公开(公告)号：US20140291846A1

公开(公告)日：2014-10-02

申请号：US14113815

申请日：2013-06-28

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD

Inventor： Li Chai

IPC: H01L23/00

CPC classification number: G02F1/1345 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/167 ,  H05K2201/0326 ,  H05K2201/0391 ,  H05K2201/09154 ,  H05K2201/09227 ,  H05K2201/10136

Abstract: A fanout line structure of an array substrate includes a plurality of fanout lines arranged on a fanout area of the array substrate, where the fanout line is used to connect a signal line with a bonding pad. Lengths of different fanout lines are different. At least one fanout line includes a first subsection and a second subsection. An electrical resistivity of material of the second subsection of the fanout line is greater than an electrical resistivity of material of the first subsection of the fanout line. Length of a first fanout line is greater than length of a second fanout line, and length of a second subsection of the second fanout line is greater than length of a second subsection of the first fanout line.

Abstract translation: 阵列基板的扇出线结构包括布置在阵列基板的扇出区域上的多个扇出线，其中扇出线用于将信号线与接合焊盘连接。 不同扇出线的长度不同。 至少一个扇出线包括第一小节和第二小节。 扇出线的第二子部分的材料的电阻率大于扇出线的第一子部分的材料的电阻率。 第一扇出线的长度大于第二扇出线的长度，并且第二扇出线的第二子部分的长度大于第一扇出线的第二子部分的长度。

公开(公告)号：US08847356B2

公开(公告)日：2014-09-30

申请号：US13884340

申请日：2011-12-07

Applicant: Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

Inventor： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

IPC: H01L21/02 ,  H05K3/46 ,  H05K1/18 ,  H01L49/02 ,  H05K1/02

CPC classification number: H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

Abstract: Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

Abstract translation: 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。

公开(公告)号：US20140268587A1

公开(公告)日：2014-09-18

申请号：US14209106

申请日：2014-03-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi Nomura ,  Akihiko Kamada

IPC: H05K1/03 ,  H05K3/30

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2201/2072 ,  H05K2203/063 ,  H05K2203/1327 ,  Y10T29/49146 ,  H01L2924/00014

Abstract: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.

Abstract translation: 在连接部件中的绝缘基板的接触面上形成防止树脂层分离的接合结构，该接触面与树脂层接触。 树脂层与绝缘基板的与树脂层接触的接触表面中的接合结构接合，接触表面形成连接部件的侧表面。

公开(公告)号：US08785788B2

公开(公告)日：2014-07-22

申请号：US13273532

申请日：2011-10-14

Applicant: Keisuke Shimizu ,  Yukinobu Mikado

Inventor： Keisuke Shimizu ,  Yukinobu Mikado

IPC: H05K1/16

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/92144 ,  H05K1/183 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/063 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49133

Abstract: A wiring board with a built-in electronic component includes a substrate having an opening portion and having a first surface and a second surface on the opposite side of the first surface, and an electronic component having a third surface and a fourth surface on the opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces the same direction as the first surface of the substrate. The electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface.

Abstract translation: 具有内置电子部件的布线基板包括：具有开口部的基板，具有与第一面相反一侧的第一面和第二面;以及电子部件，其具有第三面和第四面， 并且定位在基板的开口部分中，使得第三表面面向与基板的第一表面相同的方向。 电子部件具有连接电子部件的第四面和侧面的弯曲面，基板的开口部具有锥形部，该锥部由基板的锥形面形成，该基部与开口部的内壁连接，第一 表面和从第一表面朝向第二表面逐渐变细。

公开(公告)号：US20130335932A1

公开(公告)日：2013-12-19

申请号：US13526817

申请日：2012-06-19

Applicant: Theodore Timaru

Inventor： Theodore Timaru

IPC: H05K5/00

CPC classification number: H01P5/028 ,  H05K1/0239 ,  H05K1/142 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09845

Abstract: The system includes a first printed circuit board including a first transmission line, the first circuit board may be attached to a chassis and a second printed circuit board including a second transmission line, the second circuit board may be attached to the chassis and/or the first printed circuit board and the second transmission line configured to electrically couple power from the first transmission line.

