公开(公告)号：US07677905B2

公开(公告)日：2010-03-16

申请号：US11979968

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

公开(公告)号：US07578681B2

公开(公告)日：2009-08-25

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

公开(公告)号：US07563112B2

公开(公告)日：2009-07-21

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

公开(公告)号：US20080253096A1

公开(公告)日：2008-10-16

申请号：US12155947

申请日：2008-06-12

Applicant: Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

Inventor： Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

IPC: H05K7/00

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3426 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10787 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract translation: 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。

公开(公告)号：US20060192273A1

公开(公告)日：2006-08-31

申请号：US11066875

申请日：2005-02-25

Applicant: Bernhard Lange ,  William Boyd

Inventor： Bernhard Lange ,  William Boyd

IPC: H01L23/48

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

Abstract translation: 集成电路（IC）封装100包括耦合到IC的IC 102和引线104。 每个引线具有被配置为耦合到集成电路的第一端106和被配置为穿过延伸穿过安装板112的多个安装孔110中的一个的第二端108。 引线包括至少一个定位引线114，定位引线114包括止动件118，该止动件118是定位引线的连续部分，并且具有大于多个安装孔中的第一孔124的直径122的横向尺寸120。 引线还包括至少一个非定位引线116，其具有连续均匀成形的主体130，其横向尺寸132小于多个安装孔中的第二孔136的直径134。 停止限制非定位导线通过第二个孔的延伸。

公开(公告)号：US20060113666A1

公开(公告)日：2006-06-01

申请号：US11282834

申请日：2005-11-21

Applicant: Jun Oonishi

Inventor： Jun Oonishi

IPC: H01L23/48

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface-mounted electronic component has an outer lead extending from a package for connection to a circuit pattern on a printed circuit board by using a connecting member. The outer lead has a hole having an opening at least on a connecting member facing side in a portion of the outer lead for connecting the outer lead to the circuit pattern.

Abstract translation: 表面安装的电子部件具有从用于连接到印刷电路板上的电路图案的封装件延伸的外部引线，通过使用连接部件。 外部引线具有至少在外部引线的一部分中的连接构件朝向侧的开口，用于将外部引线连接到电路图案。

公开(公告)号：US06858796B1

公开(公告)日：2005-02-22

申请号：US10673695

申请日：2003-09-29

Applicant: Paul Jeffrey Garnett ,  Jay Kevin Osborn ,  Graham Bestwick

Inventor： Paul Jeffrey Garnett ,  Jay Kevin Osborn ,  Graham Bestwick

IPC: H05K3/30 ,  H05K9/00

CPC classification number: H05K3/308 ,  H05K2201/10371 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: An electromagnetic (EM) shielding assembly includes an electrically conductive shielding portion and one or more electrically conductive protrusions for engaging with respective conductive apertures in a circuit board. The electrically conductive protrusions can be in electrical communication with the EM shielding portion. The protrusions can enable the EM shielding assembly to be attached to a circuit board in a computer system while also providing an electrical connection to logical ground. Further components, for example a heat sink that may be in electrical communication with the EM shielding portion, may thereby also be connected to logical ground.

Abstract translation: 电磁（EM）屏蔽组件包括导电屏蔽部分和一个或多个导电突起，用于与电路板中的各个导电孔接合。 导电突起可以与EM屏蔽部分电连通。 突起可使EM屏蔽组件能够连接到计算机系统中的电路板，同时还提供与逻辑接地的电连接。 其它部件，例如可能与EM屏蔽部分电气连通的散热器，因此也可以连接到逻辑接地。

