公开(公告)号：US20170171990A1

公开(公告)日：2017-06-15

申请号：US15290894

申请日：2016-10-11

Applicant: Samsung Display Co., Ltd.

Inventor： Byoungyong Kim ,  Inseok Yeo ,  Seung-hwa Ha

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K5/0017 ,  H05K1/113 ,  H05K1/116 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10128

Abstract: A display device includes a printed circuit board (PCB), two sides of the PCB extending in first and second directions, respectively, the first and second directions crossing each other, pad group areas being defined in the PCB and arranged along the first direction; and a display panel electrically connected to the PCB through the pad group areas, the PCB including: first pads in each of the pad group areas and arranged along a third direction crossing the first and second directions; and second pads in each of the pad group areas, arranged along the third direction, and spaced apart from the first pads, wherein a portion of the first pads is in the first pad area, an other portion of the first pads and a portion of the second pads are in the second pad area, and an other portion of the second pad is in the third pad area.

公开(公告)号：US20170168212A1

公开(公告)日：2017-06-15

申请号：US15038349

申请日：2015-11-16

Applicant: Boe Technology Group Co., Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Inventor： He CHEN ,  Yufei HU ,  Hui DONG

IPC: F21V8/00 ,  H05K1/02 ,  H05B33/08

CPC classification number: G02B6/009 ,  G02B6/0068 ,  G02B6/0073 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0845 ,  H05B33/089 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10106 ,  Y02B20/346

Abstract: Embodiments of the present invention provide an LED lamp strip structure, a backlight module, a liquid crystal display device and a method of controlling the LED lamp strip structure. The LED lamp strip structure comprises: a circuit board; and at least a first LED sequence and a second LED sequence arranged in parallel on the circuit board, the first LED sequence having a plurality of predetermined intervals, and each LED in the second LED sequence corresponding to one of the plurality of predetermined intervals respectively.

公开(公告)号：US20170164474A1

公开(公告)日：2017-06-08

申请号：US15367070

申请日：2016-12-01

Applicant: Samsung Display Co., Ltd.

Inventor： Byoungyong KIM ,  Inseok YEO ,  Euiyun JANG ,  Sangjun LEE ,  Jeongho HWANG

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H05K1/111 ,  H05K1/118 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10545 ,  Y02P70/611

Abstract: Provided is a printed circuit board including a base substrate, first row pads, and second row pads. The base substrate has two sides, that can be adjacent, respectively extending in first and second directions. A plurality of pad group areas successively positioned along the first direction are defined on the base substrate. The first row pads are respectively disposed within the pad group areas and successively positioned along a third direction. The second row pads are respectively disposed within the pad group areas, successively positioned along the third direction, and spaced apart from the first row pads. Each of the second row pads is a predetermined distance from a corresponding one of the first row pads in the second direction.

公开(公告)号：US20170018881A1

公开(公告)日：2017-01-19

申请号：US14798536

申请日：2015-07-14

Applicant: Tyco Electronics Corporation ,  Tyco Electronics Japan G.K.

Inventor： Sandeep Patel ,  Linda Ellen Shields ,  Bruce Allen Champion ,  Chad William Morgan ,  Masayuki Aizawa

IPC: H01R13/6471 ,  H01R13/66

CPC classification number: H01R13/6471 ,  H01R13/6616 ,  H05K1/0228 ,  H05K1/023 ,  H05K1/117 ,  H05K2201/09409

Abstract: Pluggable connector includes a plug housing configured to couple to a communication cable. The plug housing has a plug cavity. The pluggable connector also includes a module board that is disposed within the plug cavity and configured to be communicatively coupled to the communication cable. The module board has a mating edge configured to interface with a mating connector. The module board includes a plurality of signal pathways and a plurality of ground pathways in which the signal pathways are interleaved between corresponding ground pathways. The signal and ground pathways include respective contact pads that are disposed proximate to the mating edge for engaging corresponding contacts of the mating connector. Each of the ground pathways has separate first and second trace segments and a damping component that electrically joins the first and second trace segments.

