公开(公告)号：US20170207156A1

公开(公告)日：2017-07-20

申请号：US15475133

申请日：2017-03-31

Applicant: Subtron Technology Co., Ltd.

Inventor： Chao-Min Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/13

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/048 ,  H05K3/06 ,  H05K3/064 ,  H05K3/14 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0145 ,  H05K2203/0152 ,  H05K2203/0502 ,  H05K2203/0548 ,  H05K2203/066

Abstract: A substrate structure includes a dielectric layer, a metal foil, a patterned metal layer, a first patterned solder-resist layer, a release layer and a second patterned solder-resist layer. The dielectric layer includes a first surface having a plurality of recesses and a second surface. The metal foil is disposed on the second surface. The patterned metal layer is disposed on the first surface, the patterned metal layer has a plurality of openings, and the openings are respectively corresponding to and expose the recesses. The first patterned solder-resist layer is filled in each of the recesses and corresponding to each of the openings. A top surface of the first patterned solder-resist layer is substantially coplanar with a top surface of the patterned metal layer. The second patterned solder-resist layer is disposed on the first patterned solder-resist layer and in the openings, and covers a portion of the patterned metal layer.

公开(公告)号：US09648760B2

公开(公告)日：2017-05-09

申请号：US15052885

申请日：2016-02-25

Applicant: Subtron Technology Co., Ltd.

Inventor： Chao-Min Wang

IPC: H05K3/06 ,  H05K1/09 ,  H05K3/46 ,  H05K1/02 ,  H05K3/14 ,  H05K3/00 ,  H05K3/04

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/048 ,  H05K3/06 ,  H05K3/064 ,  H05K3/14 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0145 ,  H05K2203/0152 ,  H05K2203/0502 ,  H05K2203/0548 ,  H05K2203/066

Abstract: A substrate structure includes a dielectric layer, a metal foil, a patterned metal layer, a first patterned solder-resist layer and a second patterned solder-resist layer. The dielectric layer includes a first surface and a second surface, and the first surface has a plurality of recesses. The metal foil is disposed on the second surface. The patterned metal layer is disposed on the first surface, the patterned metal layer has a plurality of openings, and the openings are respectively corresponding to and expose the recesses. The first patterned solder-resist layer is filled in each of the recesses and corresponding to each of the openings. A top surface of the first patterned solder-resist layer is substantially coplanar with a top surface of the patterned metal layer. The second patterned solder-resist layer is disposed on the first patterned solder-resist layer and in the openings, and covers a portion of the patterned metal layer.

公开(公告)号：US09628652B2

公开(公告)日：2017-04-18

申请号：US15093813

申请日：2016-04-08

Applicant: KONICA MINOLTA, INC.

Inventor： Kiyohito Tsujihara ,  Shiro Umeda ,  Yuki Higuchi

IPC: H04N1/00 ,  H04N1/04 ,  H05K1/00

CPC classification number: H04N1/0083 ,  H04N1/00795 ,  H04N1/04 ,  H04N2201/0049 ,  H04N2201/0081 ,  H05K1/00 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/0145 ,  H05K2201/2009

Abstract: An image reading device which reads an image to obtain an image signal includes: a scanning unit; a chassis member; a control unit provided in a position which does not move together with the scanning unit; and a flexible flat cable which connects the scanning unit to the control unit, includes one end attached to a side of the chassis member and a position other than the one end fixed to a position which does not move with the scanning unit, includes a range closer to the one end than the fixed position parallel to a moving direction of the scanning unit, and is arranged to extend from the one end to one side, be bent into a U-shape, enter between the scanning unit and the chassis member, and reach the fixed position, and the flexible flat cable includes a transmitting layer, a shielding layer, and a stress adjusting layer.

公开(公告)号：US20170105283A1

公开(公告)日：2017-04-13

申请号：US15179513

申请日：2016-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon KIM ,  Kyoung Jin JUN ,  Min Kyoung CHEON

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/141 ,  H05K1/181 ,  H05K1/189 ,  H05K3/301 ,  H05K3/3442 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/2045 ,  Y02P70/613

Abstract: An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus.

