公开(公告)号：US07603771B2

公开(公告)日：2009-10-20

申请号：US11511462

申请日：2006-08-29

Applicant: Roger Chang

Inventor： Roger Chang

IPC: H01K3/10

CPC classification number: H05K1/187 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/186 ,  H05K3/28 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09536 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/068 ,  H05K2203/085 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by the steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.

Abstract translation: 提供至少两个多层电路板的方法，组合所述至少两个多层电路板以形成组合的多层电路板，以及在所述组合多层电路板上形成多个外部导电通孔，电路和触点。 每个多层电路板通过以下步骤制造：制备具有多个芯片部分的单层印刷电路板，将至少一个芯片附接到相应的芯片部分，将具有多个外壳的框架附接到单层印刷电路板，附接 将半流体胶片粘贴到框架上，对半流体胶片上的导电层进行真空加压，并通过多层电路板形成多个导电内通孔。 所述至少两个多层电路板通过反转多层电路板中的一个并在反向多层电路板上真空压制其它多层电路板的步骤组合。

公开(公告)号：US20090178840A1

公开(公告)日：2009-07-16

申请号：US12351333

申请日：2009-01-09

Applicant: Woon-Chun Kim ,  Sung Yi

Inventor： Woon-Chun Kim ,  Sung Yi

IPC: H05K1/11 ,  H05K3/02 ,  H05K3/06

CPC classification number: H05K3/387 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K3/4661 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.

Abstract translation: 公开了印刷电路板及其制造方法。 根据本发明的实施例的方法包括：提供其上依次层叠有第一绝缘层，第一电路图案，第二绝缘层和树脂层的基板; 镗孔穿透基底的通孔; 通过去污工艺在树脂层上形成粗糙度; 形成通过所述通孔在层之间形成电连接的通孔; 并在其上形成粗糙度的树脂层上形成第二电路图案。

公开(公告)号：US20090110916A1

公开(公告)日：2009-04-30

申请号：US11988072

申请日：2006-07-03

Applicant: Valery Ostrovsky

Inventor： Valery Ostrovsky

IPC: B32B15/085 ,  B29C70/88 ,  B32B37/00 ,  B32B37/02 ,  H05K1/05

CPC classification number: H05K3/386 ,  B32B15/085 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  B32B37/153 ,  B32B2250/40 ,  B32B2264/102 ,  B32B2311/12 ,  B32B2323/10 ,  B32B2457/08 ,  H05K1/032 ,  H05K3/022 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0143 ,  H05K2203/0759 ,  H05K2203/1545 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/31692

Abstract: The invention provides a low energy loss, multi-layered polypropylene/metal foil product useful for further processing into printed circuit boards and antenna boards for microwave circuitry. A continuous process for manufacture of the product is described. The process comprises the steps of: providing metal foil; optionally, extrusion coating molten polypropylene upon said metal foil, to obtain a foil coated with a polypropylene foundation layer; casting a molten polypropylene tie-layer upon said metal foil or upon said coated metal foil; and laminating a polypropylene sheet on said tie layer. In the process, heat is applied to induce fusing of the layers of the multi-layered product.

Abstract translation: 本发明提供了一种低能量损失的多层聚丙烯/金属箔产品，用于进一步加工成用于微波电路的印刷电路板和天线板。 描述了用于制造产品的连续方法。 该方法包括以下步骤：提供金属箔; 任选地，在所述金属箔上挤出涂覆熔融聚丙烯，以获得涂覆有聚丙烯基础层的箔; 在所述金属箔上或所述涂覆的金属箔上浇铸熔融聚丙烯粘结层; 并在所述粘结层上层压聚丙烯片材。 在该过程中，施加热量以引起多层产品的层的熔合。

公开(公告)号：US07459047B2

公开(公告)日：2008-12-02

申请号：US11194606

申请日：2005-08-02

Applicant: Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

Inventor： Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

IPC: B29C65/52 ,  B32B15/08

CPC classification number: B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B37/12 ,  B32B2307/202 ,  B32B2307/3065 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0346 ,  H05K3/025 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31681

Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.

Abstract translation: 通过将聚酰胺酸清漆涂布到载体上的非常薄的铜箔上，半干燥清漆，使用热辊压机将聚酰亚胺膜层压到涂覆有漆膜的铜箔上，制备柔性金属箔/聚酰亚胺层压体 在具有受控氧浓度的气氛中处理该层压板用于溶剂去除和酰亚胺化。 由聚酰胺酸酰亚胺化得到的聚酰亚胺粘合剂层的厚度最高达6μm，聚酰亚胺膜和聚酰亚胺粘合剂层的厚度之和高达25μm。 聚酰亚胺粘合剂层的Tg> 400℃

公开(公告)号：US07415761B2

公开(公告)日：2008-08-26

申请号：US10356464

申请日：2003-02-03

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20080145689A1

公开(公告)日：2008-06-19

申请号：US11718986

申请日：2005-11-10

Applicant: Nobuyuki Ogawa ,  HItoshi Onozeki ,  Takahiro Tanabe ,  Kenji Takai ,  Norio Moriike ,  Shin Takanezawa ,  Takako (Formerly Watanabe) Ejiri ,  Toshihisa Kumakura

Inventor： Nobuyuki Ogawa ,  HItoshi Onozeki ,  Takahiro Tanabe ,  Kenji Takai ,  Norio Moriike ,  Shin Takanezawa ,  Takako (Formerly Watanabe) Ejiri ,  Toshihisa Kumakura

