公开(公告)号：US20160352243A1

公开(公告)日：2016-12-01

申请号：US15157991

申请日：2016-05-18

Applicant: FUJITSU LIMITED

Inventor： Kazuya OKAMOTO ,  Hironobu Kageyama

IPC: H02M7/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0237 ,  H02M1/44 ,  H02M2003/1566 ,  H05K1/0243 ,  H05K1/0265 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0979 ,  H05K2201/09972 ,  H05K2201/10166 ,  H05K2201/10303

Abstract: A converter mounting board includes: an electronic component which is supplied an electric current; a high-frequency DC-DC converter that supplies a direct current corresponding to a fast change of the electric current of the electronic component; and a low-frequency DC-DC converter located far away from the electronic component than the high-frequency DC-DC converter and supplies a direct current corresponding to a slow change of the electric current of the electronic component.

Abstract translation: A转换器安装板包括：提供电流的电子部件; 提供与电子部件的电流的快速变化对应的直流电流的高频DC-DC转换器; 以及与高频DC-DC转换器相比远离电子部件的低频DC-DC转换器，并且提供与电子部件的电流的缓慢变化相对应的直流电流。

公开(公告)号：US20160282389A1

公开(公告)日：2016-09-29

申请号：US15035675

申请日：2014-11-13

Applicant: JUMATECH GMBH

Inventor： Markus WÖLFEL

IPC: G01R17/02 ,  H01C7/06 ,  H05K3/32 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00

CPC classification number: G01R17/02 ,  G01R1/203 ,  H01C7/06 ,  H05K1/0265 ,  H05K1/0268 ,  H05K1/115 ,  H05K1/185 ,  H05K3/0017 ,  H05K3/103 ,  H05K3/328 ,  H05K3/4644 ,  H05K2201/093 ,  H05K2201/0979 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10272 ,  H05K2203/0455

Abstract: The invention relates to a printed circuit board (1) with at least two connection points (3) and at least one precision resistor (2) for measuring a current flowing between the connection points. The aim of the invention is to inexpensively produce a printed circuit board of the type mentioned in the introduction such that the printed circuit board has a reduced installation space while simultaneously having a preferably long service life. According to the invention, this is achieved in that the precision resistor extends between the connection points in the printed circuit board (11). The invention additionally relates to a corresponding method for producing said printed circuit board.

Abstract translation: 本发明涉及具有至少两个连接点（3）和至少一个精密电阻器（2）的印刷电路板（1），用于测量在连接点之间流动的电流。 本发明的目的是廉价地制造导入中所述类型的印刷电路板，使得印刷电路板具有减小的安装空间，同时具有优选较长的使用寿命。 根据本发明，这是通过精密电阻器在印刷电路板（11）的连接点之间延伸来实现的。 本发明还涉及用于制造所述印刷电路板的相应方法。

公开(公告)号：US09419065B2

公开(公告)日：2016-08-16

申请号：US13932834

申请日：2013-07-01

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Chieh-Wei Chen ,  Dinesh C. Mathew ,  Paul S. Drzaic ,  Sang Ha Kim ,  Silvio Grespan ,  John Z. Zhong ,  Jean-Pierre Guillou ,  Kuo-Hua Sung ,  Young Bae Park ,  Vasudha Gupta

IPC: H01L29/82 ,  H01L27/32 ,  G02F1/1333 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L27/326 ,  G02F1/133305 ,  G02F2001/133388 ,  H01L27/3297 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09036 ,  H05K2201/0979 ,  H05K2201/10128 ,  Y02E10/549

Abstract: An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.

Abstract translation: 电子设备可以设置有具有最小边界区域的有机发光二极管显示器。 通过为显示器提供具有中立平面调整特征的弯曲边缘部分，可以使边缘区域最小化，这有利于弯曲边缘部分的弯曲同时最小化对弯曲边缘部分的损伤。 中性平面调整特征可以包括显示器的改进的背膜层，其中后膜层的部分在弯曲区域中被去除。 显示装置可以包括衬底，具有显示像素的衬底上的显示面板以及靠近显示面板的外围电路，并被配置为驱动显示像素。 基板的周边的一部分可以基本上垂直于显示面板弯曲，以减少显示装置的表观表面积。 弯曲部分可以包括用于与外围电路通信的电极。

公开(公告)号：US20160173055A1

公开(公告)日：2016-06-16

申请号：US14569981

申请日：2014-12-15

Applicant: INTEL CORPORATION

Inventor： Michael W. Leddige ,  Wei Jern Tan ,  Chee Kit Chew ,  Natasya Athirah Abdul Khalid ,  Howard L. Heck

IPC: H03H7/38 ,  H01P3/08

CPC classification number: H05K1/025 ,  H05K2201/0979

Abstract: Techniques for impedance matching are described herein. The techniques include an apparatus for impedance matching including a trace section having a load impedance. The trace section comprises characteristics generating an impedance match between a main channel impedance and the load impedance.

Abstract translation: 本文描述了用于阻抗匹配的技术。 这些技术包括用于阻抗匹配的装置，其包括具有负载阻抗的迹线部分。 迹线部分包括在主通道阻抗和负载阻抗之间产生阻抗匹配的特性。

公开(公告)号：US09362603B2

公开(公告)日：2016-06-07

申请号：US13806824

申请日：2010-06-30

Applicant: Taras Kushta

Inventor： Taras Kushta

IPC: H01P1/203 ,  H01P1/20 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01P1/20 ,  H01P1/203 ,  H05K1/0222 ,  H05K1/0233 ,  H05K1/0251 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/0979

Abstract: A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.

