公开(公告)号：US08910356B2

公开(公告)日：2014-12-16

申请号：US12785887

申请日：2010-05-24

Applicant: Michael S. Randall ,  Chris Wayne ,  John McConnell

Inventor： Michael S. Randall ,  Chris Wayne ,  John McConnell

IPC: H01G7/00 ,  H01G4/40 ,  H05K1/14 ,  H05K3/46 ,  H01G4/30 ,  H01G4/12 ,  H05K1/03

CPC classification number: H05K1/141 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09018 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

Abstract translation: 提供一种形成电气部件的方法。 该方法包括通过将集成电路电连接到柔性电路来准备子组件; 以及将所述子组件附接到具有曲率偏差超过0.008英寸/英寸的安装表面的多层陶瓷电容器。

公开(公告)号：US20140313684A1

公开(公告)日：2014-10-23

申请号：US13864656

申请日：2013-04-17

Applicant: United States of America as Represented by the Secretary of the Army

Inventor： Bruce V. Hughes

IPC: H05K1/11 ,  H05K3/10 ,  H05K1/18

CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/4682 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10583 ,  Y10T29/49155

Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和有源的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状的心轴上制造，例如圆柱体或球体，以便形成中空弯曲的非平面结构。

公开(公告)号：US08809689B2

公开(公告)日：2014-08-19

申请号：US13539677

申请日：2012-07-02

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。

公开(公告)号：US20140003015A1

公开(公告)日：2014-01-02

申请号：US14016707

申请日：2013-09-03

Applicant: Shinji WATANABE ,  Nobuhiro MIKAMI ,  Junya SATO ,  Kenichiro FUJII ,  Katsumi ABE ,  Atsumasa SAWADA

Inventor： Shinji WATANABE ,  Nobuhiro MIKAMI ,  Junya SATO ,  Kenichiro FUJII ,  Katsumi ABE ,  Atsumasa SAWADA

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/023 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/32 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09436 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  H05K2203/302 ,  Y02P70/611 ,  H01L2924/00

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract translation: 本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。 在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。 弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。 基座部分13a由绝缘材料形成。 半导体封装20安装在焊盘部分15a上。

公开(公告)号：US20120273260A1

公开(公告)日：2012-11-01

申请号：US13539677

申请日：2012-07-02

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。

公开(公告)号：US08152048B2

公开(公告)日：2012-04-10

申请号：US12331154

申请日：2008-12-09

Applicant: Longqiang Zu

Inventor： Longqiang Zu

IPC: B23K35/12

CPC classification number: B23K3/0638 ,  H01L2924/0002 ,  H05K3/1225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09018 ,  H05K2201/09136 ,  H05K2201/094 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T428/24273 ,  Y10T428/24612 ,  H01L2924/00

Abstract: A multiple substrate system, a method, and structure for adapting solder volume to a warped module. An illustrative embodiment comprises a method for joining a first substrate to a second substrate. A deviation from a nominal gap between the first substrate and the second substrate at a first region of the first substrate is ascertained. A volume of solder paste necessary to compensate for the deviation from a nominal gap is determined. The volume of solder paste necessary to compensate for the deviation at the first region of the first substrate is applied. Further, the second substrate is bonded to the first substrate using, at least in part, the solder paste applied at the first region of the first substrate.

Abstract translation: 用于使焊料体积适应于翘曲模块的多基板系统，方法和结构。 示例性实施例包括用于将第一基板接合到第二基板的方法。 确定在第一基板的第一区域处与第一基板和第二基板之间的标称间隙的偏差。 确定补偿偏离标称间隙所需的一定量的焊膏。 施加补偿第一基板的第一区域的偏差所需的焊膏的体积。 此外，使用至少部分地施加在第一基板的第一区域处的焊膏，将第二基板接合到第一基板。

公开(公告)号：US08098486B2

公开(公告)日：2012-01-17

申请号：US12430889

申请日：2009-04-27

Applicant: Po-Wen Hsiao ,  Yuan-Chih Tsai ,  Ted-Hong Shinn

Inventor： Po-Wen Hsiao ,  Yuan-Chih Tsai ,  Ted-Hong Shinn

IPC: H05K7/14

CPC classification number: H05K1/189 ,  G02F1/133305 ,  G02F2001/133388 ,  G02F2201/54 ,  G09F9/301 ,  H05K1/0281 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A flexible display device includes a display panel and a plurality of curving-restricting structures. The display panel has a display surface and a bottom surface opposite thereto. The display surface has a visible region and an outer region surrounding the visible region. The curving-restricting structures may be disposed on at least one of the outer region of the display surface and the bottom surface of the display panel. Each curving-restricting structure has a top surface and at least a slanted side wall. The top surfaces of adjacent curving-restricting structures are spaced with each other, and the slanted side walls of adjacent curving-restricting structures face each other. When the flexible display device are curved to a predetermined extent, adjacent curving-restricting structures may resist against with each other to prevent the display panel from being unduly curved to be damaged, and thus a use reliability of the flexible display device is improved.

