公开(公告)号：US08324727B2

公开(公告)日：2012-12-04

申请号：US12720110

申请日：2010-03-09

Applicant: Joseph C. Fjelstad ,  Kevin P. Grundy ,  Para K. Segaram ,  William F. Wiedemann ,  Thomas J. Obenhuber ,  Inessa Obenhuber, legal representative

Inventor： Joseph C. Fjelstad ,  Kevin P. Grundy ,  Para K. Segaram ,  William F. Wiedemann ,  Thomas J. Obenhuber

IPC: H01L23/34

CPC classification number: H01C7/003 ,  H01C13/02 ,  H01G4/33 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/0246 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10643 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.

Abstract translation: 公开了适用于在电子互连衬底内，互连衬底和电子部件之间或IC封装内的垂直互连模式下放置和使用的薄型离散电子部件结构。

公开(公告)号：US20120211265A1

公开(公告)日：2012-08-23

申请号：US13458167

申请日：2012-04-27

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H05K1/02

CPC classification number: H05K1/189 ,  H01L21/568 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09481 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T156/10 ,  Y10T156/1057 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides an electronic assembly. The assembly uses no solder. Components or component packages with I/O leads are mounted on a flexible substrate and encapsulated with an electrically insulating material. Vias connect through the substrate to the components' leads.

Abstract translation: 本发明提供一种电子组件。 组件不使用焊料。 具有I / O引线的组件或组件封装安装在柔性基板上，并用电绝缘材料封装。 通孔通过基板连接到组件的引线。

公开(公告)号：US20120006589A1

公开(公告)日：2012-01-12

申请号：US13185323

申请日：2011-07-18

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H05K1/16

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/185 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/041 ,  H05K2201/10318 ,  H05K2203/065 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

Abstract translation: 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1600,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组件被电镀1200，并且重复进行封装和钻孔工艺1500以构建所需的层422,1502,1702。组件可以配合1800.在配合的组件内，物品可以被插入，包括销 2202a，2202b和2202c，夹层互连设备2204，散热器2402以及散热器和散热器2602组合。边缘卡连接器2802可以附接到配合的组件。

公开(公告)号：US20110215475A1

公开(公告)日：2011-09-08

申请号：US13044194

申请日：2011-03-09

Applicant: Joseph C. Fjelstad ,  Para K. Segaram ,  Thomas J. Obenhuber ,  Inessa Obenhuber ,  Kevin P. Grundy

Inventor： Joseph C. Fjelstad ,  Para K. Segaram ,  Thomas J. Obenhuber ,  Inessa Obenhuber ,  Kevin P. Grundy

IPC: H01L23/532

CPC classification number: H01L24/85 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49537 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/32245

Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Abstract translation: 具有多个表面的IC封装，用于与互连元件互连，从IC芯片连接到位于其多于一个表面上的封装组件的I / O端子，并且与空间上分离的其它器件或组件互连。

公开(公告)号：US20110199740A1

公开(公告)日：2011-08-18

申请号：US13094105

申请日：2011-04-26

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H05K1/00

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/0278 ,  H05K3/1241 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2203/1469

Abstract: A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

Abstract translation: 一种用于制造单片模制电子组件（12）的方法（10）。 提供具有配合以形成内部腔室（16）的第一和第二模具部分（14a-b）的模具（14）。 模具具有连接到腔室中的注射口（22）和通道（24）。 具有电子触点（32）的电子部件（30）填充到第二模具部分上，以基本上容纳在腔室中。 将模具配合在一起，并且通过注入口通道注入液体绝缘模塑材料（36）以填充腔室。 将成型材料硬化成固体，从而将电子部件嵌入到成型材料中作为整体式子组件（40）。 将单片子组件从模具中取出，并且将一个或多个无焊导电电路（50）施加到电子部件的电子触点，从而提供电子组件。

公开(公告)号：US07989929B2

公开(公告)日：2011-08-02

申请号：US11930217

申请日：2007-10-31

Applicant: Joseph C. Fjelstad ,  Para K. Segaram ,  Belgacem Haba

Inventor： Joseph C. Fjelstad ,  Para K. Segaram ,  Belgacem Haba

IPC: H01L23/48

CPC classification number: H05K1/147 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0228 ,  H05K1/0237 ,  H05K3/222 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.

Abstract translation: 一种直接连接信号系统，包括印刷电路板和布置在印刷电路板上的第一和第二集成电路封装。 多个电信号导体在悬挂在印刷电路板上的第一和第二集成电路封装之间延伸。

公开(公告)号：US20110171857A1

公开(公告)日：2011-07-14

申请号：US13052831

申请日：2011-03-21

Applicant: Gary Yasumura ,  William F. Wiedemann ,  Joseph C. Fjelstad ,  Para K. Segaram ,  Kevin P. Grundy

Inventor： Gary Yasumura ,  William F. Wiedemann ,  Joseph C. Fjelstad ,  Para K. Segaram ,  Kevin P. Grundy

IPC: H01R13/46

CPC classification number: H01R12/714 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/24 ,  H01R13/6599

Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Abstract translation: 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。

公开(公告)号：US20100151704A1

公开(公告)日：2010-06-17

申请号：US12693097

申请日：2010-01-25

Applicant: Gary Yasumura ,  Joseph C. Fjelstad ,  William F. Wiedemann ,  Para K. Segaram ,  Kevin P. Grundy

Inventor： Gary Yasumura ,  Joseph C. Fjelstad ,  William F. Wiedemann ,  Para K. Segaram ,  Kevin P. Grundy

IPC: H01R12/00

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/62 ,  H01R12/716 ,  H01R13/24 ,  H01R13/6587 ,  H05K1/142 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2203/167

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract translation: 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。

公开(公告)号：US20100127402A1

公开(公告)日：2010-05-27

申请号：US12692974

申请日：2010-01-25

Applicant: Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

Inventor： Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

IPC: H01L23/48

CPC classification number: H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract translation: 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US20090041977A1

公开(公告)日：2009-02-12

申请号：US12187323

申请日：2008-08-06

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: B32B3/24 ,  B32B37/00 ,  B32B43/00 ,  B32B3/02

CPC classification number: H05K1/185 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4664 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T428/24273 ,  Y10T428/24479 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a machine 800 for its manufacture. The assembly 400 has no solder. Components 406, or component packages 402, with I/O leads 412 sit on a planar substrate. The machine 800 encapsulates the components 406 or component packages, with electrically insulating material with vias 420 extending through the substrate to the components' leads 412. Then the machine 800 plates the components' leads and forms traces. Next, the machine 800 covers the plated material with electrically insulating material. Additional vias may extend through the material covering the plated material and in turn be plated and covered. The machine 800 repeats the formation of vias, plating, and coverings of the assembly as desired.

Abstract translation: 本发明提供一种用于其制造的电子组件400和机器800。 组件400没有焊料。 具有I / O引线412的部件406或部件封装件402位于平面基板上。 机器800封装组件406或组件封装，其中电绝缘材料与通孔420延伸穿过衬底到组件引线412.然后机器800压平部件引线并形成迹线。 接下来，机器800用电绝缘材料覆盖电镀材料。 附加的通孔可以延伸穿过覆盖电镀材料的材料，并且进而被电镀和覆盖。 机器800根据需要重复组装过孔，电镀和覆盖物的形成。