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    Method of bonding flying leads
    13.
    发明申请
    Method of bonding flying leads 审中-公开
    拼接飞线的方法

    公开(公告)号：US20070137025A1

    公开(公告)日：2007-06-21

    申请号：US11359427

    申请日：2006-02-23

    Applicant: Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    Inventor： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

    IPC: B23K1/06

    CPC classification number: H05K3/361 ,  G11B5/4846 ,  H05K3/328 ,  H05K2201/0397 ,  H05K2201/10765 ,  H05K2203/0285 ,  Y10T29/49027 ,  Y10T29/4903

    Abstract: The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: positioning the flying leads to correspond to the pads arranged parallel; and applying supersonic vibrations to a bonding tool so as to respectively bond the flying leads to the pads. And widths of the flying leads are wider than those of the pads, and supersonic vibrations are applied to the bonding tool, which is pressing the flying leads onto the pads, so that the flying leads are respectively supersonic-bonded to the pads.

    Abstract translation: 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：将飞行引线对准于平行布置的焊盘; 以及将超音速振动施加到接合工具，以将所述飞行引线分别连接到所述焊盘。 并且飞行引线的宽度比焊盘的宽度宽，并且超音速振动被施加到将飞行引线压在焊盘上的焊接工具，使得飞行引线分别超音速粘合到焊盘。

    ELECTRICAL COMPONENT PACKAGE WITH REINFORCED MOLDED PINS
    16.
    发明申请
    ELECTRICAL COMPONENT PACKAGE WITH REINFORCED MOLDED PINS 审中-公开

    公开(公告)号：US20180122547A1

    公开(公告)日：2018-05-03

    申请号：US15337180

    申请日：2016-10-28

    Applicant: XFMRS, Inc,

    Inventor： Tung Kong Luk ,  Yu kun Liao

    IPC: H01F27/04 ,  H01R12/57 ,  H05K3/34

    CPC classification number: H05K3/3421 ,  H01F27/027 ,  H01R12/57 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10689 ,  H05K2201/10765

    Abstract: An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.

    CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE
    18.
    发明申请
    CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE 审中-公开
    电动机的电路布置和相关控制器

    公开(公告)号：US20130069427A1

    公开(公告)日：2013-03-21

    申请号：US13583185

    申请日：2011-03-11

    Applicant: Jens Nowotnick ,  Michael Heim ,  Stefan Keil ,  Peter Rehbein ,  Gerhard Braun ,  Georg Voegele ,  Sigmund Braun ,  Andreas Kulik

    Inventor： Jens Nowotnick ,  Michael Heim ,  Stefan Keil ,  Peter Rehbein ,  Gerhard Braun ,  Georg Voegele ,  Sigmund Braun ,  Andreas Kulik

    IPC: H05K7/14 ,  H05K5/02 ,  H05K7/20 ,  B60L1/00

    CPC classification number: H05K3/202 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1815 ,  H05K1/0203 ,  H05K3/0058 ,  H05K5/0034 ,  H05K5/0069 ,  H05K2201/10765 ,  H05K2201/10924 ,  H05K2203/1316 ,  H05K2203/1322

    Abstract: The invention relates to a circuit arrangement (1) comprising an electrical and/or electronic circuit unit (10), which comprises a circuit carrier (14), on which at least one electrical and/or electronic component (12) is arranged, and at least one connection region (5) with at least one contact unit (14.2) for electrically contact-connecting the electrical and/or electronic circuit unit (10) to other electrical and/or electronic structural units, wherein at least one region of the circuit unit (10) is arranged in a housing unit (20) sealed relative to the surroundings. According to the invention, the housing unit (20) comprises a protective compound which surrounds the at least one region of the circuit unit (10) in a sealing fashion and surrounds the at least one connection region (5) in such a way that the at least one contact unit (14.2) is embedded at least at its side areas into the protective compound (22).

    Abstract translation: 本发明涉及一种包括电和/或电子电路单元（10）的电路装置（1），该电路和/或电子电路单元（10）包括电路载体（14），至少一个电和/或电子部件（12）布置在该电路单元上， 至少一个具有至少一个接触单元（14.2）的连接区域（5），用于将电气和/或电子电路单元（10）电接触连接到其它电气和/或电子结构单元，其中至少一个区域 电路单元（10）布置在相对于周围环境密封的壳体单元（20）中。 根据本发明，壳体单元（20）包括保护性化合物，其围绕电路单元（10）的至少一个区域以密封方式包围至少一个连接区域（5），使得 至少一个接触单元（14.2）至少在其侧部区域被嵌入保护化合物（22）中。

    ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME
    19.
    发明申请
    ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME 审中-公开
    电气连接结构和发光二极管模块，织物电路和具有相同功能的信号纺织品

    公开(公告)号：US20120032224A1

    公开(公告)日：2012-02-09

    申请号：US13205906

    申请日：2011-08-09

    Applicant: Chih Chang Fang ,  Hong Hsu Huang

    Inventor： Chih Chang Fang ,  Hong Hsu Huang

    IPC: H01L33/38

    CPC classification number: H05K3/325 ,  H01R4/2404 ,  H01R4/58 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10765

    Abstract: An electrical connection structure for use in an electronic component, a light emitting diode (LED) module, a fabric circuit and a signal textile with the same are provided. The electrical connection structure comprises a plurality of J-type leads which electrically connect to the electronic component and encircle two conductive lines. Thus, the electronic component can be firmly attached and electrically connected to the two conductive lines.

    Abstract translation: 提供了一种用于电子部件的电连接结构，发光二极管（LED）模块，织物电路和具有该电连接结构的信号纺织品。 电连接结构包括电连接到电子部件并且包围两条导线的多个J型引线。 因此，电子部件可以牢固地附接并电连接到两条导线。

    Press-fit fixing terminal, and electronic component having the same terminal
    20.
    发明授权
    Press-fit fixing terminal, and electronic component having the same terminal 有权
    压配固定端子和具有相同端子的电子部件

    公开(公告)号：US07210969B1

    公开(公告)日：2007-05-01

    申请号：US11511445

    申请日：2006-08-29

    Applicant: Yukio Hashimoto ,  Seiki Miura ,  Takumi Nishimoto ,  Takashi Tomago

    Inventor： Yukio Hashimoto ,  Seiki Miura ,  Takumi Nishimoto ,  Takashi Tomago

    IPC: H01R13/42

    CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10765 ,  H05K2201/10856

    Abstract: A press-fit fixing terminal is mountable to a wiring board by being inserted into a through-hole of the wiring board, and includes a flat plate section and a resilient contacting section. The flat plate section is made of metal thin plate and double-backed such that an end of the flat plate section is placed on a root side and a bent point works as an insertion tip when the terminal is inserted into the through-hole. The resilient contacting sections sandwich the double-backed portion of the flat plate section such that they are placed symmetrically with respect to the double-backed portion and both of the ridges of the resilient contacting section face outward viewed from the double-backed portion, so that each one of the resilient contacting sections forms a V-shape including an obtuse angle.

    Abstract translation: 压入固定端子通过插入到布线板的通孔中而安装到布线板，并且包括平板部分和弹性接触部分。 平板部分由金属薄板制成，并且当端子插入到通孔中时，平板部分的端部被放置在根部侧上，并且弯曲点用作插入尖端。 弹性接触部分夹着平板部分的双重部分，使得它们相对于双背部分对称地放置，并且弹性接触部分的两个脊部从双背部分向外看，因此 每个弹性接触部分形成包括钝角的V形。

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