公开(公告)号：US20240032192A1

公开(公告)日：2024-01-25

申请号：US18343772

申请日：2023-06-29

Applicant: Innolux Corporation

Inventor： Zhi-Fu Huang

IPC: H05K1/11 ,  H05K3/32

CPC classification number: H05K1/111 ,  H05K3/32 ,  H05K2201/0317 ,  H05K2201/09409 ,  H05K2201/07

Abstract: An electronic device, including multiple electronic elements, a first substrate, a second substrate, and a third substrate, is provided. The first substrate includes a first device element and a first connection pad. The second substrate includes a second device element and a second connection pad. The third substrate includes a first connection line, wherein the first connection pad and the second connection pad are coupled to the first connection line, and the first substrate, the second substrate, and the electronic elements are disposed on the third substrate.

公开(公告)号：US20180288866A1

公开(公告)日：2018-10-04

申请号：US15765017

申请日：2016-09-30

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellshaft

Inventor： Jonathan Silvano De Sousa

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/0207 ,  H05K1/0274 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0317 ,  H05K2201/0323 ,  H05K2201/10416 ,  H05K2201/2054

Abstract: A component carrier for carrying and cooling at least one heat generating electronic component is presented. The component carrier comprising includes an outer layer structure, an electrically insulating layer arranged adjacent to the outer layer structure, and a heat conducting structure arranged adjacent to the electrically insulating layer on a side opposite to the outer layer structure. The heat conducting structure is thermally coupled to the at least one heat generating electronic component such that the outer layer structure receives thermal radiation irradiated by the heat conducting structure and transports corresponding heat away from the component carrier via convection by a heat transfer medium surrounding the component carrier.

公开(公告)号：US10076030B2

公开(公告)日：2018-09-11

申请号：US15039629

申请日：2014-11-24

Applicant: Corning Precision Materials Co., Ltd.

Inventor： Jin Nyoung Heo ,  Tae Hyo Park ,  Dong Keun Shin ,  Jong Taek Kim ,  Sang Yoon Oh ,  Jin Sung Lim

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/0393 ,  B32B17/064 ,  G02F1/133305 ,  H05K1/0224 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/095 ,  H05K1/097 ,  H05K3/0067 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K2201/026 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2203/0113 ,  H05K2203/1545

Abstract: The present invention relates to a flexible hybrid substrate for a display and a method for manufacturing the same and, more specifically, to a flexible hybrid substrate for a display, which has a reduced occurrence of cracks, an improved level of flexibility, and can be used in a high-temperature process for manufacturing a display element, and a method for manufacturing the same. To this end, the present invention provides a flexible hybrid substrate for a display and a method for manufacturing the same, the flexible hybrid substrate for a display comprising: an ultra-thin plate glass; a first transparent thin film formed on one surface of the ultra-thin plate glass; and a second transparent thin film formed on the other surface of the ultra-thin plate glass, wherein the second transparent thin film includes a transparent conductive polymer.

公开(公告)号：US20180235075A1

公开(公告)日：2018-08-16

申请号：US15434919

申请日：2017-02-16

Applicant: Intel Corporation

Inventor： Taylor Gaines ,  Anna M. Prakash ,  Ziv Belman ,  Baruch Schiffmann ,  Arnon Hirshberg ,  Ron Wittenberg ,  Vladimir Malamud

IPC: H05K1/02 ,  H05K3/22 ,  H05K1/18

CPC classification number: H01L23/552 ,  H05K1/0218 ,  H05K1/0243 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/2018 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

公开(公告)号：US09949379B2

公开(公告)日：2018-04-17

申请号：US14897214

申请日：2014-04-30

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jongsoo Kim ,  Jeong-Sang Yu ,  O-Chung Kwon ,  Jae-Sic Kim

IPC: H05K3/36 ,  H05K3/28 ,  H05K3/46 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K1/03

CPC classification number: H05K3/361 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/10 ,  H05K3/285 ,  H05K3/46 ,  H05K3/4664 ,  H05K3/4676 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0317 ,  H05K2203/0759

Abstract: A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.

公开(公告)号：US09812412B2

公开(公告)日：2017-11-07

申请号：US14980404

申请日：2015-12-28

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo

IPC: H01L23/66 ,  H01L49/02 ,  H01L27/01

CPC classification number: H01L23/66 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L2223/6672 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/107 ,  H05K3/146 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09981 ,  H05K2201/10181 ,  H05K2203/0353 ,  H05K2203/1338 ,  H01L2924/00

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

公开(公告)号：US09775236B2

公开(公告)日：2017-09-26

申请号：US14371387

申请日：2014-03-07

Applicant: LG CHEM, LTD.

