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    PRINT SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PRINT SUBSTRATE
    23.
    发明申请
    PRINT SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PRINT SUBSTRATE 审中-公开
    印刷基板，电子设备以及制造印刷基板的方法

    公开(公告)号：US20150351240A1

    公开(公告)日：2015-12-03

    申请号：US14700266

    申请日：2015-04-30

    Applicant: FUJITSU LIMITED

    Inventor： Yoshio NABEYAMA

    IPC: H05K1/11 ,  H05K3/00 ,  H05K1/02

    CPC classification number: H05K1/115 ,  H05K1/0298 ,  H05K3/0047 ,  H05K3/429 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0207

    Abstract: A print substrate includes: a base; a tapered shape hole that is formed in the base, and is configured to have a diameter which continuously changes along a thickness direction of the base; a conductive film that covers a wall surface of the tapered shape hole; a plurality of wirings that are formed in locations which are different from each other in the thickness direction of the base, and that are connected to the conductive film; and a cylindrical shape hole that communicates with the tapered shape hole on a smaller diameter side of the tapered shape hole, and that has a smaller diameter than the diameter of the tapered shape hole in the locations in which the wirings, formed on the smaller diameter side of the tapered shape hole, of the plurality of wirings are connected to the conductive film.

    Abstract translation: 印刷基板包括：基底; 形成在所述基座中的锥形形状的孔，并且被构造成具有沿着所述基部的厚度方向连续变化的直径; 覆盖所述锥形孔的壁面的导电膜; 多个布线，其形成在基板的厚度方向上彼此不同的位置，并且与导电膜连接; 以及圆锥形孔，其与锥形孔的较小直径侧的锥形孔连通，并且在形成在更小直径上的布线的位​​置具有比锥形形状孔的直径小的直径 多个布线的锥形孔的一侧连接到导电膜。

    VIA STRUCTURE
    24.
    发明申请
    VIA STRUCTURE 有权
    威盛结构

    公开(公告)号：US20150334821A1

    公开(公告)日：2015-11-19

    申请号：US14809607

    申请日：2015-07-27

    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

    Inventor： Shih-Hsien WU ,  Min-Lin Lee

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0227 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4685 ,  H05K2201/09854 ,  Y10T29/49165

    Abstract: A via structure includes a ground conductor, a floated conductor and a signal conductor. The ground conductor is electrically coupled to a reference potential. The floated conductor is electrically insulated from the ground conductor. The signal conductor is located between and insulated from the ground conductor and the floated conductor.

    Abstract translation: 通孔结构包括接地导体，浮动导体和信号导体。 接地导体电耦合到参考电位。 浮动导体与接地导体电绝缘。 信号导体位于接地导体和浮动导体之间并与之绝缘。

    Printed wiring board and method for manufacturing printed wiring board
    25.
    发明授权
    Printed wiring board and method for manufacturing printed wiring board 有权
    印刷电路板及制造印刷线路板的方法

    公开(公告)号：US09192045B2

    公开(公告)日：2015-11-17

    申请号：US14291048

    申请日：2014-05-30

    Applicant: IBIDEN CO., LTD.

    Inventor： Atsushi Osaki

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

    CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/4661 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

    Abstract: A printed wiring board includes an insulative substrate having a penetrating hole, a first conductive layer formed on a first surface of the insulative substrate, a second conductive layer formed on a second surface of the insulative substrate, and a through-hole conductor formed in the penetrating hole through the insulative substrate such that the through-hole conductor is connecting the first conductive layer and second conductive layer. The penetrating hole has a first opening portion formed on a first-surface side of the insulative substrate and a second opening portion formed on a second-surface side of the insulative substrate such that the second opening portion has a depth which is greater than a depth of the first opening portion and the second opening portion has a volume which is greater than a volume of the first opening portion, and the through-hole conductor formed in the second opening portion includes a void portion.

    Abstract translation: 印刷布线板包括具有贯通孔的绝缘基板，形成在绝缘基板的第一表面上的第一导电层，形成在绝缘基板的第二表面上的第二导电层，和形成在绝缘基板上的通孔导体 通孔穿过绝缘基板，使得通孔导体连接第一导电层和第二导电层。 所述贯通孔具有形成在所述绝缘基板的第一面侧的第一开口部和形成在所述绝缘基板的第二面侧的第二开口部，使得所述第二开口部的深度大于所述绝缘基板的深度 第一开口部分和第二开口部分的体积大于第一开口部分的体积，并且形成在第二开口部分中的通孔导体包括空隙部分。

    Conductive connection structure for conductive wiring layer of flexible circuit board
    27.
    发明授权
    Conductive connection structure for conductive wiring layer of flexible circuit board 有权
    柔性电路板导电布线层导电连接结构

    公开(公告)号：US09155208B2

    公开(公告)日：2015-10-06

    申请号：US14138383

    申请日：2013-12-23

    Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

    Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

    CPC classification number: H05K3/4061 ,  H05K1/0283 ,  H05K1/115 ,  H05K1/118 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1572

    Abstract: A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.