公开(公告)号：US09591746B2

公开(公告)日：2017-03-07

申请号：US15199913

申请日：2016-06-30

Applicant: Industrial Technology Research Institute

Inventor： Wei-Yuan Cheng ,  Chen-Chu Tsai ,  Yuh-Zheng Lee

IPC: H05K1/00 ,  H05K3/00 ,  H05K1/02 ,  H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/028 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16 ,  H01L2924/181 ,  H05K1/0281 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/007 ,  H05K3/4038 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1178 ,  H01L2924/00012

Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Abstract translation: 根据本公开的实施例，电子设备封装可以包括导线层和刚性元件。 线层包括彼此相对的第一表面和第二表面，并且线层的第二表面具有至少一个粗糙结构。 具有粗糙结构的第二表面的一部分具有比第二表面的另一部分更大的粗糙度。 刚性元件设置在线层的第一表面上，其中刚性元件的刚度大于金属丝层的刚度，并且粗糙结构在金属丝层的第一表面上的投影区域与 刚性元素。

公开(公告)号：US20170042019A1

公开(公告)日：2017-02-09

申请号：US14820201

申请日：2015-08-06

Applicant: International Business Machines Corporation

Inventor： Matthew S. Doyle ,  Joseph Kuczynski ,  Kevin M. O'Connell ,  Chelsie M. Peterson ,  Mark D. Plucinski ,  Timothy J. Tofil

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0275 ,  H05K1/0213 ,  H05K1/0274 ,  H05K1/03 ,  H05K1/09 ,  H05K1/097 ,  H05K1/18 ,  H05K3/143 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0323 ,  H05K2201/0332

Abstract: In an example, a polymeric material is disclosed. The polymeric material includes a polymer substrate and a plurality of graphene traces arranged to form a tamper detection circuit on the polymer substrate.

Abstract translation: 在一个实例中，公开了聚合物材料。 聚合物材料包括聚合物基底和布置成在聚合物基底上形成篡改检测电路的多个石墨烯迹线。

公开(公告)号：US20170006701A1

公开(公告)日：2017-01-05

申请号：US15125573

申请日：2014-03-11

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： Vincenzo CASASANTA, III

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/12 ,  C08J5/04 ,  B32B5/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/36 ,  C08J5/00 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0366 ,  B32B3/266 ,  B32B5/02 ,  B32B5/08 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B9/02 ,  B32B9/04 ,  B32B25/02 ,  B32B25/042 ,  B32B25/08 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/28 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/04 ,  B32B2260/046 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/065 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/0278 ,  B32B2264/105 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2307/7163 ,  B32B2307/75 ,  B32B2457/08 ,  C08J5/005 ,  C08J5/041 ,  C08J2367/04 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/0353 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/097 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0162 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0269 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0271 ,  H05K2203/0769 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  C08L67/04

Abstract: Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

Abstract translation: 可生物降解的印刷电路板或PCB可以由包括至少一种可生物降解的聚合物的基材片制成。 另外，PCB上使用的电迹线也可以包括结合有导电材料的可生物降解的聚合物。 PCB可能被堆肥以降解PCBs

公开(公告)号：US20160219763A1

公开(公告)日：2016-07-28

申请号：US15005443

申请日：2016-01-25

Applicant: Michael A. TISCHLER ,  Calvin Wade SHEEN

Inventor： Michael A. TISCHLER ,  Calvin Wade SHEEN

IPC: H05K13/04 ,  C22B7/00

CPC classification number: C22B7/005 ,  H05K1/189 ,  H05K3/043 ,  H05K13/0486 ,  H05K2201/0145 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/1545 ,  H05K2203/178

Abstract: In accordance with certain embodiments, devices are recycled by removing one or more electronic components from a portion of the device and urging one or more regions of the portion of the device toward an abrasion head. The abrasion head mechanically removes at least a portion of patternable material in each of the one or more regions. The steps are repeated for subsequent portions of the device.

