括隐形眼镜在内的眼科镜片可以通过并入有源和无源电气元件来增强。 需要电互连和管芯附接配置以确保部件和透镜的光学部分之间的电连接以及提供用于将平面器件安装在球形表面上的装置。 用于动力眼科装置（包括隐形眼镜）的电互连和芯片附件包括在光学塑料上实现导电迹线，将平面裸片附接到球形表面和底部填充，包覆成型和遮光以完成透镜。

公开(公告)号：US08659119B2

公开(公告)日：2014-02-25

申请号：US12783787

申请日：2010-05-20

Applicant: Vijayeshwar D. Kharma ,  Jennifer V. Muncy ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit ,  David Questad

Inventor： Vijayeshwar D. Kharma ,  Jennifer V. Muncy ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit ,  David Questad

IPC: H01L27/01

CPC classification number: H01L28/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T428/24479 ,  H01L2224/0401 ,  H01L2924/00

Abstract: An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.

Abstract translation: 一种电子模块，包括具有至少一个结构的衬底，该结构减少了通过衬底的应力流动，其中所述结构包括在衬底的表面中的至少一个沟槽。

公开(公告)号：US08593823B2

公开(公告)日：2013-11-26

申请号：US12588728

申请日：2009-10-26

Applicant: Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

Inventor： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

IPC: H05K7/00

CPC classification number: G11B5/486 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/181 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49167

Abstract: A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.

Abstract translation: 具有电路的悬挂板包括导电图案。 导电图案包括设置在具有电路的悬挂板的前表面上并与磁头电连接的第一端子; 以及设置在具有电路的悬挂板的背面上并与电子设备电连接的第二端子。

公开(公告)号：US08503132B2

公开(公告)日：2013-08-06

申请号：US11509972

申请日：2006-08-25

Applicant: Eiki Oosawa

Inventor： Eiki Oosawa

IPC: G11B5/60

CPC classification number: G11B5/60 ,  H05K3/3442 ,  H05K2201/09081 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/107 ,  Y02P70/613

Abstract: A head gimbal assembly for a hard disk drive includes a head slider having a head element part which performs reading and/or writing of data to/from a magnetic disc and a suspension on which the head slider is mounted. Bonding pads formed on the head slider are formed on a side surface of the head slider except for an air bearing surface (ABS) which faces the magnetic disc and a back surface on a side opposite to the ABS. End peripheries of the bonding pads are arranged to be in contact with an end periphery of the side surface of the head slider which abuts on the back surface of the head slider.

Abstract translation: 用于硬盘驱动器的头万向架组件包括具有头元件部分的磁头滑动器，磁头元件部件执行从磁盘读取和/或写入数据以及安装磁头滑块的悬架。 形成在磁头滑块上的接合焊盘形成在磁头滑块的侧表面上，除了面向磁盘的空气轴承表面（ABS）和与ABS相对的一侧的后表面。 接合焊盘的端部周边被布置成与头部滑块的侧表面的与端部滑块的后表面邻接的端部周边接触。

公开(公告)号：US08445926B2

公开(公告)日：2013-05-21

申请号：US11995649

申请日：2006-12-28

Applicant: Jun Seok Park ,  Yong Seok Choi

Inventor： Jun Seok Park ,  Yong Seok Choi

IPC: H01L33/00

CPC classification number: H05K1/0206 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16 ,  H05K1/0204 ,  H05K3/4069 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10727

Abstract: Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board provided with a circuit pattern used for driving the light emitting diode and a through hole formed in an area where the light emitting diode is mounted, and a heat sink provided in the through hole and contacted with a bottom surface of the light emitting diode.

Abstract translation: 公开了一种LED封装，其制造方法和具有该LED封装的背光单元。 发光二极管封装包括发光二极管，设置有用于驱动发光二极管的电路图案的印刷电路板和形成在安装有发光二极管的区域中的通孔，以及设置在该发光二极管的散热片 通孔并与发光二极管的底表面接触。

公开(公告)号：US20120170240A1

公开(公告)日：2012-07-05

申请号：US13416560

申请日：2012-03-09

Applicant: Hironori Tanaka

Inventor： Hironori Tanaka

IPC: H05K7/06 ,  H05K1/16

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/0269 ,  H05K3/0035 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09036 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/1469 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01028

Abstract: A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the core substrate separate from the conduction circuit. Also included is forming a concavity in the core substrate, the concavity being formed in an area of the core substrate not including the conductor circuit and alignment mark, and inserting the electronic component into the concavity in the core substrate by using the alignment mark on the core substrate to align the electronic component with the concavity.

Abstract translation: 一种多层印刷线路板及其制造方法。 一种方法包括制造其中容纳有电子部件的多层印刷线路板的方法。 该方法包括在芯基板上形成导通电路，并在芯基板上形成与导通电路分离的对准标记。 还包括在芯基板中形成凹部，凹部形成在不包括导体电路的芯基板的区域和对准标记中，并且通过使用在芯基板上的对准标记将电子部件插入芯基板的凹部 芯基板以使电子部件与凹部对准。

公开(公告)号：US08213121B2

公开(公告)日：2012-07-03

申请号：US11973668

申请日：2007-10-09

Applicant: Melvin J. A. Dela Pena ,  Edmar C. Escober ,  Sandy E. Joson ,  Teddy T. Tabarangao

Inventor： Melvin J. A. Dela Pena ,  Edmar C. Escober ,  Sandy E. Joson ,  Teddy T. Tabarangao

IPC: G11B21/16 ,  G11B21/24

CPC classification number: H05K3/3452 ,  G11B5/4853 ,  H05K3/3442 ,  H05K2201/09909 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/613

Abstract: A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.

Abstract translation: 一种防止焊料桥接的方法和装置。 该方法包括提供其上设置有焊盘的基底层。 该方法还包括在衬底层内提供信号导电层。 该方法还包括在信号导电层上形成焊盘。 焊盘具有基面。 该方法还包括在焊盘的基面的上方形成阻挡部。 阻挡部分用于在回流过程中控制焊料流动。