Abstract translation: 本发明的过滤器包括具有多层基板的多个通孔结构。 多个通孔结构中的每一个包括第一，第二和第三功能部分。 第一功能部的信号通路的一端连接到第二功能部的信号通路的一端，第二功能部的信号通路的另一端连接到第三功能部的两个信号通路。 那些信号通道被多个接地通孔包围。 滤波器的输入和输出端口连接到每个第一功能部分的信号通道的另一端。

公开(公告)号：US09312593B2

公开(公告)日：2016-04-12

申请号：US13483234

申请日：2012-05-30

Applicant: Dror Hurwitz

Inventor： Dror Hurwitz

IPC: H01P11/00 ,  H01P3/08 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01P11/003 ,  H01L2924/0002 ,  H01P3/08 ,  H01P3/081 ,  H01P3/085 ,  H05K1/0218 ,  H05K1/0242 ,  H05K3/4647 ,  H05K2201/0723 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/0979 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A signal carrier for carrying a signal in a direction within the X-Y plane of a multilayer composite electronic structure comprising a plurality of dielectric layers extending in an X-Y plane, the signal carrier comprising a first transmission line comprising a lower continuous metallic layer and further comprising a row of metallic via posts coupled to the continuous metal layer, wherein the transmission line is separated by a dielectric material from an underlying reference plane.

Abstract translation: 一种用于在包括在XY平面中延伸的多个电介质层的多层复合电子结构的XY平面内的方向上传送信号的信号载体，所述信号载体包括包含下连续金属层的第一传输线，并且还包括 金属通孔柱连接到连续金属层，其中传输线由介电材料与下面的参考平面隔开。

公开(公告)号：US20160056222A1

公开(公告)日：2016-02-25

申请号：US14823509

申请日：2015-08-11

Applicant: Japan Display Inc.

Inventor： Kazuhiro ODAKA ,  Jun HANARI ,  Toshihiro SATO

IPC: H01L27/32 ,  H01L51/00

CPC classification number: H01L27/3297 ,  G02F1/00 ,  G02F1/13452 ,  G02F2202/28 ,  H01L27/3276 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  H05K2201/0979 ,  H05K2201/10136

Abstract: A terminal is formed on a substrate. An anisotropic conductive film is disposed on the terminal. A flexible printed board is connected to the terminal via the anisotropic conductive film. At least one opening is formed in the terminal. An adhesion reinforcing portion as a projection is formed inside the opening. The adhesion reinforcing portion is formed of a material having higher adhesion to the anisotropic conductive film than a material constituting the surface of the terminal, and is adhered to the anisotropic conductive film.

Abstract translation: 端子形成在基板上。 在端子上设置各向异性导电膜。 柔性印刷电路板通过各向异性导电膜连接到端子。 在终端中形成至少一个开口。 在开口内部形成有作为突起的粘合强化部。 附着力增强部由与各向异性导电膜的粘附性高于构成端子表面的材料的材料形成，并附着在各向异性导电膜上。

公开(公告)号：US20160035710A1

公开(公告)日：2016-02-04

申请号：US14882574

申请日：2015-10-14

Applicant: Sharp Kabushiki Kaisha

Inventor： Makoto AGATANI ,  Toshio HATA ,  Tomokazu NADA ,  Shinya ISHIZAKI

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21K9/232 ,  F21V23/06 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/01327 ,  H01L2933/0066 ,  H05K1/11 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/0979 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.

公开(公告)号：US09226388B2

公开(公告)日：2015-12-29

申请号：US13955474

申请日：2013-07-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang-Kyung Lee ,  Hee-Kyoung Lee ,  Dong-Hwan Lee ,  Kyung-Sang Lim

IPC: H05K9/00 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0242 ,  H05K1/0219 ,  H05K1/0233 ,  H05K2201/086 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/0979

Abstract: A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via.

Abstract translation: 公开了印刷电路板。 本发明的一个实施例提供了一种印刷电路板，其包括：绝缘层，其中形成有多层电路布线; 沿绝缘层的周边形成的通孔，其被构造用于连接形成在绝缘层的不同层上的电路布线，所述通孔以使其内部为中空的方式形成; 以及包含在通孔中的电磁波吸收部。

公开(公告)号：US09155206B2

公开(公告)日：2015-10-06

申请号：US12744054

申请日：2008-12-05

Applicant: Mitja Rateiczak ,  Bernhard Reul ,  Cornelia Retsch

Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Cornelia Retsch

IPC: H05K1/11 ,  H01R12/00 ,  H05K1/00 ,  H01R11/11 ,  H01R9/24 ,  H01R13/02 ,  H05K3/32 ,  H05B3/84 ,  H01R4/02 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K3/32 ,  H01R4/02 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0306 ,  H05K3/3421 ,  H05K2201/0979 ,  H05K2201/1031 ,  H05K2201/10962 ,  Y02P70/611

Abstract: In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1). The body (2) itself can also be configured so as to be resilient by way of incisions (6) and/or equipped with a plug-in lug (5).

Abstract translation: 在焊接连接元件（1）中，其特别地用于焊接到诸如窗玻璃的脆性基板上，用于连接电气部件，该焊料连接元件具有用于连接目的的主体（2）和至少两个 从其突出的焊脚（3），相应的可弹性变形的连接部分，其适于适应在主体和焊脚之间延伸的热膨胀差异，根据本发明提供了多于两个焊脚（3），用于焊接到 表面，其中热膨胀的差异和来自待连接部件的机械力的影响可以通过焊脚（3）和/或连接部件相对的弹性而平行于基板表面的至少两个坐标方向被适应 （2）和/或焊料连接元件（1）。 本体（2）本身也可以被配置为通过切口（6）和/或配备有插入式凸耳（5）而具有弹性。