公开(公告)号：US09668352B2

公开(公告)日：2017-05-30

申请号：US13835845

申请日：2013-03-15

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  Power Gold LLC

Inventor： James Jen-ho Wang ,  Jin Joo Park ,  Masahiko Kouchi

IPC: H05K1/16 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/189 ,  H01L2224/83192 ,  H05K1/0207 ,  H05K1/183 ,  H05K2201/09781 ,  H05K2201/10681 ,  Y10T29/49146

Abstract: A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer arranged in-between the second and the third conductive layers, the second conductive layer and the insulating center layer being removed to form an opening to expose an upper surface of the third conductive layer, wherein the first flexible printed circuit is arranged such that the device is accommodated inside the opening, a lower surface of the device being in thermal connection with the third conductive layer, and the first conductive layer is arranged to be in electrical connection with the second conductive layer.

公开(公告)号：US09665190B2

公开(公告)日：2017-05-30

申请号：US14810202

申请日：2015-07-27

Applicant: Wacom Co., Ltd.

Inventor： Hiromichi Kanzaki ,  Gunji Ishihara ,  Taketoshi Ito ,  Takashi Yamaguchi ,  Oki Nagashima

IPC: G06F3/038 ,  G06F3/0354 ,  H05K1/02 ,  B23K26/351 ,  B23K37/04 ,  B23K26/08 ,  H05K3/06 ,  H05K1/18 ,  B23K101/42

CPC classification number: G06F3/038 ,  B23K26/08 ,  B23K26/351 ,  B23K37/04 ,  B23K37/0452 ,  B23K2101/42 ,  G06F3/03545 ,  H05K1/0292 ,  H05K1/181 ,  H05K3/06 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10015 ,  H05K2203/107 ,  H05K2203/171 ,  H05K2203/173 ,  H05K2203/175

Abstract: A position indicator includes: a chassis; a substrate disposed inside the chassis; a coil; capacitors disposed on the substrate; interconnects disposed on the substrate such that each at least partially connects a respective one of the capacitors to the coil in parallel; and pairs of land patterns. Each pair of land patterns includes a first land pattern and a second land pattern. Each of the interconnects has a first end connected to a first end of the coil and a second end connected to a second end of the coil, and is connected to one of the capacitors. The pairs of land patterns are disposed such that each of the interconnects is at least partially interposed between the first land pattern and the second land pattern of one of the pairs of land patterns.

公开(公告)号：US20170150612A1

公开(公告)日：2017-05-25

申请号：US15381380

申请日：2016-12-16

Applicant: Yazaki Corporation

Inventor： Takafumi Toda ,  Takeyuki Hamaguchi

IPC: H05K3/20 ,  H05K3/00 ,  H05K13/04 ,  H05K1/02

CPC classification number: H05K3/20 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0212 ,  H05K1/0263 ,  H05K3/0044 ,  H05K3/202 ,  H05K13/04 ,  H05K2201/09781 ,  H05K2201/10272 ,  H05K2203/0228 ,  Y10T29/4913

Abstract: An electronic component board is made by attaching bus bars to an insulating plate, and by electrically connecting electronic components to the bus bars. In the electronic component board, heat radiating portions integrally formed with specific bus bars are provided along an outer periphery of the insulating plate. A width of a portion extended parallel to the outer periphery of the insulating plate of the heat radiating portion is constant. The electronic component board 1 is produced by die-cutting a metal plate in a lump into the bus bars and a band-shaped connecting portion connected to the bus bars, having a constant width, and positioned at an outer edge of the metal plate, by attaching the bus bars to the insulating board, and by cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as the heat radiating portion.

公开(公告)号：US09655241B2

公开(公告)日：2017-05-16

申请号：US14916605

申请日：2014-09-04

Applicant: FUJIKURA LTD. ,  DDK Ltd.

Inventor： Yuki Ishida ,  Masayuki Suzuki ,  Yuki Nakano ,  Harunori Urai ,  Norifumi Nagae

IPC: H01R12/77 ,  H05K1/11 ,  H01R12/88 ,  H01R12/72 ,  H05K1/02

CPC classification number: H05K1/113 ,  H01R12/727 ,  H01R12/772 ,  H01R12/88 ,  H05K1/0218 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09781

Abstract: A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the wirings (9).

公开(公告)号：US20170135201A1

公开(公告)日：2017-05-11

申请号：US15410485

申请日：2017-01-19

Applicant: LG Display Co., Ltd.

Inventor： InHo YEO ,  KyongShik JEON

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/0218 ,  H05K1/0219 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K2201/04 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