Abstract translation: 该系统包括第一印刷电路板，其包括第一传输线，第一电路板可以附接到机架，第二印刷电路板包括第二传输线，第二电路板可以附接到机架和/或 第一印刷电路板和第二传输线，其被配置为电耦合来自第一传输线的电力。

公开(公告)号：US08547702B2

公开(公告)日：2013-10-01

申请号：US12793170

申请日：2010-06-03

Applicant: Takahiro Yada ,  Takahiro Yamazaki ,  Sumiki Muto

Inventor： Takahiro Yada ,  Takahiro Yamazaki ,  Sumiki Muto

IPC: H05K5/00

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/162 ,  H05K2203/167

Abstract: A multi-piece board includes a frame and multiple wiring boards connected to the frame. The frame and each of the wiring boards are positioned with a clearance. The frame and/or each of the wiring boards has an end portion having a first notch portion on a surface side adjacent to the clearance. The end portion of the frame and/or each of the wiring boards has a second notch portion formed on the opposite surface side with respect to the surface side of the first notched portion adjacent to the clearance. The clearance between the frame and each of the wiring boards is filled with an adhesive agent.

Abstract translation: 多片板包括框架和连接到框架的多个接线板。 框架和每个接线板以间隙定位。 框架和/或每个布线板具有在与间隙相邻的表面侧上具有第一切口部分的端部。 框架和/或每个布线板的端部具有相对于与间隙相邻的第一切口部分的表面侧的相对表面侧上形成的第二切口部分。 框架和每个布线板之间的间隙填充有粘合剂。

公开(公告)号：US20130183475A1

公开(公告)日：2013-07-18

申请号：US13876670

申请日：2011-09-30

Applicant: Yoshitaka Yoshida ,  Hiroaki Yamamoto

Inventor： Yoshitaka Yoshida ,  Hiroaki Yamamoto

IPC: H05K1/03 ,  B32B3/30 ,  H05K3/00

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: A multi-piece-array formed by laminating a plurality of ceramic layers includes: a product region where a plurality of wiring board portions having a rectangular shape in plan view and including cavities are arranged in matrix; a redundant portion that is positioned along a periphery of the product region; and dividing grooves that are formed on a front surface and/or a back surface along a boundary between the wiring board portions and a boundary between the wiring board portion and the redundant portion. A deepest portion of the dividing groove has an arc shape and the dividing groove includes a middle portion, and a width of the deepest portion is greater than a width of the groove inlet and a width of the middle portion is equal to or less than the width of the groove inlet.

Abstract translation: 通过层叠多个陶瓷层而形成的多片阵列包括：在平面图中具有矩形形状并且包括空腔的多个布线板部分以矩阵布置的产品区域; 沿着产品区域的周边定位的冗余部分; 以及沿着布线板部分之间的边界和布线板部分和冗余部分之间的边界形成在前表面和/或后表面上的划分凹槽。 分隔槽的最深部分具有弧形，分隔槽包括中间部分，并且最深部分的宽度大于沟槽入口的宽度，并且中间部分的宽度等于或小于 槽入口宽度。

公开(公告)号：US08330052B2

公开(公告)日：2012-12-11

申请号：US13242712

申请日：2011-09-23

Applicant: Tomoyuki Ishimatsu ,  Yukio Yamada

Inventor： Tomoyuki Ishimatsu ,  Yukio Yamada

IPC: H05K1/02

CPC classification number: H05K3/361 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/09154 ,  H05K2201/099 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region.

Abstract translation: 一种接合结构体的制造方法，其特征在于，具有：在以规定的方式配置各向异性导电膜之后，配置包含布线板的配线构件，所述布线构件具有在所述布线板被抗蚀剂覆盖的抗蚀剂区域 以及布线板未被抗蚀剂层覆盖的第二电极区域，使得与第二电极区域的边界处的抗蚀剂区域的边缘位于基板的倒角部分的上方; 并且从布线部件的侧面加热和压缩各向异性导电膜以熔化，使各向异性导电膜流入抗蚀剂区域的侧面，从而利用各向异性导电膜覆盖第二电极区域，从而将 第一电极区域和第二电极区域。

公开(公告)号：US08258411B2

公开(公告)日：2012-09-04

申请号：US12548933

申请日：2009-08-27

Applicant: Alan E. Wang ,  Kevin C. Olson

Inventor： Alan E. Wang ,  Kevin C. Olson

IPC: H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US07973391B2

公开(公告)日：2011-07-05

申请号：US12128620

申请日：2008-05-29

Applicant: Joseph C. Fjelstad ,  Kevin P. Grundy ,  Para K. Segaram ,  Gary Yasumura

Inventor： Joseph C. Fjelstad ,  Kevin P. Grundy ,  Para K. Segaram ,  Gary Yasumura

IPC: H01L23/58

CPC classification number: H05K1/0243 ,  G01R31/2822 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  Y10S438/981 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.

Abstract translation: 公开了锥形电介质和导体结构，其提供受控的阻抗互连，同时信号导体线从更细的间距转换到较粗的间距，从而消除通常与电路接触间距的变化相关的电中断。 还公开了用于构造装置和应用的方法。