公开(公告)号：US20130196529A1

公开(公告)日：2013-08-01

申请号：US13753734

申请日：2013-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-woong JUNG

IPC: H01R13/62

CPC classification number: H01R13/62 ,  H01R12/774 ,  H05K1/118 ,  H05K2201/2009

Abstract: A signal cable, a cable connector, and a signal cable connecting apparatus including the same facilitate connection of the signal cable to the cable connector. The signal cable includes a plurality of signal lines; a cable film which sheaths the plurality of signal lines; and a cable locking portion formed in the cable film, to releasably engage with a cable holder of a cable connector.

Abstract translation: 信号电缆，电缆连接器和包括该信号线的信号电缆连接装置有利于将信号电缆连接到电缆连接器。 信号电缆包括多条信号线; 覆盖所述多条信号线的电缆膜; 以及形成在电缆薄膜中的电缆锁定部分，以可释放地与电缆连接器的电缆保持器接合。

公开(公告)号：US20130176689A1

公开(公告)日：2013-07-11

申请号：US13824479

申请日：2011-07-08

Applicant: Nozomu Nishimura ,  Nobuhiro Mikami

Inventor： Nozomu Nishimura ,  Nobuhiro Mikami

IPC: H05K7/02 ,  H05K3/30

CPC classification number: H05K7/02 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/16225 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y10T29/4913

Abstract: A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Abstract translation: 本发明的组件内置模块包括：基板，其包括顶表面和底表面; 多个电子部件，其安装在所述基板的上表面上; 密封基板顶表面的树脂; 以及与基板的底面接合的加强板。 加强板和树脂彼此粘合。

公开(公告)号：US20130133931A1

公开(公告)日：2013-05-30

申请号：US13686597

申请日：2012-11-27

Applicant: FUJIKURA LTD.

Inventor： Hirohito WATANABE ,  Akiko OGAWA

IPC: H05K1/02

CPC classification number: H05K1/02 ,  H05K1/0281 ,  H05K2201/2009

Abstract: Provided is a printed wiring board capable of inhibiting a reinforcing plate from peeling off even when a bending radius is small. The printed wiring board includes a wiring board main body, and a reinforcing plate attached to the wiring board main body, the reinforcing plate includes first and second reinforcing portions which are arranged to be mutually spaced apart, and a connecting portion which integrally connects the first reinforcing portion with the second reinforcing portion, and the connecting portion includes a first portion which has a cross-sectional area smaller than a cross-sectional area of the first reinforcing portion and smaller than a cross-sectional area of the second reinforcing portion, and a second portion of which a cross-sectional area increases along a direction from the first portion to at least one of the first reinforcing portion and the second reinforcing portion.

Abstract translation: 提供一种即使弯曲半径小也能够抑制加强板剥离的印刷布线板。 印刷电路板包括布线板主体和安装在布线板主体上的加强板，加强板包括互相间隔布置的第一和第二加强部分，以及连接部分，其将第一 具有第二加强部的加强部，连接部具有截面积小于第一加强部的截面积且小于第二加强部的横截面积的第一部，以及 第二部分的横截面积沿着从第一部分到第一加强部分和第二加强部分中的至少一个的方向增加。

公开(公告)号：US20130128474A1

公开(公告)日：2013-05-23

申请号：US13408821

申请日：2012-02-29

Applicant: JungYoul Kang ,  SeongHun Kim

Inventor： JungYoul Kang ,  SeongHun Kim

IPC: H05K1/00 ,  H05K7/00

CPC classification number: H05K1/0271 ,  G02F1/13 ,  G02F1/133 ,  H05K1/00 ,  H05K1/02 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0281 ,  H05K2201/0154 ,  H05K2201/058 ,  H05K2201/09681 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/2009

Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

Abstract translation: 本公开公开了一种用于显示装置的驱动印刷电路板（PCB）。 更具体地，提供了通过防止PCB翘曲来改善接合的驱动印刷电路板。 后表面加强板包括多边形图案，以防止在表面安装技术（SMT）工艺期间由于与板的热收缩不同而导致驱动印刷电路板的PCB翘曲。

公开(公告)号：US08446738B2

公开(公告)日：2013-05-21

申请号：US12579051

申请日：2009-10-14

Applicant: John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

Inventor： John L. Colbert ,  Arvind K. Sinha ,  Roger D. Weekly

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/144 ,  G11C5/025 ,  H05K1/113 ,  H05K1/114 ,  H05K1/141 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/044 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2009

Abstract: A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB.

Abstract translation: 描述了用于在用作单个主板的共面板之间互连和分配信号和功率的系统，方法和主板组件。 主板组件包括具有相对的平行的第一和第二表面的多层第一印刷电路板，每个具有设置在其上的至少一个焊盘格栅阵列（LGA）。 组件还包括至少一个布线层（Y），其被设计成仅电连接第一PCB上或其内部的部件，以及至少一个布线层（X），其设计成仅将第一PCB上的部件电连接到多层第二PCB 。 所述多层第二PCB具有相对的平行的第一和第二表面，所述第一表面具有设置在其上的至少一个LGA。 它还包括至少一个被设计成仅电连接第二PCB上或第二PCB内的组件的布线层（V），以及设计成仅将第二PCB上的部件与第一PCB上的部件电互连的至少一个层（X） 。 第一LGA插入器耦合到布置在第一PCB的第一表面上的LGA，并且将至少一个部件电连接到第一PCB。 第二LGA插入件夹在布置在第一PCB的第二表面上的LGA之间并耦合到布置在第二PCB的第一表面上的LGA。 它将第一个PCB电连接到第二个PCB上的组件。

公开(公告)号：US20130114214A1

公开(公告)日：2013-05-09

申请号：US13725488

申请日：2012-12-21

Applicant: Koichiro Takeguchi ,  Shigeo Hayashi

Inventor： Koichiro Takeguchi ,  Shigeo Hayashi

IPC: H05K7/02

CPC classification number: H05K7/02 ,  H04N5/64 ,  H05K3/301 ,  H05K2201/10409 ,  H05K2201/2009

Abstract: According to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first surface and exposed to an inside of the housing; a component contained in the housing, the component comprising a first supported area located at a distance from a surface of the circuit board; and a support member configured to support the component, the support member comprising a first end portion fixed to the first supported area of the component, and a second end portion fixed to the second surface of the reinforcing member.