Abstract translation: 可插拔连接器包括被配置为耦合到通信电缆的插头壳体。 插头壳体具有插头腔。 可插拔连接器还包括模块板，其设置在插塞空腔内并且被配置为可通信地耦合到通信电缆。 模块板具有配置成与配合连接器相接合的配合边缘。 模块板包括多个信号路径和多个接地路径，其中信号路径在对应的接地路径之间交错。 信号和接地路径包括各自的接触垫，其设置在配合边缘附近，用于接合配合连接器的相应触点。 每个接地路径具有分离的第一和第二迹线段和电连接第一和第二迹线段的阻尼分量。

公开(公告)号：US09549467B1

公开(公告)日：2017-01-17

申请号：US14041407

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick ,  Luan Vo ,  Dennis Albaijes

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.

Abstract translation: 一种用于太空任务的电子组件，包括PCB和耦合到PCB的一个或多个多针CGA器件。 PCB具有一个或多个通孔在焊盘特征中，并且每个通孔内焊盘特征包括焊盘焊盘，其被配置为将一个或多个多引脚CGA器件的引脚耦合到通孔。 PCB还包括在PCB的中心平面上方和下方两个对称配置的多个层。

公开(公告)号：US09535302B2

公开(公告)日：2017-01-03

申请号：US14490467

申请日：2014-09-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hee-Kwon Lee

IPC: H01L27/32 ,  G02F1/1368 ,  H05K1/11 ,  G02F1/1345 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02F1/1368 ,  G02F1/13452 ,  H01L27/3241 ,  H01L27/3244 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/189 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09672 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: A display device according to an example embodiment of the present invention includes a display panel configured to display an image, the display panel including a plurality of pixels, a chip on film (COF) coupled to the display panel, the COF comprising a driver, a plurality of COF wires and a plurality of COF pads, and a flexible printed circuit board (FPCB) coupled to the COF, the FPCB including a plurality of FPCB wires and a plurality of FPCB pads, wherein the plurality of COF pads are arranged in two rows, and wherein one or more COF pads of the plurality of COF pads in a first row of the two rows are one or more dummy pads.

Abstract translation: 根据本发明的示例性实施例的显示装置包括被配置为显示图像的显示面板，包括多个像素的显示面板，耦合到显示面板的薄膜（COF），包括驱动器的COF， 多个COF线和多个COF垫，以及耦合到COF的柔性印刷电路板（FPCB），所述FPCB包括多个FPCB布线和多个FPCB垫，其中所述多个COF垫布置在 两排，并且其中两行中的第一行中的多个COF焊盘中的一个或多个COF焊盘是一个或多个虚拟焊盘。

公开(公告)号：US09524931B2

公开(公告)日：2016-12-20

申请号：US14592105

申请日：2015-01-08

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Satoshi Shiraki

IPC: H01L23/12 ,  H01L23/053 ,  H01L21/20 ,  H01L21/36 ,  H01L23/498 ,  H05K1/11 ,  H01L25/10 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H05K1/14 ,  H05K3/00 ,  H01L23/29

CPC classification number: H01L23/49838 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1533 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: A wiring substrate includes a block with substrates laid out in an array. The block includes corners and a plan view center. Each substrate includes a substrate body. Pads are formed on the substrate body. Each pad includes a pad surface. The pads of the substrates include first pads, which are the pads of one of the substrates located in at least one of the corners of the block. The pad surface of each of the first pads includes a first axis extending from the first pad toward the plan view center of the block. The pad surface of each of the first pads has a first length along the corresponding first axis and a second length along a second axis, which is orthogonal to the first axis. The first length is longer than the second length.