IPC: H05K1/09 ,  B32B15/04 ,  H05K3/00

CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12667 ,  Y10T428/12694 ,  Y10T428/12847 ,  Y10T428/12854 ,  Y10T428/12931 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/2887

Abstract: Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Abstract translation: 本发明提供一种粘附辅助剂配合金属箔，其特征在于，在表面的平均平均粗糙度Rz为2.0μm以下的金属上，具有厚度为0.1〜10μm的粘附辅助剂层，其中，所述粘合助剂层为 由粘合辅助剂组合物形成，包括：（A）选自酚醛清漆环氧树脂和芳烷基环氧树脂的环氧树脂; 和（C）环氧树脂固化剂。

公开(公告)号：US07294393B2

公开(公告)日：2007-11-13

申请号：US11167623

申请日：2005-06-27

Applicant: Hideya Murai ,  Tadanori Shimoto ,  Kazuhiro Baba ,  Katsumi Kikuchi

Inventor： Hideya Murai ,  Tadanori Shimoto ,  Kazuhiro Baba ,  Katsumi Kikuchi

IPC: B32B3/06

CPC classification number: H05K3/4673 ,  B32B7/12 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/249958 ,  Y10T428/31681

Abstract: In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at −65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.

Abstract translation: 在片材（1）中，设置接合层（2），然后在接合层（2）上层叠高强度层（3）。 接合层（2）由作为热固性材料的环氧树脂制成。 高强度层（3）由聚酰亚胺制成，其在环氧树脂的热固化温度下不软化，并且其拉伸断裂强度高于固化的热固性材料的拉伸断裂强度。 此外，聚酰亚胺在23℃下的拉伸断裂强度为100MPa以上，在23℃下的拉伸断裂伸长率为10％以上。假设在-65℃下的拉伸断裂强度为a和a 150℃时的拉伸断裂强度为b，比率（a / b）为2.5以下。

公开(公告)号：US20070172674A1

公开(公告)日：2007-07-26

申请号：US11657529

申请日：2007-01-25

Applicant: Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

Inventor： Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

IPC: B32B15/08

CPC classification number: B32B27/281 ,  B32B7/06 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G73/1042 ,  C08G73/12 ,  H05K3/181 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10S428/901 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

Abstract translation: 一种树脂复合铜箔，其包含铜箔和含有嵌段共聚物聚酰亚胺和马来酰亚胺化合物的树脂层，所述树脂层形成在所述铜箔的一个表面上，其制造方法，使用所述树脂复合材料的覆铜层压板 铜箔，使用覆铜层压板的印刷电路板的制造方法，以及通过上述方法得到的印刷电路板。

公开(公告)号：USRE39615E1

公开(公告)日：2007-05-08

申请号：US10617653

申请日：2002-10-17

Applicant: Charles A. Poutasse

Inventor： Charles A. Poutasse

IPC: B23B3/00

CPC classification number: H05K3/386 ,  C08G59/02 ,  C08G59/06 ,  C08G59/40 ,  C08L61/04 ,  C09J163/00 ,  H05K3/022 ,  H05K3/384 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/30 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(═NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

Abstract translation: 本发明涉及粘合剂组合物，其包含：（A）至少一种酚醛树脂树脂; 和（B）通过使（B-1）至少一种双官能环氧树脂与（B-2）至少一种由下式表示的化合物反应制备的产物：其中在式（I）和（II）中：G，T和 Q独立地为选自COOH，OH，SH，NH 2，NHR 1，（NHC（-NH））m的官能团。 NH 2，NR 2 COOH，NR 1，SO 2，C（O）NHR 2， 1，R 2，R 2，R 2，R 2，OH，R 2， 其中R 1，R 2，R 2，R 2，R 2， / SUP>是烃基，R 2是亚烷基或亚烷基，m是1至约4的数; T也可以是R 1，或者1或2或更高的C 1 H 4 > -NH 2 2; 并且Q也可以是H.本发明还涉及具有粘附到其至少一个侧面的上述粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。 本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

公开(公告)号：US20070026245A1

公开(公告)日：2007-02-01

申请号：US11493603

申请日：2006-07-27

Applicant: Satoshi Okamoto ,  Toyonari Ito

Inventor： Satoshi Okamoto ,  Toyonari Ito

IPC: B32B15/09 ,  B32B15/20 ,  B05D3/02

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B38/0036 ,  B32B2305/55 ,  B32B2307/54 ,  B32B2309/02 ,  H05K1/0326 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: The present invention provides a laminate comprising a resin layer and a copper foil. The resin layer is made from a liquid crystalline polyester having at least one structural unit selected from a structural unit derived from aromatic diamine and a structural unit derived from aromatic amine with a phenolic hydroxyl group in an amount of 10 to 35% by mole on the basis of the total structural units in the polyester. The copper foil has a tensile modulus of 60 GPa or smaller and a tensile strength at break of 150 MPa or smaller measured after heat treatment at a temperature of 300° C. The copper-foil laminate has good flexibility and high durability with little anisotropy is provided.

Abstract translation: 本发明提供一种包含树脂层和铜箔的层压体。 树脂层由液晶聚酯制成，该液晶聚酯具有至少一种选自芳族二胺衍生的结构单元的结构单元和衍生自酚羟基的芳族胺的结构单元，其量为10〜35摩尔％ 聚酯中总结构单位的基础。 铜箔的拉伸模量为60GPa以下，热处理后在300℃下测定的断裂拉伸强度为150MPa以下。铜箔层叠体具有良好的柔软性，耐久性高，几何异向性小 提供。