Abstract translation: 根据某些实施例，通过从装置的一部分移除一个或多个电子部件并将装置的一个或多个区域推向磨损头来再循环装置。 磨损头在一个或多个区域的每一个中机械地去除至少一部分可图案材料。 对于设备的后续部分重复这些步骤。

公开(公告)号：US20160194466A1

公开(公告)日：2016-07-07

申请号：US14915937

申请日：2014-10-23

Applicant: TEIJIN DUPONT FILMS JAPAN LIMITED

Inventor： Yumiko NAKAMURA ,  Naomi MIZUNO ,  Taro OYA

IPC: C08J5/18 ,  H05K1/03 ,  B32B27/36 ,  B32B15/09 ,  B32B27/20 ,  H05K1/02 ,  C08K5/5313

CPC classification number: C08J5/18 ,  B32B3/00 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/36 ,  B32B2250/02 ,  B32B2307/202 ,  B32B2307/3065 ,  B32B2307/518 ,  B32B2307/538 ,  B32B2307/54 ,  B32B2367/00 ,  B32B2457/08 ,  B32B2457/12 ,  C08J3/203 ,  C08J2367/02 ,  C08K3/016 ,  C08K5/49 ,  C08K5/51 ,  C08K5/53 ,  C08K5/5313 ,  C08L67/02 ,  C08L67/03 ,  H05K1/028 ,  H05K1/03 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209 ,  Y10T428/24355 ,  Y10T428/25 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: A flame-retardant biaxially oriented polyester film is obtained by imparting flame retardancy to a polyester film itself using a phosphorus flame retardant, a flame-retardant polyester film laminate is formed from the same, and a flexible circuit board is provided. The present invention is obtained from a flame-retardant biaxially oriented polyester film which contains, based on the weight of the polyester film, 70 to 99.5% by weight of polyethylene terephthalate or polyethylene naphthalate, and 0.5 to 30% by weight of flame retardant particles having an average particle diameter of 0.5 to 3.0 μm and being represented by a specific phosphinate or diphosphinate, wherein the number of coarse particles having a maximum length of 10 μm or more contained in the polyester film is 10/m2 or less.

Abstract translation: 通过使用磷阻燃剂赋予聚酯膜本身的阻燃性，由该阻燃双轴取向聚酯膜形成阻燃性双轴取向聚酯膜，由其形成阻燃聚酯膜层压体，并且设置柔性电路板。 本发明由阻燃性双轴取向聚酯膜获得，该聚酯膜基于聚酯膜的重量为70〜99.5重量％的聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯，0.5〜30重量％的阻燃粒子 平均粒径为0.5〜3.0μm，由特定的次膦酸酯或二次膦酸盐表示，其中聚酯膜中所含的最大长度为10μm以上的粗粒子数为10个/ m 2以下。

公开(公告)号：US20160192474A1

公开(公告)日：2016-06-30

申请号：US14583940

申请日：2014-12-29

Applicant: TACTO TEK OY

Inventor： Paavo NISKALA ,  Jarmo SAASKI ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN ,  Antti KERANEN

IPC: H05K1/02 ,  B29C51/14 ,  G06F1/16 ,  H05K1/18 ,  H05K3/00

CPC classification number: B29C51/14 ,  B29C51/16 ,  B29L2031/3406 ,  B29L2031/3425 ,  B29L2031/3431 ,  B29L2031/3481 ,  G06F1/163 ,  G06F1/1652 ,  G06F1/1658 ,  H05K1/0266 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/09118 ,  H05K2201/10545 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.

Abstract translation: 电子设备的多层结构（200），包括用于容纳电子装置的柔性基底膜（102），优选地通过印刷电子元件和/或表面安装元件提供给柔性基底膜的多个电气元件（204,206） 层压到基底膜的至少第一表面上的保护层（104），所述保护层被配置为基本上在元件数量的位置处掩盖基底的可感知的物理偏差，例如不平坦的表面轮廓或着色， 外部感知，可选地通过保护层进行视觉感知和/或触觉检查，以及在与第一表面相对的基底膜的至少第二表面上模制的塑料层（106）。 提出了相应的制造方法。