公开(公告)号：US09647327B2

公开(公告)日：2017-05-09

申请号：US13805416

申请日：2011-06-11

Applicant: Ulrich Schindler ,  Christian Schumacher ,  Stefan Mieslinger

Inventor： Ulrich Schindler ,  Christian Schumacher ,  Stefan Mieslinger

IPC: H01Q1/36 ,  H01Q1/38 ,  G06K19/077 ,  H01L23/498 ,  H01Q1/22 ,  H01Q7/00 ,  H05K3/30 ,  H05K1/16 ,  H05K3/38

CPC classification number: H01Q1/38 ,  G06K19/077 ,  G06K19/07722 ,  G06K19/07779 ,  H01L23/49855 ,  H01L2924/0002 ,  H01Q1/2225 ,  H01Q7/00 ,  H05K1/165 ,  H05K3/305 ,  H05K3/38 ,  H05K2201/09781 ,  H05K2201/10098 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to a multilayered film element (1) comprising a first component, more particularly an RFID antenna in the form of a multilayered film element, and to a method for fixing a second component on a film element (1) of this type. The film element (1) has a dielectric layer (10) having a front side (10V) and a rear side (10R). The film element (1) has a layer (11, 12) forming a first component, and at least one component contact area (23, 24) arranged on the front side (10V) and connected to the first component. The film element (1) has at least one thermode contact layer (30) which is arranged on the dielectric layer (10) and which, as seen perpendicularly to the dielectric layer (10), is arranged in the region of the at least one component contact area (23, 24). The thermode contact layer (30) has a thermode contact area (32) on a side facing away from the dielectric layer (10), said thermode contact area forming an outer surface of the film element (1).

公开(公告)号：US09609746B1

公开(公告)日：2017-03-28

申请号：US15011649

申请日：2016-01-31

Applicant: Unimicron Technology Corp.

Inventor： Shu-Sheng Chiang ,  Ming-Hao Wu ,  Wei-Ming Cheng

IPC: H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/0266 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0376 ,  H05K2203/163

Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening connecting the cavity and exposing a portion of the first patterned circuit layer. A hole diameter of the opening is smaller than a hole diameter of cavity. A height difference is between an inner surface of the inner dielectric layer exposed by the cavity and a top surface of the first patterned circuit layer exposed by the opening.

公开(公告)号：US09605821B2

公开(公告)日：2017-03-28

申请号：US14547652

申请日：2014-11-19

Applicant: GE LIGHTING SOLUTIONS, LLC

Inventor： Bidour Al-Gaadi ,  Xavier Jacques Denis ,  Zoltán Hercz ,  Balázs Nagy

IPC: F21S8/08 ,  H05K1/02 ,  F21V15/01 ,  F21V29/87 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21S8/086 ,  F21V15/01 ,  F21V29/87 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: An outdoor light emitting diode (LED) luminaire includes a plastic housing having two or more surfaces, a printed circuit board (PCB) coupled to at least one of the two or more surfaces, the PCB including a substrate and a conductive surface on the substrate, a plurality of LED light sources mounted on the PCB, a first portion of the conductive surface forming conductive paths in electrical communication with the plurality of LED light sources, and a second portion of the conductive surface forming thermal pads at a plurality of locations that are at least one of between and around the plurality of LED light sources, the thermal pads configured to dissipate heat generated by the plurality of LED light sources.

公开(公告)号：US09591759B2

公开(公告)日：2017-03-07

申请号：US14740360

申请日：2015-06-16

Applicant: EMCOM TECHNOLOGY INC.

Inventor： Chu-Li Wang

IPC: H01P1/00 ,  H05K1/16 ,  H01R13/6464

CPC classification number: H05K1/16 ,  H05K1/0222 ,  H05K1/0228 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/162 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09809

Abstract: A circuit board for a communication connector, comprising a first signal input terminal, a first signal output terminal, a second signal input terminal, a second signal output terminal, a first signal wire, a second signal wire, a capacitive structure and a capacitive cylinder. The first signal input terminal and the first signal output terminal are coupled by the first signal wire; the second signal input terminal and the second signal output terminal are coupled by the second signal wire; the capacitive structure is coupled with the first signal wire; the capacitive cylinder is coupled with second signal wire. The capacitive structure and the capacitive cylinder are capacitive coupled between the first signal wire and the second signal wire.

Abstract translation: 一种用于通信连接器的电路板，包括第一信号输入端，第一信号输出端，第二信号输入端，第二信号输出端，第一信号线，第二信号线，电容结构和电容筒 。 第一信号输入端和第一信号输出端通过第一信号线耦合; 第二信号输入端和第二信号输出端通过第二信号线耦合; 电容结构与第一信号线耦合; 电容筒与第二信号线耦合。 电容结构和电容气缸电容耦合在第一信号线和第二信号线之间。

公开(公告)号：US09585256B2

公开(公告)日：2017-02-28

申请号：US14565532

申请日：2014-12-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki Gouchi

IPC: H05K1/18 ,  H05K3/46 ,  B32B37/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H01L23/00 ,  B32B37/04 ,  B32B37/14 ,  H05K7/10 ,  H05K7/12

CPC classification number: H05K1/185 ,  B32B37/04 ,  B32B37/142 ,  B32B37/18 ,  B32B2305/342 ,  H01L24/19 ,  H01L24/25 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/09781 ,  H05K2201/10 ,  H05K2201/1006 ,  H05K2201/10204 ,  H05K2203/063 ,  H01L2924/00

Abstract: A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.

Abstract translation: 部件嵌入式基板包括通过沿预定方向堆叠多个树脂层而形成的多层体，嵌入在多层体中的部件，具有多个端子电极的部件，设置在多层体中的多个接合导体 并且与所述多个端子电极接合，设置在所述多层体中并电耦合到所述多个接合导体的多个布线导体和包围在设置在所述多层体中的所述部件的外边界内的至少一个辅助构件。 辅助构件可以与多个布线导体中的每一个电绝缘，并且被布置为当在多层体上施加压力时平衡作用在多个端子电极上的压力。