公开(公告)号：US20060213685A1

公开(公告)日：2006-09-28

申请号：US11442016

申请日：2006-05-26

Applicant: Alan Wang ,  Kevin Olson

Inventor： Alan Wang ,  Kevin Olson

IPC: H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20060211309A1

公开(公告)日：2006-09-21

申请号：US11440077

申请日：2006-05-25

Applicant: Tsutomu Matsuo ,  Masakazu Nagata

Inventor： Tsutomu Matsuo ,  Masakazu Nagata

IPC: H01R24/00

CPC classification number: H05K1/117 ,  H01R12/722 ,  H05K1/144 ,  H05K2201/09154 ,  H05K2201/2027

Abstract: A transmission board (10) comprises a frame body (30) and a surface board (20) supported by the frame body (30) and having a transmission circuit. The frame body (30) has plugging edges (33, 34) that project from the edges of the surface board (20) for guiding the terminals of mating connectors to connection pads on the surface board (20). The plugging edges have guiding slopes 33A and 33B, and 34A and 34B. At least the plugging edges of the frame body (30) are made of a metal or resin molding.

Abstract translation: 传输板（10）包括框体（30）和由框体（30）支撑并具有传输电路的表面板（20）。 框体（30）具有从表面板（20）的边缘突出的插入边缘（33,34），用于将配合连接器的端子引导到表面板（20）上的连接焊盘。 堵塞边缘具有引导斜面33A和33B以及34A和34B。框体（30）的至少堵塞边缘由金属或树脂模塑制成。

公开(公告)号：US07029266B2

公开(公告)日：2006-04-18

申请号：US10430612

申请日：2003-05-05

Applicant: Paul R. Walters, Jr. ,  Refugio C. Morales, Jr.

Inventor： Paul R. Walters, Jr. ,  Refugio C. Morales, Jr.

IPC: B29C59/04

CPC classification number: H05K3/0052 ,  B29C67/0044 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/1518

Abstract: Methods and apparatuses for shaping a corner of a printed circuit board are disclosed. An apparatus in accordance with one embodiment includes a carrier configured to releasably contact a printed circuit board, a curved contact surface positioned to roll against a corner of the printed circuit board. Optionally, another curved contact surface can be positioned to roll against another corner of the printed circuit board. The contact surface can be rotatable relative to the carrier about a rotation axis that is generally parallel to at least a portion of the curved contact surface. The contact surface can be continuous or discontinuous, and can shape the corner of the printed circuit board with a reduced tendency for damage to the printed circuit board. Multiple contact surfaces can be rotatable about different rotation axes.

公开(公告)号：US06991470B2

公开(公告)日：2006-01-31

申请号：US10912146

申请日：2004-08-06

Applicant: Thomas Muench

Inventor： Thomas Muench

IPC: H01R12/00

CPC classification number: H01L24/05 ,  H01L23/057 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85399 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/113 ,  H05K1/117 ,  H05K1/185 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2203/049 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

Abstract translation: 电路载体及其制造方法技术领域本发明涉及一种电路载体及其制造方法，该电路载体具有基板，具有两个相对布置的区域。 扁平连接器条的端子触点布置在区域的边缘区域中。 在至少一个端子触点之下布置有一个贯通触点，其中，与端子触点的后侧具有隐蔽的电连接，并且端子触点的顶侧呈现出不受干扰的形态和平坦表面。

公开(公告)号：US20050195052A1

公开(公告)日：2005-09-08

申请号：US10793022

申请日：2004-03-03

Applicant: Lewis Dove ,  John Casey

Inventor： Lewis Dove ,  John Casey

IPC: H01L21/48 ,  H01L21/768 ,  H01L49/00 ,  H01P3/08 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/46

CPC classification number: H01P3/088 ,  H01L21/4857 ,  H01L21/4867 ,  H05K1/0221 ,  H05K1/092 ,  H05K3/4667 ,  H05K2201/09154 ,  H05K2201/09981 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: In one embodiment, a plurality of thickfilm dielectric layers are printed on a substrate, with each successive layer being printed over a previous layer, and with each layer having sloped walls. After printing a first subset of the plurality of thickfilm dielectric layers, a first conductive thickfilm is printed over at least the walls of the first subset of dielectric layers. Then, after printing a second subset of the plurality of thickfilm dielectric layers, a second conductive thickfilm is printed over the second subset of dielectric layers (with the first and second conductive thickfilms being electrically coupled).

