公开(公告)号：US20140152092A1

公开(公告)日：2014-06-05

申请号：US14176483

申请日：2014-02-10

Applicant: Bayerische Motoren Werke Aktiengesellschaft

Inventor： Jose LOPEZ DE ARROYABE

IPC: B60L11/18

CPC classification number: B60L11/1803 ,  B60L15/007 ,  B60L15/20 ,  B60L2240/429 ,  B60L2240/80 ,  B60L2270/147 ,  H02M7/003 ,  H02P27/06 ,  H05K1/0263 ,  H05K1/144 ,  H05K7/1432 ,  H05K2201/041 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10272 ,  Y02T10/644 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/72 ,  Y02T10/7275

Abstract: A vehicle includes a power electronics unit for converting energy between a DC circuit and a polyphase machine, wherein the power electronics unit has a power module, a driver board, and a control board. The power electronics unit has two DC current rails, wherein the DC circuit can be connected to the same, and the power electronics unit has phase current rails, wherein the polyphase machine can be connected to the same. The number of the phase current rails corresponds to the number of the phases of the polyphase machine. The arrangement of the power module, the driver board, and the control board corresponds to a stacked or sandwiched construction, the phase current rails are electrically connected to the power module, and the control board has a passage for each of the phase current rails, wherein one phase current rail is fed through each passage.

Abstract translation: 车辆包括用于在DC电路和多相机之间转换能量的电力电子单元，其中所述电力电子单元具有功率模块，驱动器板和控制板。 电力电子单元具有两个直流电流导轨，其中DC电路可以连接到其上，并且电力电子单元具有相电流轨，其中多相机可以连接到其上。 相电流轨的数量对应于多相机的相数。 电源模块，驱动器板和控制板的布置对应于堆叠或夹层结构，相电流轨电连接到电源模块，并且控制板具有用于每个相电流轨的通道， 其中一个相电流轨被馈送通过每个通道。

公开(公告)号：US08733974B2

公开(公告)日：2014-05-27

申请号：US13444751

申请日：2012-04-11

Applicant: Huan-Hsiang Huang ,  Chih-Wei Lu

Inventor： Huan-Hsiang Huang ,  Chih-Wei Lu

IPC: F21S2/00 ,  F21V21/00 ,  H01R33/00 ,  H01R33/945

CPC classification number: F21V19/0055 ,  F21V7/00 ,  F21V23/06 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01R12/53 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10356 ,  H05K2201/10878

Abstract: A light emitting diode module includes a metal substrate, a main circuit, an adapter circuit board, an adapter circuit and a plurality of light emitting diodes, and the main circuit is installed on the metal substrate and includes a plurality of first power points, an adapter circuit installed on the adapter circuit board and including a plurality of second power points, each being electrically coupled to each corresponding first power point, and the light emitting diode is installed on a surface of the metal substrate and electrically coupled to the main circuit. A light emitting diode lamp includes a reflection cover, a light emitting diode module and a plurality of power lines.

Abstract translation: 发光二极管模块包括金属基板，主电路，适配器电路板，适配器电路和多个发光二极管，并且主电路安装在金属基板上，并且包括多个第一电源点， 适配器电路安装在适配器电路板上并且包括多个第二电源点，每个第二电源点电耦合到每个对应的第一电源点，并且发光二极管安装在金属基板的表面上并电耦合到主电路。 发光二极管灯包括反射盖，发光二极管模块和多条电源线。

公开(公告)号：US20140055974A1

公开(公告)日：2014-02-27

申请号：US14114528

申请日：2012-04-20

Applicant: Uwe Hansen

Inventor： Uwe Hansen

IPC: H05K1/14

CPC classification number: H05K1/148 ,  G01L19/06 ,  G01P15/0802 ,  G01P15/09 ,  G01P15/125 ,  G01P2015/0882 ,  H05K1/0271 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/144 ,  H05K1/145 ,  H05K3/0064 ,  H05K3/4611 ,  H05K5/0056 ,  H05K2201/0133 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10083 ,  H05K2201/10151

Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Abstract translation: 本发明涉及一种印刷电路板装置，更具体地说涉及一种多层印刷电路板。 印刷电路板布置包括彼此平行布置并彼此连接的至少两个印刷电路板。 根据本发明，在最初提及的类型的印刷电路板布置的情况下，一个印刷电路板的至少一个表面区域通过实施在印刷电路板装置中的元件连接到印刷电路板装置的另一个印刷电路板 弹性和/或阻尼方式，使得通过印刷电路板和元件的表面区域形成振荡系统，特别是弹簧质量系统，振荡弯曲带或弯曲振荡板。

公开(公告)号：US20140049684A1

公开(公告)日：2014-02-20

申请号：US13727467

申请日：2012-12-26

Applicant: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： YU-TSAN CHENG ,  WEN-CHANG CHEN ,  SHIN-WEN CHEN ,  WEN-HSIUNG CHEN ,  SHU-SHENG PENG

IPC: H05K1/02 ,  H04N5/225

CPC classification number: H05K1/0281 ,  H04N5/225 ,  H04N5/2253 ,  H05K1/0215 ,  H05K1/141 ,  H05K3/323 ,  H05K2201/041 ,  H05K2201/09781 ,  H05K2201/10121

Abstract: A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads.The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly.

Abstract translation: 电路板组件包括柔性电路板，导电粘合剂和多个增强板。 柔性电路板包括第一表面和第二表面。 多个板焊盘安装在第一表面上。 导电粘合剂涂覆在第一表面上并且完全覆盖所有的板焊盘。 加强板位于第二表面上。 每个加强板在空间上对应于相应的一个板焊盘。 加强板提供电路板组件的物理接地和加强。

公开(公告)号：US20140016242A1

公开(公告)日：2014-01-16

申请号：US14027685

申请日：2013-09-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

IPC: H01G4/01

CPC classification number: H01G4/12 ,  H01G2/06 ,  H01G4/01 ,  H01G4/224 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

Abstract translation: 多层陶瓷电容器包括层叠的扁平状内部电极。 插入器包括比多层陶瓷电容器的轮廓大的绝缘基板。 安装多层陶瓷电容器的第一安装电极位于绝缘基板的第一主表面上，以及用于连接到位于第二主表面上的外部电路板的第一外部连接电极。 多层陶瓷电容器以这样的方式安装到内插器上，使得内部电极的主表面平行或基本上平行于中介层的主表面，即绝缘基板的第一和第二主表面。

公开(公告)号：US20130329393A1

公开(公告)日：2013-12-12

申请号：US13781677

申请日：2013-02-28

Applicant: HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： HSIN-KUAN WU ,  HOU-YUAN CHOU

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10363

Abstract: A printed circuit board includes a motherboard and a daughterboard. The motherboard includes at least one first signal pad. The daughterboard includes at least one second signal pad electronically connected to the at least one first signal pad for electronically connecting the daughterboard to the motherboard.

Abstract translation: 印刷电路板包括母板和子板。 主板包括至少一个第一信号垫。 子板包括至少一个第二信号垫，其电连接到至少一个第一信号垫，用于将子板电连接到母板。

公开(公告)号：US20130298252A1

公开(公告)日：2013-11-07

申请号：US13843331

申请日：2013-03-15

Applicant: Tecvan Informática Ltda.

Inventor： Jorge Ribeiro-Pereira

IPC: G06F21/55

CPC classification number: G06F21/554 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09681

Abstract: The present invention provides the mechanical positioning of electronic circuits, mounted on rigid printed circuit boards or flexible circuits, creating a protected region within a Safe Equipment, so that an action to attempt to invade or violate this area of the equipment will trigger an alarm that triggers the blocking of the equipment use, instantly erasing the safety keys of the safe equipment; to avoid this possibility, the invention provides a region completely surrounded by protection circuits and sensors surrounding the sensitive part of the device with alarm devices.