Inventor： Sung-Hak Bae ,  Sang-Choll Han ,  Byong-Mook Kim

IPC: H02K1/02 ,  H05K1/02 ,  H05K3/04 ,  H05B3/12 ,  H05B3/84 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/14 ,  H05K3/38 ,  G03F7/00

CPC classification number: H05K1/0296 ,  G03F7/00 ,  H05B3/12 ,  H05B3/84 ,  H05B2203/017 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/0023 ,  H05K3/0044 ,  H05K3/04 ,  H05K3/045 ,  H05K3/146 ,  H05K3/38 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0317 ,  H05K2201/09036 ,  H05K2203/0108

Abstract: The present disclosure relates to a transparent substrate including: a resin pattern layer including a plurality of grooves respectively including side surfaces and a bottom surface; and, a conductive layer formed within the grooves, wherein a line width of the conductive layer is 0.1 μm to 3 μm and an average height of the conductive layer is 5% to 50% of a maximum depth of each of the grooves, and a manufacturing method thereof, such that simplicity in a manufacturing process and a consecutive process are enabled, manufacturing costs are inexpensive, and a transparent substrate having superior electrical conductivity and transparency characteristics is manufactured.

公开(公告)号：US09730332B2

公开(公告)日：2017-08-08

申请号：US14342288

申请日：2013-11-11

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Hideta Arai ,  Atsushi Miki ,  Kohsuke Arai ,  Kaichiro Nakamuro

IPC: B32B15/01 ,  H05K1/05 ,  C25D1/04 ,  H05K3/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/36 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K3/022 ,  C25D1/04 ,  C25D7/0614 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/14 ,  H05K3/361 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/05 ,  H05K2201/058 ,  Y10T29/49126 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

公开(公告)号：US09549462B2

公开(公告)日：2017-01-17

申请号：US14780529

申请日：2014-03-03

Applicant: KANEKA CORPORATION

Inventor： Tooru Irie ,  Takahisa Fujimoto ,  Takashi Kuchiyama ,  Hironori Hayakawa ,  Shinya Omoto ,  Kenji Yamamoto

IPC: H05K1/09 ,  H05K1/02 ,  G06F3/044 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/22

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K1/0326 ,  H05K1/09 ,  H05K3/0064 ,  H05K3/06 ,  H05K3/067 ,  H05K3/108 ,  H05K3/227 ,  H05K3/388 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0317 ,  H05K2201/09663 ,  H05K2201/0979

Abstract: Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 μm or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2θ of the (111) plane of the second metal layer is less than 43.400° as measured using a CuKα ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.

Abstract translation: 提供一种透明导电膜，其包括在透明膜基板的至少一个表面上由图案化的金属细线构成的透明电极层。 线的线宽为5μm以下。 导线包括从透明膜基板一侧依次与第一金属层接触的第一金属层和第二金属层。 第一和第二金属层都含有90重量％以上的铜。 第一和第二金属层的总膜厚度为150〜1000nm。 使用CuKα射线作为X射线源测定的第二金属层的（111）面的衍射角2θ小于43.400°，第一金属层的结晶特性与第二金属层的晶体性质不同。

公开(公告)号：US09357636B2

公开(公告)日：2016-05-31

申请号：US13994448

申请日：2012-03-02

Applicant: Jin Hyong Lim ,  Song Ho Jang ,  Jin Woo Park ,  Ki-Hwan Kim ,  In-Seok Hwang ,  Chung Wan Kim ,  Seung Heon Lee ,  Beom Mo Koo ,  Ji Young Hwang

Inventor： Jin Hyong Lim ,  Song Ho Jang ,  Jin Woo Park ,  Ki-Hwan Kim ,  In-Seok Hwang ,  Chung Wan Kim ,  Seung Heon Lee ,  Beom Mo Koo ,  Ji Young Hwang

IPC: H01L31/18 ,  H01L31/0236 ,  H05K1/09 ,  H05K1/02 ,  G06F3/041 ,  H01B1/08 ,  H05K3/10 ,  H05K7/02 ,  G06F3/044 ,  G06F3/045 ,  H01L31/05 ,  H05K3/16 ,  H05K3/46

CPC classification number: H05K1/0274 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/08 ,  H01L31/02366 ,  H01L31/05 ,  H01L31/18 ,  H02S40/38 ,  H03K17/962 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/10 ,  H05K3/16 ,  H05K3/4644 ,  H05K7/02 ,  H05K2201/0317 ,  Y10T29/49155 ,  Y10T428/24802

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

Abstract translation: 本发明的示例性实施例涉及一种导电结构体，其包括具有AlO x N y的变暗图案层及其制造方法。 根据本发明的示例性实施例的导电结构体可以防止导电图案层的反射而不影响导电图案层的导电性，并且通过改善吸光度来改善导电图案层的隐蔽性。 因此，可以通过使用根据本发明的示例性实施例的导电结构体来开发具有改善的可视性的显示面板。