Abstract translation: 在一个实施例中，多个厚膜电介质层印刷在衬底上，其中每个连续层被印刷在先前的层上，并且每个层具有倾斜的壁。 在打印多个厚膜电介质层的第一子集之后，在至少第一电介质层子集的壁上印刷第一导电厚膜。 然后，在印刷多个厚膜电介质层的第二子集之后，将第二导电厚膜印刷在电介质层的第二子集上（第一和第二导电厚膜电耦合）。

公开(公告)号：US06932621B2

公开(公告)日：2005-08-23

申请号：US10394784

申请日：2003-03-21

Applicant: David M. Anderson ,  David R. Gladish ,  Robert T. Johnson ,  Matthew C. Malkin ,  Simon D. Senibi ,  Terrance L. Thomas

Inventor： David M. Anderson ,  David R. Gladish ,  Robert T. Johnson ,  Matthew C. Malkin ,  Simon D. Senibi ,  Terrance L. Thomas

IPC: B64C1/00 ,  H01R12/51 ,  H01R13/46 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H01R12/00

CPC classification number: H05K1/118 ,  H01R12/523 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09154 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A connector pad is provided having a base, a top opposite the base, and tapered sidewalls therebetween. The tapering minimizes stress concentrations when the connector pad is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies suitable for sandwiching a flat structurally integrated wiring array therebetween. A plurality of plated through holes formed in the connector pad enable access to the wiring array therein.

Abstract translation: 连接器衬垫设置有基部，与基部相对的顶部以及在它​​们之间的锥形侧壁。 当连接器垫结合到结构中或在结构的表面上时，渐缩使应力集中最小化。 连接器衬垫由多个结构承载层组成，适用于将平坦的结构上集成的布线阵列夹在其间。 形成在连接器焊盘中的多个电镀通孔使得能够访问其中的布线阵列。

公开(公告)号：US20050151247A1

公开(公告)日：2005-07-14

申请号：US11030288

申请日：2005-01-07

Applicant: Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

Inventor： Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

IPC: H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01L23/34

CPC classification number: H01L23/49805 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00014

Abstract: The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.

Abstract translation: 本发明提供一种电子装置，其特征在于，具备：表面安装在电路基板上的基底基板，安装在所述基板的表面上的一个或多个电子元件元件和/或其内部设置在所述基板的端部的外部电极 并且以垂直于基底基板的后表面的柱的形式，用于将一个或多个电子元件连接到电路板。 此外，基底在其端部设置有与基底的侧面和背面交叉的斜面。 外部电极的表面暴露在斜面上。

公开(公告)号：US20050012187A1

公开(公告)日：2005-01-20

申请号：US10892483

申请日：2004-07-16

Applicant: Koujiro Kameyama ,  Kiyoshi Mita

Inventor： Koujiro Kameyama ,  Kiyoshi Mita

IPC: H01L23/12 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H05K3/34 ,  H01L21/48 ,  H01L31/11

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.

Abstract translation: 半导体器件包括半导体元件和电连接到半导体元件的电极，半导体元件和电极被具有绝缘性能的密封剂密封，电极暴露在通过接合剂连接到安装表面上 外部安装电路板，其中电极被成形为使得当安装表面经由接合剂连接到安装电路板时，接合剂可以从围绕安装表面的侧表面可视地识别。

公开(公告)号：US20040185688A1

公开(公告)日：2004-09-23

申请号：US10394784

申请日：2003-03-21

Inventor： David M. Anderson ,  David R. Gladish ,  Robert T. Johnson ,  Matthew C. Malkin ,  Simon D. Senibi ,  Terrance L. Thomas

IPC: H01R012/00

CPC classification number: H05K1/118 ,  H01R12/523 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09154 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A connector pad is provided having a base, a top opposite the base, and tapered sidewalls therebetween. The tapering minimizes stress concentrations when the connector pad is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies suitable for sandwiching a flat structurally integrated wiring array therebetween. A plurality of plated through holes formed in the connector pad enable access to the wiring array therein.

Abstract translation: 连接器衬垫设置有基部，与基部相对的顶部以及在它​​们之间的锥形侧壁。 当连接器垫结合到结构中或在结构的表面上时，渐缩使应力集中最小化。 连接器衬垫由多个结构承载层组成，适用于将平坦的结构上集成的布线阵列夹在其间。 形成在连接器焊盘中的多个电镀通孔使得能够访问其中的布线阵列。

公开(公告)号：US06760090B2

公开(公告)日：2004-07-06

申请号：US10157206

申请日：2002-05-30

Applicant: Hyoung Soo Cho

Inventor： Hyoung Soo Cho

IPC: G02F11345

CPC classification number: G02F1/13452 ,  G02F1/1333 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09154

Abstract: A liquid crystal display includes a liquid crystal panel having a plurality of pads, a printed circuit board, a tape carrier package electrically interconnecting the liquid crystal panel and the printed circuit board, an electrode lead portion formed on a rear surface of the tape carrier package, an anisotropic conductive film connected to at least one of the plurality of pads of the liquid crystal panel and formed at a first side of the electrode lead portion, and a solder resist formed at a second side of the electrode lead portion and contacting the anisotropic conductive film.

Abstract translation: 液晶显示器包括具有多个焊盘的液晶面板，印刷电路板，将液晶面板和印刷电路板电连接的带载体封装，形成在带载体封装的后表面上的电极引线部分 形成在电极引线部分的第一侧的液晶板的多个焊盘中的至少一个焊盘上的各向异性导电膜，以及形成在电极引线部分的第二侧并与各向异性接触的阻焊剂 导电膜。