Abstract translation: 布线基板包括具有布置在阵列中的基板的块。 该块包括角落和平面图中心。 每个基板包括基板主体。 垫片形成在基板主体上。 每个垫包括垫表面。 衬底的焊盘包括第一焊盘，其是位于块的至少一个角落中的一个衬底的焊盘。 每个第一焊盘的焊盘表面包括从第一焊盘朝向块的平面图中心延伸的第一轴。 每个第一焊盘的焊盘表面具有沿着对应的第一轴线的第一长度和沿着与第一轴线正交的第二轴线的第二长度。 第一长度比第二长度长。

公开(公告)号：US20160307840A1

公开(公告)日：2016-10-20

申请号：US15193355

申请日：2016-06-27

Applicant: Texas Instruments Incorporated

Inventor： Thomas Dyer BONIFIELD ,  Byron WILLIAMS ,  Shrinivasan JAGANATHAN ,  David LARKIN ,  Dhaval Atul SARAIYA

IPC: H01L23/522 ,  H01L23/538 ,  H01L23/498 ,  H01L23/62 ,  H05K1/16 ,  H01L23/532 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/5223 ,  H01L23/49811 ,  H01L23/5227 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/5329 ,  H01L23/538 ,  H01L23/62 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/14335 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0088 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0175 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09672 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.

公开(公告)号：US09468102B2

公开(公告)日：2016-10-11

申请号：US14291684

申请日：2014-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： KyongSoon Cho

IPC: H05K1/11 ,  H05K1/18 ,  G02F1/1345

CPC classification number: H05K1/118 ,  G02F1/13452 ,  H05K1/189 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10128

Abstract: A display device includes a display panel including panel bumps, a flexible circuit film connected to the display panel and including a chip, and panel bonding leads connecting the display panel to the chip. The panel bumps include first panel bumps arranged along a first row, and second panel bumps arranged along a second row which is spaced apart from the first row toward the chip. Each second panel bump is disposed between two adjacent first panel bumps when viewed from a column direction perpendicular to a row direction. The panel bonding leads includes first panel bonding leads connected to the first panel bumps and second panel bonding leads connected to the second panel bumps. Each first panel bonding lead includes a first portion having a first thickness, and a second portion adjacent to the second panel bump having a second thickness smaller than the first thickness.

Abstract translation: 显示装置包括显示面板，包括面板凸块，连接到显示面板并包括芯片的柔性电路薄膜，以及将显示面板连接到芯片的面板接合引线。 面板凸块包括沿着第一排布置的第一面板凸块和沿着与第一行朝向芯片间隔开的第二排布置的第二面板凸块。 当从垂直于行方向的列方向观察时，每个第二面板凸块设置在两个相邻的第一面板凸块之间。 面板接合引线包括连接到第一面板凸块的第一面板接合引线和连接到第二面板凸块的第二面板接合引线。 每个第一面板接合引线包括具有第一厚度的第一部分和与第二面板凸起相邻的第二部分，其具有小于第一厚度的第二厚度。

公开(公告)号：US20160211599A1

公开(公告)日：2016-07-21

申请号：US14916663

申请日：2014-09-04

Applicant: FUJIKURA LTD. ,  DDK LTD.

Inventor： Yuki ISHIDA ,  Masayuki SUZUKI ,  Yuki NAKANO ,  Harunori URAI ,  Norifumi NAGAE

IPC: H01R12/73 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/732 ,  H01R12/772 ,  H01R12/88 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09781

Abstract: A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed separately from the wirings (9, 11).

Abstract translation: 印刷电路板（1）包括：基底（3）; 多个用于电连接的焊盘（15a，17a），其设置在所述基底基板（3）的一个表面侧和连接端部（13）处以与另一个电子部件（50）连接; 与焊盘（15a，17a）连接的布线（9,11）; 以及形成在连接端部（13）的侧边缘部分处并且沿着断开方向与另一个电子部件（50）的接合部分（58）接合的可接合部分（28,29）。 柔性印刷布线板（1）还包括加强层（31,32），其被设置在基底基板（3）的另一个表面侧，并且当观察时相对于可接合部分（28,29）在前侧 在与另一个电子部件连接的方向上，并且与布线（9,11）分开形成。