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    High density circuit board and manufacturing method thereof
    21.
    发明申请
    High density circuit board and manufacturing method thereof 审中-公开
    高密度电路板及其制造方法

    公开(公告)号：US20090250260A1

    公开(公告)日：2009-10-08

    申请号：US12155756

    申请日：2008-06-09

    Applicant: Myung Sam Kang

    Inventor： Myung Sam Kang

    IPC: H05K1/02 ,  B32B38/10 ,  B05D5/12 ,  C23F1/02

    CPC classification number: H05K3/107 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09881 ,  H01L2924/00

    Abstract: The present invention relates to a high density circuit board for increasing the density of a circuit by impregnating fine circuit patterns inside a top part of a substrate, and a method for manufacturing the same.In accordance with the present invention, a high density circuit board includes a substrate with fine circuit patterns impregnated inside top and bottom parts; a via formed inside the substrate to electrically conduct the fine circuit patterns of the top and bottom parts of the substrate each other; pads formed on the fine circuit patterns of the top part of the substrate; and solder resists formed on the top and bottom parts of the substrate, which can convert the circuit patterns into fine pitches and increase the degree of close adhesion between the substrate and the circuit patterns, thereby improving reliability.

    Abstract translation: 高密度电路板及其制造方法技术领域本发明涉及一种用于通过在基板顶部浸渍精细电路图案来提高电路密度的高密度电路板及其制造方法。 根据本发明，高密度电路板包括具有浸渍在顶部和底部内部的精细电路图案的基板; 形成在基板内部的通孔，以使基板的顶部和底部的精细电路图案彼此导电; 衬垫形成在衬底的顶部的精细电路图案上; 以及形成在基板的顶部和底部上的阻焊剂，其可以将电路图案转换成细间距并增加基板和电路图案之间的紧密粘合度，从而提高可靠性。

    Printed circuit board including embedded passive component
    22.
    发明授权
    Printed circuit board including embedded passive component 失效
    印刷电路板包括嵌入式无源元件

    公开(公告)号：US07583512B2

    公开(公告)日：2009-09-01

    申请号：US12023616

    申请日：2008-01-31

    Applicant: Chang Sup Ryu ,  Myung Sam Kang

    Inventor： Chang Sup Ryu ,  Myung Sam Kang

    IPC: H05K1/16

    CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

    Abstract translation: 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。

    Printed circuit board
    23.
    发明申请
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US20080314633A1

    公开(公告)日：2008-12-25

    申请号：US12149522

    申请日：2008-05-02

    Applicant: Myung Sam Kang ,  Chin Kwan Kim

    Inventor： Myung Sam Kang ,  Chin Kwan Kim

    IPC: H01R12/04

    CPC classification number: H05K3/4007 ,  H05K3/246 ,  H05K3/3457 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2201/09745

    Abstract: A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.

    Abstract translation: 公开了一种印刷电路板，其增加了IC和印刷电路板之间的接触面积，从而增加了粘合度。 印刷电路板包括：绝缘层，其包括嵌入在绝缘层的上表面中以与上表面齐平的至少一个通孔焊盘的第一电路图案，以及形成在下表面中的第二电路图案 的绝缘层与下表面齐平; 形成在绝缘层上的阻焊层; 通孔和通过通孔和通孔焊盘一体地形成在第二电路图案上的突起，使得其从绝缘层突出成高于阻焊层。

    Printed circuit board and method of manufacturing the same
    25.
    发明授权
    Printed circuit board and method of manufacturing the same 失效
    印刷电路板及其制造方法

    公开(公告)号：US08541096B2

    公开(公告)日：2013-09-24

    申请号：US12654446

    申请日：2009-12-18

    Applicant: Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    Inventor： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    IPC: H05K1/03 ,  H05K7/02

    CPC classification number: H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

    Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

    Abstract translation: 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

    Printed circuit board and manufacturing method thereof
    28.
    发明申请
    Printed circuit board and manufacturing method thereof 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20110061912A1

    公开(公告)日：2011-03-17

    申请号：US12654668

    申请日：2009-12-29

    Applicant: Myung Sam Kang ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

    Inventor： Myung Sam Kang ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

    IPC: H05K1/00 ,  H05K1/11 ,  B32B38/10 ,  B29C65/00

    CPC classification number: H05K3/4611 ,  H05K3/045 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2203/1461 ,  H05K2203/1536 ,  Y10T156/10

    Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

    Abstract translation: 提供了一种印刷电路板（PCB）及其制造方法。 PCB包括堆叠结构，其包括其间插入有第一绝缘层的第二绝缘层和第三绝缘层，以及具有第一至第四导电通孔的导电通孔。 在第一绝缘层中埋设第二层电路图形和第三层电路图案，在第二绝缘层上形成第一层电路图案，在第三绝缘层上形成第四层电路图形。 第一导电通孔连接第一层电路图案和第二层电路图案，第二导电通孔连接第一层电路图案和第三层电路图案，第三导电通孔连接第二层电路图案和 第四层电路图案和第四导电通孔连接第三层电路图案和第四层电路图案。

    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
    29.
    发明申请
    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier 审中-公开
    用于制造基板的载体和使用载体制造基板的方法

    公开(公告)号：US20100147559A1

    公开(公告)日：2010-06-17

    申请号：US12382359

    申请日：2009-03-13

    Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC: H05K1/02 ,  H05K3/02

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    Abstract: The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.

    Abstract translation: 本发明涉及用于制造基板的载体和使用该载体制造基板的方法，该方法包括：（A）制备包括释放层的载体，以及顺序地设置在两侧的绝缘层和金属层 释放层; （B）图案化金属层以形成基极电路层; （C）在基极电路层上形成积层; （D）执行路由处理以将绝缘层与释放层分离; 和（E）在积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

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