Abstract translation: 柔性显示装置包括显示面板和多个弯曲限制结构。 显示面板具有显示面和与其相反的底面。 显示表面具有可见区域和围绕可见区域的外部区域。 弯曲限制结构可以设置在显示面的外部区域和显示面板的底面的至少一个上。 每个弯曲限制结构具有顶表面和至少一个倾斜的侧壁。 相邻的弯曲限制结构的顶面彼此间隔开，相邻弯曲限制结构的倾斜侧壁彼此面对。 当柔性显示装置弯曲到预定的程度时，相邻的弯曲限制结构可以彼此抵抗以防止显示面板被过度弯曲以致损坏，从而提高了柔性显示装置的使用可靠性。

公开(公告)号：US08029717B2

公开(公告)日：2011-10-04

申请号：US12063088

申请日：2006-08-17

Applicant: Kazuya Nakamura ,  Nobuo Imaizumi ,  Yoshihito Hiyama ,  Ryutaro Maeda ,  Hiroshi Goto

Inventor： Kazuya Nakamura ,  Nobuo Imaizumi ,  Yoshihito Hiyama ,  Ryutaro Maeda ,  Hiroshi Goto

IPC: B29C59/00

CPC classification number: B29C59/04 ,  B29C43/021 ,  B29C43/06 ,  B29C2043/025 ,  B29C2043/463 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/167

Abstract: There is provided a nanoimprint apparatus. The nanoimprint apparatus transfers a pattern formed on a surface of a mold to a transfer layer which is formed partially or entirely on a side surface of a substantially cylindrical or columnar substrate. The nanoimprint apparatus includes: a first jig which is in contact with the substrate 102; a second jig which rotatably supports the first jig; a press unit which is connected to the second jig to press the substrate on the mold 104 through the first and second jigs; and a movable holding unit which holds the mold and moves the mold 104 in a direction substantially perpendicular to a pressing force.

Abstract translation: 提供了一种纳米压印装置。 纳米压印装置将形成在模具表面上的图案转移到部分或全部形成在基本上圆柱形或柱状衬底的侧表面上的转印层。 纳米压印装置包括：与基板102接触的第一夹具; 第二夹具，其可旋转地支撑所述第一夹具; 压接单元，其连接到第二夹具，以通过第一和第二夹具将基板压在模具104上; 以及可移动保持单元，其保持模具并使模具104沿大致垂直于按压力的方向移动。

公开(公告)号：US20110211323A1

公开(公告)日：2011-09-01

申请号：US13018912

申请日：2011-02-01

Applicant: Norichika Unriin

Inventor： Norichika Unriin

IPC: H05K7/00 ,  H05K3/30

CPC classification number: H05K3/305 ,  H01L23/3121 ,  H01L25/0657 ,  H01L2224/45144 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2225/06562 ,  H01L2924/01079 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2203/0169 ,  H05K2203/082 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012

Abstract: According to one embodiment, a circuit board includes: a substrate on which circuit patterns are formed, a first surface of the substrate being formed substantially flat; and a solder resist film that covers the first surface of the substrate. The solder resist film assumes, as a whole, a convex shape in which the thickness of the solder resist film in the center of the substrate is larger than the thickness of the solder resist film in the periphery of the substrate.

Abstract translation: 根据一个实施例，电路板包括：基板，其上形成有电路图案，基板的第一表面基本上是平坦的; 以及覆盖基板的第一表面的阻焊膜。 作为整体，阻焊膜总体上呈现基板中心的阻焊膜的厚度大于基板周围的阻焊膜的厚度的凸形状。

公开(公告)号：US07906731B2

公开(公告)日：2011-03-15

申请号：US12612553

申请日：2009-11-04

Applicant: Nobuyuki Matsui ,  Hideo Nagai ,  Keiji Nishimoto ,  Toshifumi Ogata

Inventor： Nobuyuki Matsui ,  Hideo Nagai ,  Keiji Nishimoto ,  Toshifumi Ogata

IPC: H01L33/00

CPC classification number: F21V29/004 ,  F21V19/0055 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.

Abstract translation: 照明装置包括散热器70，插座10和LED模块60. LED模块60具有在由绝缘板和金属板构成的金属基底63的顶侧的中心部分中的发光单元62 。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热器70侧突出。 LED模块60在发光单元62的围绕根据插座10的按压单元14T，14L和14D被按压的状态下安装在散热器70上。将发光单元62的环绕压在 散热器70确保LED模块60的翘曲的中心部分接触散热器70。