公开(公告)号：US5411404A

公开(公告)日：1995-05-02

申请号：US145018

申请日：1993-10-29

Applicant: Iosif Korsunsky ,  Tod M. Harlan ,  Joanne E. Shipe

Inventor： Iosif Korsunsky ,  Tod M. Harlan ,  Joanne E. Shipe

IPC: H01R13/648 ,  H01R12/50 ,  H01R13/6585 ,  H01R13/6594 ,  H05K3/30 ,  H05K7/12 ,  H01R13/652 ,  H01R13/73

CPC classification number: H05K7/12 ,  H01R12/58 ,  H01R13/6585 ,  H01R23/6873 ,  H05K3/308 ,  H01R13/648 ,  H01R13/6594 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: An electrical connector (10) of the type having an array of signal contacts (22) surface mountable to pads of a circuit board (20), with at least one ground bus (40) having a plurality of post sections (44,50,52) insertable into through holes (34) of the circuit board. At least two of the post sections (50,52) include protuberances (54,56) proximate free ends thereof adapted to bear against side walls of the respective through holes upon insertion thereinto, for deflection of the shanks (62,64) of the post sections in the opposite direction. The protuberance of each of the at least two post sections extends in opposed directions along the row of posts, thus cooperating to act as a clamp of modest force to retain the connector to the board prior to contact soldering. The deflectable shank (62,64) preferably has a reduced cross-sectional area at root (66,68) facilitating deflection in the plastic region.

Abstract translation: 一种电连接器（10），其具有可安装到电路板（20）的焊盘的信号触头阵列（22），至少一个接地母线（40）具有多个支柱部分（44,50， 52）可插入到电路板的通孔（34）中。 至少两个柱部分（50,52）包括邻近其自由端的突起（54,56），其适于在插入其中时抵靠相应通孔的侧壁，用于使所述杆部（62,64）的杆 在相反方向的柱子。 所述至少两个柱部分中的每一个的突起沿着所述柱的相反方向延伸，从而协作以用作适度力的夹具以在所述接触焊接之前将所述连接器保持在所述板上。 可偏转柄（62,64）优选地具有减小的根部横截面积（66,68），有利于塑性区域中的偏转。

公开(公告)号：US5109319A

公开(公告)日：1992-04-28

申请号：US607718

申请日：1990-11-01

Applicant: Jerome Potash

Inventor： Jerome Potash

IPC: H01G2/06 ,  H01G9/00 ,  H01L23/49 ,  H05K3/30

CPC classification number: H01G2/06 ,  H01G9/00 ,  H01L24/01 ,  H05K3/308 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/19041 ,  H05K2201/094 ,  H05K2201/10174 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10878 ,  H05K2203/168

Abstract: A diode or other axial lead electronic component which requires mounting of its leads in a predetermined orientation is provided with leads of considerably different diameter. A printed circuit board is provided with holes sized to receive respective leads, so that the leads can be inserted into the holes only one way. Instead of having circular cross-sections and different diameters, one lead may have a circular cross-section while all or an end portion of the other lead has a non-circular cross-section with a diameter allowing that lead to fit in only the larger hole of the printed circuit board.

Abstract translation: 需要以预定方向安装其引线的二极管或其它轴向引线电子部件具有直径相当不同的引线。 印刷电路板设置有用于接收相应引线的孔，使得引线可以仅以一种方式插入到孔中。 代替具有圆形横截面和不同直径，一个引线可以具有圆形横截面，而另一个引线的全部或一个端部具有非圆形横截面，其直径允许仅导致较大的直径 印刷电路板的孔。

公开(公告)号：US4171855A

公开(公告)日：1979-10-23

申请号：US803879

申请日：1977-06-06

Applicant: Jef Raskin

Inventor： Jef Raskin

IPC: H01R12/70 ,  H05K3/30 ,  H05K3/34 ,  H05K1/08

CPC classification number: H01R12/7076 ,  H05K3/308 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2201/10484 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K3/3447

Abstract: An electronic component is provided having mounting leads configured as concentric arcs centered about a desired axis of rotation. The leads may therefore be inserted into a mounting board, and the component rotated to a desired angle with respect to the surface of the mounting board. In some embodiments, one or more of the mounting leads is provided with tabs or other positioning elements to facilitate the positioning of the component at any of a number of selected angles relative to the mounting board.

Abstract translation: 提供了一种电子部件，其具有被构造成围绕期望的旋转轴线居中的同心圆弧的安装引线。 因此，引线可以插入到安装板中，并且部件相对于安装板的表面旋转到期望的角度。 在一些实施例中，一个或多个安装引线设置有突片或其它定位元件，以便于相对于安装板以多个选定角度的任何一个定位元件。