Abstract translation: 根据一个实施例，电视接收机包括：壳体; 布置在壳体中的电路板; 安装在电路板上的电子部件; 加强构件，包括与所述电路板接触的第一表面，以及位于所述第一表面的相对侧并暴露于所述壳体的内部的第二表面; 包含在所述壳体中的部件，所述部件包括位于距所述电路板的表面一定距离处的第一支撑区域; 以及支撑构件，其构造成支撑所述构件，所述支撑构件包括固定到所述构件的所述第一支撑区域的第一端部和固定到所述加强构件的所述第二表面的第二端部。

公开(公告)号：US08426738B2

公开(公告)日：2013-04-23

申请号：US12692422

申请日：2010-01-22

Applicant: Jun Sup Shin ,  Bum Cho Kim

Inventor： Jun Sup Shin ,  Bum Cho Kim

IPC: H05K1/02

CPC classification number: H05K1/118 ,  G11B33/122 ,  H02K3/521 ,  H02K5/225 ,  H02K2211/03 ,  H05K3/3447 ,  H05K2201/09081 ,  H05K2201/10265 ,  H05K2201/2009

Abstract: Disclosed herein is a flexible printed circuit board (PCB) of a spindle motor. The flexible PCB includes a solder part, an upper reinforcing plate, a lower reinforcing plate, and a soldering part. The solder part has a through hole so that a coil extending from a stator core passes through the solder part, and has a separation part which is open or closed only in one direction along with the through hole. The upper reinforcing plate supports the upper portion of the separation part. The lower reinforcing plate supports the lower portion of the solder part, and has an elliptical through hole which partially overlaps with the through hole so that the coil passes through the lower reinforcing plate. The soldering part is formed to enable the coil to be secured to the solder part.

Abstract translation: 这里公开了一种主轴电动机的柔性印刷电路板（PCB）。 柔性PCB包括焊接部，上加强板，下加强板和焊接部。 焊接部具有通孔，使得从定子芯延伸的线圈通过焊料部，并且具有与通孔一起在一个方向上打开或闭合的分离部。 上加强板支撑分离部分的上部。 下加强板支撑焊料部分的下部，并且具有与通孔部分重叠的椭圆形通孔，使得线圈通过下加强板。 焊接部件形成为使得线圈能够固定到焊接部件。

公开(公告)号：US08362364B2

公开(公告)日：2013-01-29

申请号：US12705776

申请日：2010-02-15

Applicant: Toshiya Asano ,  Shinnosuke Maeda

Inventor： Toshiya Asano ,  Shinnosuke Maeda

IPC: H05K1/16

CPC classification number: H05K1/0271 ,  H01L21/563 ,  H01L23/16 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/562 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/0058 ,  H05K2201/2009 ,  H05K2201/2018 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.

Abstract translation: 布线基板组件包括矩形板状布线板，其具有多个树脂绝缘层和交替层叠在一起以限定相对的第一和第二主表面的导电层，以及布置在第一主表面上用于与端子表面接触的多个连接端子 所述芯片和矩形框状加固件固定到所述布线板的所述第一主表面，所述连接端子通过所述加强件的开口暴露。 加强构件具有由从加强构件的内周面延伸到外周面的狭缝分隔开的多个结构件。

公开(公告)号：US20120312586A1

公开(公告)日：2012-12-13

申请号：US13590908

申请日：2012-08-21

Applicant: Naoki Nakamura ,  Shigeru Sugino ,  Nobuo Taketomi ,  Ryo Kanai

Inventor： Naoki Nakamura ,  Shigeru Sugino ,  Nobuo Taketomi ,  Ryo Kanai

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/0281 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.

Abstract translation: 柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘 的第二导电焊盘。

公开(公告)号：US08238974B2

公开(公告)日：2012-08-07

申请号：US12830884

申请日：2010-07-06

Applicant: Wei-Chih Lai

Inventor： Wei-Chih Lai

IPC: H04B1/38

CPC classification number: H05K1/147 ,  H04M1/0266 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/10136 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2203/0191

Abstract: An embodiment of the invention discloses an display module for mobile communication device which comprises a display panel, a flexible printed circuit board, an electronic component. The flexible printed circuit board is coupled to the display panel and is divided into a first portion and a second portion. The electronic component is disposed on a first surface of the flexible printed circuit board, and the location of the electronic component corresponds to that of the second portion of the flexible printed circuit board. The extensibility of the second portion of the flexible printed circuit board is smaller than that of the first portion of the flexible printed circuit board.

Abstract translation: 本发明的实施例公开了一种用于移动通信设备的显示模块，包括显示面板，柔性印刷电路板，电子部件。 柔性印刷电路板耦合到显示面板并被分成第一部分和第二部分。 电子部件设置在柔性印刷电路板的第一表面上，并且电子部件的位置对应于柔性印刷电路板的第二部分的位置。 柔性印刷电路板的第二部分的可伸长性小于柔性印刷电路板的第一部分的伸长性。