    Abstract translation: 用于柔性电路板的导电布线层的导电连接结构包括形成在包括导电布线层，第一覆盖层和第二覆盖层的叠层结构中的第一通孔和第二通孔。 第一通孔延伸穿过第一覆盖层和导电布线层。 第二通孔延伸穿过第二覆盖层。 第二通孔形成在与导电布线层的第二表面上的暴露区相对应的位置处，并与第一通孔连通。 第一导电浆料层形成在第一覆盖层的表面上并填充在第一通孔中，以在第一通孔中形成柱部分。 柱部具有形成弯曲帽的底端。 导电布线层的第二表面的暴露区域至少部分被弯曲的盖子覆盖。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    28.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20150237728A1

    公开(公告)日：2015-08-20

    申请号：US14621998

    申请日：2015-02-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Chung Sik PARK ,  Jae Hwa KIM ,  Heun Gun SHIN

    IPC: H05K1/11 ,  H05K3/00

    CPC classification number: H05K1/113 ,  H05K1/0206 ,  H05K3/0044 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/09854 ,  Y10T29/49155

    Abstract: A printed circuit board according to the embodiment includes an insulating layer; a first pad on a top surface of the insulating layer; a second pad on a bottom surface of the insulating layer; and a via formed in the insulating layer and having one surface connected to the first pad and an opposite surface connected to the second pad, wherein the via includes a plurality of via parts which are at least partially overlapped with each other.

    Abstract translation: 根据实施例的印刷电路板包括绝缘层; 绝缘层的顶表面上的第一焊盘; 在所述绝缘层的底表面上的第二焊盘; 以及形成在所述绝缘层中并且具有连接到所述第一焊盘的一个表面和连接到所述第二焊盘的相对表面的通孔，其中所述通孔包括彼此至少部分重叠的多个通孔部分。

    Substrate with built-in component
    29.
    发明授权
    Substrate with built-in component 有权
    基板与内置组件

    公开(公告)号：US09101075B2

    公开(公告)日：2015-08-04

    申请号：US14101026

    申请日：2013-12-09

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Masaki Naganuma ,  Kazuaki Ida ,  Tatsuro Sawatari ,  Hiroshi Nakamura

    IPC: H05K1/18

    CPC classification number: H05K1/186 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/15151 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/09063 ,  H05K2201/09427 ,  H05K2201/09854 ,  H01L2924/00

    Abstract: There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction.

    Abstract translation: 提供了具有内置部件的基板，包括具有用于存储部件的空腔的金属芯层; 层叠在所述芯层上并具有多个用于层间连接的通孔的布线层，所述通孔形成在与所述空腔相对的区域处; 以及电子部件，包括电连接到所述多个通孔的多个端子，以及存储在所述空腔中并具有用于支撑所述多个端子的支撑表面的部件主体，所述多个端子偏离所述多个端子的中心 所述支撑表面朝向第一方向，并且所述部件主体从所述腔的中心偏心地设置到与所述第一方向相反的第二方向。

    Method of embedding magnetic component in substrate
    30.
    发明授权
    Method of embedding magnetic component in substrate 有权
    将磁性成分嵌入衬底的方法

    公开(公告)号：US09101072B2

    公开(公告)日：2015-08-04

    申请号：US13477919

    申请日：2012-05-22

    Applicant: Bo-Shiung Huang ,  Han-Ching Shih ,  Tzu-Yuan Fan ,  Wei-Hsiung Yang ,  Kai-Hsiang Chen

    Inventor： Bo-Shiung Huang ,  Han-Ching Shih ,  Tzu-Yuan Fan ,  Wei-Hsiung Yang ,  Kai-Hsiang Chen

    IPC: B23P11/00 ,  H05K1/16 ,  H01F41/02 ,  H01F41/14

    CPC classification number: H05K1/165 ,  H01F41/0253 ,  H01F41/14 ,  H05K2201/086 ,  H05K2201/09854 ,  Y10T29/4902 ,  Y10T29/49075 ,  Y10T29/49826 ,  Y10T29/49833

    Abstract: A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.

    Abstract translation: 公开了一种在基板中嵌入磁性部件的方法。 通过机械钻孔在基板中形成孔。 每个孔包括顶部开口，底部和侧壁，其中顶部开口的区域大于底部开口的面积。 侧壁从顶部开口垂直向下延伸到预定深度，然后向内倾斜到底部，以在孔的底部形成倾斜的侧壁。 沿着顶部开口的边缘的一部分限定预定区域，并且通过布线移除在该预定区域下方的基底材料的一部分，以形成部分容纳沟槽，其中倾斜侧壁的一部分位于底部。 然后，将磁性部件放置在部件容纳沟槽中。

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