Abstract translation: 本发明提供了安装在刚性印刷电路板或柔性电路上的电子电路的机械定位，在安全设备内创建受保护的区域，使得试图侵入或违反设备的该区域的动作将触发警报， 触发设备使用的阻塞，立即擦除安全设备的安全钥匙; 为了避免这种可能性，本发明提供了一个由保护电路和传感器完全包围的区域，该区域围绕具有报警装置的设备的敏感部分。

公开(公告)号：US20130271976A1

公开(公告)日：2013-10-17

申请号：US13444751

申请日：2012-04-11

Applicant: Huan-Hsiang Huang ,  Chih-Wei Lu

Inventor： Huan-Hsiang Huang ,  Chih-Wei Lu

IPC: F21V7/00 ,  F21V21/00

CPC classification number: F21V19/0055 ,  F21V7/00 ,  F21V23/06 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01R12/53 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10356 ,  H05K2201/10878

Abstract: A light emitting diode module includes a metal substrate, a main circuit, an adapter circuit board, an adapter circuit and a plurality of light emitting diodes, and the main circuit is installed on the metal substrate and includes a plurality of first power points, an adapter circuit installed on the adapter circuit board and including a plurality of second power points, each being electrically coupled to each corresponding first power point, and the light emitting diode is installed on a surface of the metal substrate and electrically coupled to the main circuit. A light emitting diode lamp includes a reflection cover, a light emitting diode module and a plurality of power lines.

Abstract translation: 发光二极管模块包括金属基板，主电路，适配器电路板，适配器电路和多个发光二极管，并且主电路安装在金属基板上，并且包括多个第一电源点， 适配器电路安装在适配器电路板上并且包括多个第二电源点，每个第二电源点电耦合到每个对应的第一电源点，并且发光二极管安装在金属基板的表面上并电耦合到主电路。 发光二极管灯包括反射盖，发光二极管模块和多条电源线。

公开(公告)号：US08507802B1

公开(公告)日：2013-08-13

申请号：US12113617

申请日：2008-05-01

Applicant: William Knauer

Inventor： William Knauer

IPC: H05K1/00

CPC classification number: H05K1/0213 ,  G01R19/0092 ,  H05K1/0218 ,  H05K1/0262 ,  H05K3/368 ,  H05K2201/0191 ,  H05K2201/041 ,  H05K2201/0792

Abstract: Provided is printed circuit board for minimizing dielectric losses experienced by a low-current portion of an electric circuit. The printed circuit board includes a first substrate supporting an electrically-conductive material patterned to form a conductive pathway between electric circuit components, and a surface-mount guard pad provided on a substantially-planar exposed surface of the first substrate and covering at least an area of the exposed surface including a footprint of the low-current portion on the first substrate. A second substrate is also provided with one or more electrically conductive pads that are surface mounted to the guard pad to couple the second substrate to the guard pad. The second substrate also supports a signal trace included in the low-current region for conducting a low-current signal.

Abstract translation: 提供了用于最小化电路的低电流部分所经历的介电损耗的印刷电路板。 印刷电路板包括支撑图案化以在电路部件之间形成导电路径的导电材料的第一基板和设置在第一基板的基本上平坦的暴露表面上的表面安装保护垫，并且覆盖至少一个区域 所述暴露表面包括所述第一基底上的所述低电流部分的覆盖区。 第二基板还设置有一个或多个导电焊盘，其表面安装到保护焊盘以将第二衬底耦合到保护焊盘。 第二基板还支持包括在低电流区域中的用于传导低电流信号的信号迹线。

公开(公告)号：US08500456B1

公开(公告)日：2013-08-06

申请号：US13190639

申请日：2011-07-26

Applicant: Henry V. Holec ,  Wm. Todd Crandell

Inventor： Henry V. Holec ,  Wm. Todd Crandell

IPC: H01R12/00

CPC classification number: H05K1/0293 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R9/096 ,  H01R12/523 ,  H01R13/717 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0292 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/113 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2201/2027 ,  H05K2203/0228

Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract translation: 在一些实施例中，可互连电路板可以包括以下特征中的一个或多个：（a）位于电路板顶部的第一导电焊盘，（b）导电焊盘上的电镀通孔， 电路板，（c）耦合到电镀通孔的第二导电焊盘; 第二导电焊盘能够电连接到附接到第二可互连电路板的顶部的第三导电焊盘，（d）切割标记，指示用于分离电路板的安全位置，以及（e）与第二导电焊盘相邻的第二切割标记 可以利用第一和第二切割标记之间的区域来进行通过电路板的安全切割的第一切割标记。